JPH0472367A - Electrically conductive composition - Google Patents
Electrically conductive compositionInfo
- Publication number
- JPH0472367A JPH0472367A JP20813690A JP20813690A JPH0472367A JP H0472367 A JPH0472367 A JP H0472367A JP 20813690 A JP20813690 A JP 20813690A JP 20813690 A JP20813690 A JP 20813690A JP H0472367 A JPH0472367 A JP H0472367A
- Authority
- JP
- Japan
- Prior art keywords
- conductive composition
- copper powder
- parts
- diamine
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 150000004985 diamines Chemical class 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 11
- 125000002252 acyl group Chemical group 0.000 claims abstract description 5
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 5
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 9
- 239000002245 particle Substances 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 3
- LERPQJNGDVCXSI-UHFFFAOYSA-N 2-[decanoyl(methyl)amino]acetic acid Chemical compound CCCCCCCCCC(=O)N(C)CC(O)=O LERPQJNGDVCXSI-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 235000004279 alanine Nutrition 0.000 abstract 1
- 239000005007 epoxy-phenolic resin Substances 0.000 abstract 1
- LDRRLMSXOCEKCW-UHFFFAOYSA-N n-(1-aminopropan-2-yl)dodecanamide Chemical compound CCCCCCCCCCCC(=O)NC(C)CN LDRRLMSXOCEKCW-UHFFFAOYSA-N 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- FSYKKLYZXJSNPZ-UHFFFAOYSA-N N-methylaminoacetic acid Natural products C[NH2+]CC([O-])=O FSYKKLYZXJSNPZ-UHFFFAOYSA-N 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- -1 aliphatic amines Chemical class 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- 150000004665 fatty acids Chemical class 0.000 description 6
- BACYUWVYYTXETD-UHFFFAOYSA-N N-Lauroylsarcosine Chemical compound CCCCCCCCCCCC(=O)N(C)CC(O)=O BACYUWVYYTXETD-UHFFFAOYSA-N 0.000 description 5
- 108010077895 Sarcosine Proteins 0.000 description 5
- 229940043230 sarcosine Drugs 0.000 description 5
- 108700004121 sarkosyl Proteins 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 239000003240 coconut oil Substances 0.000 description 2
- 235000019864 coconut oil Nutrition 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- BBOPKBHSDDSVFS-UHFFFAOYSA-N 1-chloro-4-ethoxy-2-fluorobenzene Chemical compound CCOC1=CC=C(Cl)C(F)=C1 BBOPKBHSDDSVFS-UHFFFAOYSA-N 0.000 description 1
- NGOZDSMNMIRDFP-UHFFFAOYSA-N 2-[methyl(tetradecanoyl)amino]acetic acid Chemical compound CCCCCCCCCCCCCC(=O)N(C)CC(O)=O NGOZDSMNMIRDFP-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- UNWFFCPRJXMCNV-UHFFFAOYSA-N 3-[dodecanoyl(methyl)amino]propanoic acid Chemical compound CCCCCCCCCCCC(=O)N(C)CCC(O)=O UNWFFCPRJXMCNV-UHFFFAOYSA-N 0.000 description 1
- GMHCJCQMNYOULB-UHFFFAOYSA-N 3-[methyl(octadecanoyl)amino]propanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(=O)N(C)CCC(O)=O GMHCJCQMNYOULB-UHFFFAOYSA-N 0.000 description 1
- DCVMAYAWOPBYKB-UHFFFAOYSA-N 3-[methyl(tetradecanoyl)amino]propanoic acid Chemical compound CCCCCCCCCCCCCC(=O)N(C)CCC(O)=O DCVMAYAWOPBYKB-UHFFFAOYSA-N 0.000 description 1
- ZRNBEAAEJJLWTJ-KHPPLWFESA-N 3-[methyl-[(z)-octadec-9-enoyl]amino]propanoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)N(C)CCC(O)=O ZRNBEAAEJJLWTJ-KHPPLWFESA-N 0.000 description 1
- XBTWVJKPQPQTDW-UHFFFAOYSA-N 4-n,4-n-diethyl-2-methylbenzene-1,4-diamine Chemical compound CCN(CC)C1=CC=C(N)C(C)=C1 XBTWVJKPQPQTDW-UHFFFAOYSA-N 0.000 description 1
- QNGVNLMMEQUVQK-UHFFFAOYSA-N 4-n,4-n-diethylbenzene-1,4-diamine Chemical compound CCN(CC)C1=CC=C(N)C=C1 QNGVNLMMEQUVQK-UHFFFAOYSA-N 0.000 description 1
- OMLYQIDMEQAGRI-UHFFFAOYSA-N CCCCCC(=O)N(C)CCC(O)=O Chemical compound CCCCCC(=O)N(C)CCC(O)=O OMLYQIDMEQAGRI-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BZORFPDSXLZWJF-UHFFFAOYSA-N N,N-dimethyl-1,4-phenylenediamine Chemical compound CN(C)C1=CC=C(N)C=C1 BZORFPDSXLZWJF-UHFFFAOYSA-N 0.000 description 1
- VDIPNVCWMXZNFY-UHFFFAOYSA-N N-methyl-beta-alanine Chemical compound CNCCC(O)=O VDIPNVCWMXZNFY-UHFFFAOYSA-N 0.000 description 1
- DIOYAVUHUXAUPX-KHPPLWFESA-N Oleoyl sarcosine Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)N(C)CC(O)=O DIOYAVUHUXAUPX-KHPPLWFESA-N 0.000 description 1
- 241000269851 Sarda sarda Species 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000004986 phenylenediamines Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、導電性組成物に関し、更に詳細には、導電性
、耐湿性及び耐熱性等に優れ、印刷回路用等に極めて有
用な導電性組成物に関する。Detailed Description of the Invention <Industrial Application Field> The present invention relates to a conductive composition, and more particularly, the present invention relates to a conductive composition that has excellent conductivity, moisture resistance, heat resistance, etc., and is extremely useful for printed circuits. The present invention relates to sexual compositions.
〈従来の技術〉
従来から電子部品分野において、印刷回路用導電性組成
物としては、金及び銀等の貴金属を主成分とする導電性
組成物が広く用いられている。特に銀は、最も体積固有
抵抗の低い金属であること、酸化した際も導電性を有し
ていること及び貴金属の中でも比較的廉価であることか
ら多用されている。<Prior Art> Conventionally, in the field of electronic components, conductive compositions containing noble metals such as gold and silver as main components have been widely used as conductive compositions for printed circuits. In particular, silver is frequently used because it is a metal with the lowest volume resistivity, has electrical conductivity even when oxidized, and is relatively inexpensive among noble metals.
しかしながら、銀を主成分とする導電性組成物により印
刷回路を形成する場合、例えば回路の線間隔が狭く、し
かも電位差が大きい場合には、銀の移行現象(マイグレ
ーション)が生し、回路の抵抗増大、更には回路の短絡
が生じるという欠点がある。また近年、電子部品業界に
おいては、コスト低減が重要視されており、比較的廉価
な銀でさヘコスト的に問題がある。However, when a printed circuit is formed using a conductive composition containing silver as a main component, for example, when the line spacing of the circuit is narrow and the potential difference is large, a migration phenomenon of silver occurs and the resistance of the circuit increases. The disadvantage is that an increase in the voltage and even a short circuit can occur. Furthermore, in recent years, cost reduction has been emphasized in the electronic parts industry, and relatively inexpensive silver has been problematic in terms of cost.
そこで最近、銀に次いで体積固有抵抗が低く。Recently, silver has the lowest volume resistivity after silver.
しかも銀よりも廉価な銅を主成分とする導電性組成物の
開発が種々検討されている。しかし、該導電性組成物中
の銅粉末は、大きな被醸化性を有しているため、導電性
組成物の貯蔵時、印刷及び加熱等の回路形成時、更には
、形成された回路の使用時において、銅粉末の表面が酸
化され、銅粉末粒子間の接触抵抗が増大し、十分な導電
性を得ることができないという欠点がある。従って、こ
のような銅粉末が有する欠点を解決するために、種々の
添加剤を、銅を主成分とする導電性組成物中に添加する
ことが提案されている。該添加剤としては例えば、特公
昭52−24936号公報には、亜燐酸又はその誘導体
が、特公昭61−36796号公報には、アントラセン
又はその誘導体が、特開昭57−55974号公報には
、ヒドロキノン類の誘導体が提案されている。しかし、
前記添加剤を添加した導電性組成物により得られる塗膜
の比抵抗値は、10−3Ω・α程度と十分でないのが現
状である。また特開昭61−211378号公報には不
飽和脂肪酸を、特公昭61−14175号公報には脂肪
酸アミドを、特開昭61−200179号公報には高級
脂肪族アミンを、特開昭58−225168号公報には
フェニレンジアミン誘導体を添加剤として用いた導電性
組成物が提案されている。該導電性組成物により得られ
る塗膜の比抵抗値は、10−’Ω・α程度と改善はされ
ているものの、塗膜を高湿度下に放置すると抵抗値が急
激に増大し、しかも長期安定性が望めないという欠点が
ある。Moreover, various studies have been made to develop conductive compositions containing copper as a main component, which is cheaper than silver. However, since the copper powder in the conductive composition has a large oxidation property, it is difficult to use when storing the conductive composition, when forming circuits such as printing and heating, and even when forming circuits. During use, the surface of the copper powder is oxidized, the contact resistance between the copper powder particles increases, and there is a drawback that sufficient conductivity cannot be obtained. Therefore, in order to solve the drawbacks of copper powder, it has been proposed to add various additives to conductive compositions containing copper as a main component. Examples of such additives include phosphorous acid or its derivatives in Japanese Patent Publication No. 52-24936, anthracene or its derivatives in Japanese Patent Publication No. 61-36796, and Japanese Patent Publication No. 57-55974 , derivatives of hydroquinones have been proposed. but,
At present, the specific resistance value of a coating film obtained from a conductive composition containing the above-mentioned additives is about 10<-3 >[Omega].alpha., which is not sufficient. Furthermore, JP-A-61-211378 discloses unsaturated fatty acids, JP-A-61-14175 discloses fatty acid amides, JP-A-61-200179 discloses higher aliphatic amines, and JP-A-61-200179 discloses higher aliphatic amines. No. 225168 proposes a conductive composition using a phenylenediamine derivative as an additive. Although the specific resistance value of the coating film obtained with the conductive composition has been improved to about 10-'Ω・α, the resistance value increases rapidly when the coating film is left under high humidity, and furthermore, the resistance value increases over a long period of time. The drawback is that stability cannot be expected.
〈発明が解決しようとする課題〉
従って本発明の主要な目的は、導電性、耐熱性、耐湿性
、堅牢性等に優れ、且つ印刷回路等を形成することが可
能な導電性組成物を提供することにある。<Problems to be Solved by the Invention> Therefore, the main object of the present invention is to provide a conductive composition that has excellent conductivity, heat resistance, moisture resistance, robustness, etc., and is capable of forming printed circuits, etc. It's about doing.
く課題を解決するための手段〉
本発明によれば、(a)銅粉末、(b)熱硬化性樹脂及
び(c)下記一般式(I)
(式中R1Co−は、炭素数1〜22のアシル基を示し
、R2は水素原子又は炭素数1〜22のアルキル基若し
くはアルケニル基を示す。またnは1〜10の整数を示
す)で表わされる化合物、また必要に応じて(d)ジア
ミンを含有してなる導電性組成物が提供される。Means for Solving the Problems> According to the present invention, (a) copper powder, (b) thermosetting resin, and (c) the following general formula (I) (wherein R1Co- is a carbon number of 1 to 22 represents an acyl group, R2 represents a hydrogen atom or an alkyl group or alkenyl group having 1 to 22 carbon atoms, and n represents an integer of 1 to 10), and optionally (d) diamine. Provided is a conductive composition containing the following.
以下本発明を更に詳細に説明する。The present invention will be explained in more detail below.
本発明の導電性組成物シコ用いる(、)銅粉末は、特に
限定されるものではないが、例えば電解銅粉、酸化第一
銅、酸化第二銅等を還元した還元銅粉、アトマイズ銅粉
、金属銅粉砕物等を好ましく挙げることができる。該銅
粉末の粒径は、0.5〜100μ、特に0.5〜30μ
の範囲であるのが好ましい。粒径が100μを超える場
合には、印刷性に問題が生じ、また0、5μ未満では、
銅粉末が酸化されやすく、得られる塗膜の導電性が低下
するので好ましくない。The copper powder used in the conductive composition of the present invention is not particularly limited, but includes, for example, electrolytic copper powder, reduced copper powder obtained by reducing cuprous oxide, cupric oxide, etc., and atomized copper powder. , pulverized metal copper, etc. can be preferably mentioned. The particle size of the copper powder is 0.5 to 100μ, particularly 0.5 to 30μ.
It is preferable that it is in the range of . If the particle size exceeds 100μ, problems will occur in printability, and if the particle size is less than 0.5μ,
This is not preferred because the copper powder is easily oxidized and the conductivity of the resulting coating film is reduced.
本発明の導電性組成物に用いる(b)熱硬化性樹脂とし
ては、例えばエポキシ樹脂、尿素樹脂、メラミン樹脂、
フェノール樹脂、不飽和ポリエステル樹脂、アルキッド
樹脂、ジアリルフタレート等のアリル樹脂、熱硬化性ウ
レタン樹脂、ポリイミド樹脂等を好ましく挙げることが
できる。Examples of the thermosetting resin (b) used in the conductive composition of the present invention include epoxy resin, urea resin, melamine resin,
Preferred examples include phenol resins, unsaturated polyester resins, alkyd resins, allyl resins such as diallyl phthalate, thermosetting urethane resins, and polyimide resins.
本発明において、前記(a)銅粉末と、(b)熱硬化性
樹脂との配合割合は、好ましくは(a)銅粉末65〜9
Sfi量%、特に好ましくは75〜90重量%、即ち(
b)熱硬化性樹脂5〜35重量%、特に好ましくは10
〜25重量%であるのが望ましい。前記(a)銅粉末の
配合割合が65重量%未満では、導電回路として要求さ
れる比抵抗が得られず、また95重量%を超える場合に
は、印刷性等のペーストとした際の物性が低下するので
好ましくない。In the present invention, the blending ratio of the (a) copper powder and (b) thermosetting resin is preferably 65 to 9.
% Sfi, particularly preferably 75-90% by weight, i.e. (
b) 5 to 35% by weight of thermosetting resin, particularly preferably 10
Preferably it is 25% by weight. If the blending ratio of the copper powder (a) is less than 65% by weight, the specific resistance required for a conductive circuit cannot be obtained, and if it exceeds 95% by weight, the physical properties of the paste, such as printability, may deteriorate. This is not preferable because it lowers the temperature.
本発明の導電性組成物に用いる(c)化合物は、下記一
般式(1)で表わすことができ。The compound (c) used in the conductive composition of the present invention can be represented by the following general formula (1).
式中R,CO−は、炭素数1〜22のアシル基をボし、
R2は水素原子又は炭素数1〜22のアルキル基若しく
はアルケニル基を示す。またnは1〜10の整数を示す
。R,C〇−が、炭素数22を超えるアシル基、R2が
炭素数22を超えるアルキル基又はアルケニル基若しく
はnが10を超える場合には、何れも製造が困難である
。前記−般式(1)で表わされる(c)化合物としては
、具体的には例えば、カプロイルサルコシン、ラウロイ
ルサルコシン、ミリストイルサルコシン、バルミトイル
サルコシン、ステアロイルサルコシン、オレオイルサル
コシン、ベヘノイルサルコシン等の高級脂肪酸から変成
されるN−アシルサルコシン、またはヤシ油脂肪酸サル
コシン、トール油脂肪酸サルコシン等の混合脂肪酸サル
コシン、N−ラウロイル−N−メチル−β−アラニン、
N−オレオイル−N−メチル−β−アラニン、N−ココ
イル−N−メチル−β−アラニン、N−カプロイル−N
−メチル−β−アラニン、N−ミリストイル−N−メチ
ル−β−アラニン、N−バルミトイル−N−メチル−β
−アラニン、N−ステアロイル−N−メチル−β−アラ
ニン、N−ベヘンイル−N−メチル−β−アラニン等を
好ましく挙げることができる。該化合物の配合量は、前
記銅粉末と、熱硬化性樹脂との合計量100重量部に対
して、好ましくは0.5〜10重量部、特に好ましくは
1.5〜7.5重量部であるのが好ましい。In the formula, R, CO- represents an acyl group having 1 to 22 carbon atoms,
R2 represents a hydrogen atom or an alkyl group or alkenyl group having 1 to 22 carbon atoms. Moreover, n represents an integer of 1 to 10. When R and C〇- are an acyl group having more than 22 carbon atoms, when R2 is an alkyl group or alkenyl group having more than 22 carbon atoms, or when n is more than 10, it is difficult to manufacture any of them. Specific examples of the compound (c) represented by the general formula (1) include caproylsarcosine, lauroylsarcosine, myristoylsarcosine, balmitoylsarcosine, stearoylsarcosine, oleoylsarcosine, behenoylsarcosine, etc. N-acyl sarcosine modified from higher fatty acids, or mixed fatty acid sarcosine such as coconut oil fatty acid sarcosine, tall oil fatty acid sarcosine, N-lauroyl-N-methyl-β-alanine,
N-oleoyl-N-methyl-β-alanine, N-cocoyl-N-methyl-β-alanine, N-caproyl-N
-Methyl-β-alanine, N-myristoyl-N-methyl-β-alanine, N-valmitoyl-N-methyl-β
Preferred examples include -alanine, N-stearoyl-N-methyl-β-alanine, and N-behenyl-N-methyl-β-alanine. The compounding amount of the compound is preferably 0.5 to 10 parts by weight, particularly preferably 1.5 to 7.5 parts by weight, based on 100 parts by weight of the total amount of the copper powder and thermosetting resin. It is preferable to have one.
前記配合量が、0.5重量部未満では添加による種々の
効果が得られず、また10重量部を超えると、導電性組
成物としての物性に悪影響を及ぼすので好ましくない。If the amount is less than 0.5 parts by weight, various effects cannot be obtained by addition, and if it exceeds 10 parts by weight, it will have an adverse effect on the physical properties of the conductive composition, which is not preferable.
本発明の導電性組成物において、必要に応じて含有させ
ることができる(d)ジアミンは、更に導電性、耐熱性
及び耐湿性を向上させる成分であって、例えば脂肪族ジ
アミン、芳香族ジアミン等を挙げることができ、具体的
には脂肪族ジアミンとして、ラウロイルプロピレンジア
ミン、バルミトイルプロピレンジアミン、ステアリルプ
ロピレンジアミン、オレイルプロピレンジアミン等を、
また芳香族ジアミンとして、0−フェニレンジアミン、
m−フェニレンジアミン、P−フェニレンジアミン、4
−(4−スルホベンジル)アミノアニリン、4−ジメチ
ルアミノアニリン、4−ジエチルアミノアニリン、2−
アミノ−5−ジエチルアミノトルエン、4− [N−(
β−ヒドロキシエチル)アミノコアニリン、4− [N
、N−ジー(β−ヒドロキシエチル)アミノコアニリン
等を挙げることができる。該(d)ジアミンを含有させ
る場合の配合量は、前記(c)一般式(1)で表わされ
る化合物100重量部に対して、好ましくは100〜1
000重量部、特に好ましくは500〜1000重量部
の範囲である。ジアミンの配合量が100重量部未満の
場合には、ジアミンを添加することによる所望の効果が
得られず、また1000重量部超えると耐熱性、耐湿性
が低下するので好ましくない。In the conductive composition of the present invention, (d) diamine, which can be contained as necessary, is a component that further improves conductivity, heat resistance, and moisture resistance, such as aliphatic diamine, aromatic diamine, etc. Examples of aliphatic diamines include lauroylpropylene diamine, balmitoylpropylene diamine, stearylpropylene diamine, oleylpropylene diamine, etc.
In addition, aromatic diamines include 0-phenylenediamine,
m-phenylenediamine, p-phenylenediamine, 4
-(4-sulfobenzyl)aminoaniline, 4-dimethylaminoaniline, 4-diethylaminoaniline, 2-
Amino-5-diethylaminotoluene, 4-[N-(
β-hydroxyethyl)aminocoaniline, 4-[N
, N-di(β-hydroxyethyl)aminocoaniline, and the like. The amount of the diamine (d) to be incorporated is preferably 100 to 1 part by weight per 100 parts by weight of the compound represented by the general formula (1) (c).
000 parts by weight, particularly preferably from 500 to 1000 parts by weight. If the amount of diamine added is less than 100 parts by weight, the desired effect cannot be obtained by adding the diamine, and if it exceeds 1000 parts by weight, heat resistance and moisture resistance will decrease, which is not preferable.
本発明の導電性組成物を調製するには1例えば前記(a
)銅粉末、(b)熱硬化性樹脂及び前記(c)一般式(
1)で表わされる化合物を、また必要に応じて(d)ジ
アミンを混合し、混練することにより得ることができる
。また前記組成物を調製する際に、必要に応じて、ブチ
ルカルピトール等の粘度調整剤、消泡剤、増粘剤、皮は
り防止剤等を添加することも可能である。To prepare the conductive composition of the present invention, 1, for example, the above (a)
) copper powder, (b) thermosetting resin and the above (c) general formula (
The compound represented by 1) can be obtained by mixing and kneading (d) diamine if necessary. Further, when preparing the composition, it is also possible to add a viscosity modifier such as butylcarpitol, an antifoaming agent, a thickener, an anti-scaling agent, etc., if necessary.
〈発明の効果〉
本発明の導電性組成物は、銅及び熱硬化性樹脂を主成分
とするので、従来の銀又は金を主成分とする導電性組成
物に比してコスト的に安価であり、しかも前記一般式(
I)で表される化合物、更には必要に応じてジアミンを
含有するため、高温、高湿度の苛酷な環境下においても
、優れた導電性を安定的に得ることができる。従って、
例えば本発明の導電性組成物を絶縁基盤上に焼付は硬化
させることにより、導電性、耐熱性、耐湿性、はんだ付
性のいずれにも極めて優れた印刷回路等を製造すること
ができる。<Effects of the Invention> Since the conductive composition of the present invention has copper and a thermosetting resin as its main components, it is cheaper in cost than conventional conductive compositions whose main components are silver or gold. Yes, and the above general formula (
Since it contains the compound represented by I) and further a diamine if necessary, excellent conductivity can be stably obtained even under harsh environments of high temperature and high humidity. Therefore,
For example, by baking and curing the conductive composition of the present invention on an insulating substrate, it is possible to produce printed circuits and the like that are extremely excellent in conductivity, heat resistance, moisture resistance, and solderability.
〈実施例〉
以下本発明を実施例及び比較例により更に詳細に説明す
るが、本発明はこれらに限定されるものではない。<Examples> The present invention will be described in more detail below with reference to Examples and Comparative Examples, but the present invention is not limited thereto.
尚、例中の部は重量部を示す。In addition, parts in the examples indicate parts by weight.
夫育叢よ
平均粒径8μのアトマイズ銅粉末85部を、フェノール
樹脂(商品名rBLS−364HJ昭和高分子株式会社
製、不揮発分65%)15部、ラウロイルサルコシン2
.5部及びブチルカルピトール5部と共に充分混合分散
させた。次いで得られた組成物を、250メツシユのテ
トロンスクリ−ンを用いて、ガラス−エポキシ基板上に
、輻21、長さ368mの抵抗値測定用パターンを印刷
した後、160℃に保持した恒温槽中で30分間加熱し
、焼付は硬化を行なった。得られた硬化試料について、
デジタルマルチメータにより初期抵抗値を測定し、また
印刷回路の膜厚を測定して初期比抵抗値を算出した。そ
の結果、初期抵抗値及び初期比抵抗値は夫々4.4Ω、
6.0X10−’Ω・口であった。また耐湿性を評価す
るために、60℃、95%RHの恒温恒湿槽に、前記硬
化試料を1000時間保持した後、同様に比抵抗値を算
出したところ、7.lX10−’Ω・1であった。85 parts of atomized copper powder with an average particle size of 8μ, 15 parts of phenol resin (trade name rBLS-364HJ manufactured by Showa Kobunshi Co., Ltd., non-volatile content 65%), 2 parts of lauroyl sarcosine
.. 5 parts and 5 parts of butylcarpitol were thoroughly mixed and dispersed. Next, the resulting composition was printed on a glass-epoxy substrate with a pattern for resistance value measurement with 21 lines and a length of 368 m using a 250-mesh Tetron screen, and then placed in a constant temperature bath maintained at 160°C. The film was heated for 30 minutes in a baking oven to harden the film. Regarding the obtained cured sample,
The initial resistance value was measured using a digital multimeter, and the film thickness of the printed circuit was also measured to calculate the initial specific resistance value. As a result, the initial resistance value and initial specific resistance value were 4.4Ω, respectively.
It was 6.0×10-'Ω・mouth. In addition, in order to evaluate moisture resistance, the cured sample was kept in a constant temperature and humidity chamber at 60° C. and 95% RH for 1000 hours, and then the specific resistance value was similarly calculated. It was lX10-'Ω·1.
また耐熱性を評価するために、85℃の恒温槽中に前記
硬化試料を1000時間保持した後、同様に比抵抗値を
算出したところ6.6XIO−’Ω・lであった。更に
また、はんだ耐熱性を評価するために、前記硬化試料を
260’Cのはんだ浴槽に10秒浸漬した後、同様に比
抵抗値を算出したところ8.0X10−’Ω・lであっ
た。(C)化合物の種類、初期比抵抗値、耐湿・耐熱及
びはんだ耐熱試験後の比抵抗値を表1に示す。Further, in order to evaluate heat resistance, the cured sample was kept in a constant temperature bath at 85° C. for 1000 hours, and then the specific resistance value was similarly calculated and found to be 6.6XIO-'Ω·l. Furthermore, in order to evaluate the soldering heat resistance, the cured sample was immersed in a solder bath at 260'C for 10 seconds, and the specific resistance value was similarly calculated to be 8.0x10'Ω·l. Table 1 shows the type of compound (C), the initial resistivity value, and the resistivity value after moisture resistance, heat resistance, and soldering heat resistance tests.
実施例2〜8、比較 1〜4
ラウロイルサルコシンの代わりに、表1に示す化合物2
.5部を用いた以外は、実施例1と同様に組成物を調製
し、各測定を行なった。その結果を表1に示す。Examples 2-8, Comparisons 1-4 Compound 2 shown in Table 1 instead of lauroylsarcosine
.. A composition was prepared in the same manner as in Example 1, except that 5 parts were used, and each measurement was performed. The results are shown in Table 1.
失に何旦
ラウロイルサルコシンの代わりに、ヤシ油脂肪酸サルコ
シン100部に、オレイルプロピレンジアミン700部
を混合した混合物2.5部を用いた以外は、実施例1と
同様に組成物を調製し、各測定を行なった。その結果を
表1に示す。A composition was prepared in the same manner as in Example 1, except that 2.5 parts of a mixture of 100 parts of coconut oil fatty acid sarcosine and 700 parts of oleylpropylene diamine was used instead of lauroyl sarcosine. Measurements were made. The results are shown in Table 1.
失に鰹↓立
ラウロイルサルコシンの代わりに、N−ラウロイル−N
−メチル−β−アラニン100部に、P−フ二二レンジ
アミン800部を混合した混合物2.5部を用いた以外
は、実施例1と同様に組成物を調製し、各測定を行なっ
た。その結果を表1に示す。Lost bonito ↓ Instead of standing lauroyl sarcosine, N-lauroyl-N
-A composition was prepared in the same manner as in Example 1, except that 2.5 parts of a mixture of 100 parts of methyl-β-alanine and 800 parts of P-phinyl diamine was used, and each measurement was performed. . The results are shown in Table 1.
Claims (1)
記一般式( I ) ▲数式、化学式、表等があります▼ (I) (式中R_1CO−は、炭素数1〜22のアシル基を示
し、R_2は水素原子又は炭素数1〜22のアルキル基
若しくはアルケニル基を示す。またnは1〜10の整数
を示す)で表わされる化合物を含有してなる導電性組成
物。 2) 更に(d)ジアミンを含有して成る請求項1記載
の導電性組成物。[Claims] 1) (a) copper powder, (b) thermosetting resin, and (c) the following general formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (I) (In the formula, R_1CO- is , represents an acyl group having 1 to 22 carbon atoms, R_2 represents a hydrogen atom or an alkyl group or alkenyl group having 1 to 22 carbon atoms, and n represents an integer of 1 to 10). A conductive composition. 2) The conductive composition according to claim 1, further comprising (d) a diamine.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1-204703 | 1989-08-09 | ||
JP20470389 | 1989-08-09 | ||
JP2-140034 | 1990-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0472367A true JPH0472367A (en) | 1992-03-06 |
Family
ID=16494916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20813690A Pending JPH0472367A (en) | 1989-08-09 | 1990-08-08 | Electrically conductive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0472367A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1184881A2 (en) * | 2000-08-29 | 2002-03-06 | Shoei Chemical Inc. | Conductive paste |
JP2006063441A (en) * | 2004-07-30 | 2006-03-09 | Jfe Mineral Co Ltd | Ultrafine metal powder slurry |
WO2019220667A1 (en) * | 2017-05-23 | 2019-11-21 | 住友金属鉱山株式会社 | Electroconductive paste, electronic component, and laminated ceramic capacitor |
-
1990
- 1990-08-08 JP JP20813690A patent/JPH0472367A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1184881A2 (en) * | 2000-08-29 | 2002-03-06 | Shoei Chemical Inc. | Conductive paste |
EP1184881A3 (en) * | 2000-08-29 | 2003-09-17 | Shoei Chemical Inc. | Conductive paste |
JP2006063441A (en) * | 2004-07-30 | 2006-03-09 | Jfe Mineral Co Ltd | Ultrafine metal powder slurry |
WO2019220667A1 (en) * | 2017-05-23 | 2019-11-21 | 住友金属鉱山株式会社 | Electroconductive paste, electronic component, and laminated ceramic capacitor |
CN112106149A (en) * | 2017-05-23 | 2020-12-18 | 住友金属矿山株式会社 | Conductive paste, electronic component, and multilayer ceramic capacitor |
CN112106149B (en) * | 2017-05-23 | 2022-09-27 | 住友金属矿山株式会社 | Conductive paste, electronic component, and multilayer ceramic capacitor |
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