JPS6357677A - Conductive printing ink composition - Google Patents
Conductive printing ink compositionInfo
- Publication number
- JPS6357677A JPS6357677A JP61202559A JP20255986A JPS6357677A JP S6357677 A JPS6357677 A JP S6357677A JP 61202559 A JP61202559 A JP 61202559A JP 20255986 A JP20255986 A JP 20255986A JP S6357677 A JPS6357677 A JP S6357677A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- component
- printing ink
- conductive
- polyester resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 29
- 238000007639 printing Methods 0.000 title claims description 18
- 239000002253 acid Substances 0.000 claims abstract description 32
- 229920001225 polyester resin Polymers 0.000 claims abstract description 16
- 239000004645 polyester resin Substances 0.000 claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 16
- 125000003118 aryl group Chemical group 0.000 claims abstract description 11
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract description 29
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 abstract description 9
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 239000000049 pigment Substances 0.000 abstract description 2
- 238000012643 polycondensation polymerization Methods 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 239000000976 ink Substances 0.000 description 16
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 12
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 6
- 229920006267 polyester film Polymers 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- 150000001298 alcohols Chemical class 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- ALOUNLDAKADEEB-UHFFFAOYSA-N dimethyl sebacate Chemical compound COC(=O)CCCCCCCCC(=O)OC ALOUNLDAKADEEB-UHFFFAOYSA-N 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- WBJWXIQDBDZMAW-UHFFFAOYSA-N 2-hydroxynaphthalene-1-carbonyl chloride Chemical compound C1=CC=CC2=C(C(Cl)=O)C(O)=CC=C21 WBJWXIQDBDZMAW-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BKFXSOCDAQACQM-UHFFFAOYSA-N 3-chlorophthalic acid Chemical compound OC(=O)C1=CC=CC(Cl)=C1C(O)=O BKFXSOCDAQACQM-UHFFFAOYSA-N 0.000 description 1
- KFIRODWJCYBBHY-UHFFFAOYSA-N 3-nitrophthalic acid Chemical compound OC(=O)C1=CC=CC([N+]([O-])=O)=C1C(O)=O KFIRODWJCYBBHY-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PYHXGXCGESYPCW-UHFFFAOYSA-N alpha-phenylbenzeneacetic acid Natural products C=1C=CC=CC=1C(C(=O)O)C1=CC=CC=C1 PYHXGXCGESYPCW-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- VSGNNIFQASZAOI-UHFFFAOYSA-L calcium acetate Chemical compound [Ca+2].CC([O-])=O.CC([O-])=O VSGNNIFQASZAOI-UHFFFAOYSA-L 0.000 description 1
- 239000001639 calcium acetate Substances 0.000 description 1
- 235000011092 calcium acetate Nutrition 0.000 description 1
- 229960005147 calcium acetate Drugs 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229940014772 dimethyl sebacate Drugs 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Paints Or Removers (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は導電性印刷インキ組成物に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to conductive printing ink compositions.
本発明は導電性印刷インキ組成物において、この組成物
が、導電性粉末及び、芳香族二塩基酸と炭素数４以上の
脂肪族二塩基酸とからなる酸成分を用いたポリエステル
樹脂をそれぞれ含むようにすることにより、
フレキシブルプリント回路基板に回路を作成する上で求
められる導電性、密着性といった種々の特性において優
れた性能を有することができるようにしたものである。The present invention provides a conductive printing ink composition, each of which contains a conductive powder and a polyester resin using an acid component consisting of an aromatic dibasic acid and an aliphatic dibasic acid having 4 or more carbon atoms. By doing so, it is possible to have excellent performance in various properties such as conductivity and adhesion required when creating a circuit on a flexible printed circuit board.
近年、半導体素子の高密度化と共に電子機器の小型、軽
量、薄型化が進展し、フレキシブルプリント回路基板（
以下、ＦＰＣ基板という）が空間を有効に利用しうろこ
とから注目されている。このＦＰＣ基板の基材として民
生用にポリエステルフィルムが使用され、産業用にポリ
イミドフィルムが使用されている。In recent years, along with the increasing density of semiconductor devices, electronic devices have become smaller, lighter, and thinner, and flexible printed circuit boards (
FPC boards (hereinafter referred to as FPC boards) are attracting attention because they make effective use of space. As the base material of this FPC board, polyester film is used for consumer use, and polyimide film is used for industrial use.
ところで、ＦＰＣ基板とりわけポリエステルフィルムを
基材とするＦＰＣ基板に回路を形成する方法として、導
電性印刷インキ組成物を用いて基材に回路をスクリーン
印刷する方法が主流となりつつある。By the way, as a method of forming a circuit on an FPC board, especially an FPC board using a polyester film as a base material, a method of screen printing a circuit on the base material using a conductive printing ink composition is becoming mainstream.
−ｉにポリエステルフィルムは難密着性素材であるため
、これに密着し得るインキ素材の種類には限りがあり、
材料選択に困難を極めているのが現状である。- Since polyester film is a material with poor adhesion, there are limits to the types of ink materials that can adhere to it.
At present, it is extremely difficult to select materials.
以前、ポリエステルフィルムに密着し得る導電性印刷イ
ンキ組成物として、芳香族二塩基酸と脂肪族二価アルコ
ールとから誘導される特定の線状ポリエステル樹脂を微
細な金属と混合した組成物が提案されている。（特開昭
６０−２５０５５号公幸旧 。Previously, a composition in which a specific linear polyester resin derived from an aromatic dibasic acid and an aliphatic dihydric alcohol was mixed with fine metal was proposed as a conductive printing ink composition capable of adhering closely to polyester films. ing. (Japanese Patent Publication No. 60-25055, formerly known as Koyuki.
しかし、このようにポリエステル樹脂の二塩基酸成分が
芳香族二塩基酸のみから成る導電性印刷インキ組成物は
、ＦＰＣ基板としてのポリ千ステルフィルムに印刷した
とき、密着性、可撓性及び折り曲げ性に劣り、この点で
回路の信鯨性低下につながる問題点を有していた。However, when a conductive printing ink composition in which the dibasic acid component of the polyester resin is only an aromatic dibasic acid is printed on a polyester film used as an FPC board, it has poor adhesion, flexibility, and bendability. In this respect, there was a problem that led to a decrease in the reliability of the circuit.
本発明者らは、上記問題点に鑑み、導電性並びにＦＰＣ
基板との密着性に優れていると共に、可撓性、折り曲げ
性に優れた導電性印刷インキを提供すべく鋭意検討した
結果、本発明に到達した。In view of the above problems, the present inventors have developed
The present invention was achieved as a result of extensive research aimed at providing a conductive printing ink that has excellent adhesion to substrates, as well as flexibility and bendability.
即ち、本発明によって提供される導電性印刷インキ組成
物（以下、本発明組成物という）は、導電性粉末及び、
芳香族二塩基酸６０〜９５モル％と炭素数４以上の脂肪
族二塩基酸４０〜５モル％から成る酸成分を用いたポリ
エステル樹脂をそれぞれ含むものである。That is, the conductive printing ink composition provided by the present invention (hereinafter referred to as the composition of the present invention) comprises conductive powder and
Each contains a polyester resin using an acid component consisting of 60 to 95 mol% of an aromatic dibasic acid and 40 to 5 mol% of an aliphatic dibasic acid having 4 or more carbon atoms.
本発明に用いられる導電性粉末としては、ニッケル、銀
、銅、鉄、金、白金、パラジウム等の純金属、又は、こ
れらの金属を基質とする合金の粉末、炭素粉末等の導電
性を有する粉末の１種又は２種以上が用いられる。なか
でもニッケル粉末及び／又は銀粉末を使用した場合に本
発明の効果が顕著に現われる。The conductive powder used in the present invention includes conductive powders such as pure metals such as nickel, silver, copper, iron, gold, platinum, and palladium, powders of alloys using these metals as substrates, and carbon powders. One or more types of powder may be used. Among these, the effects of the present invention are particularly noticeable when nickel powder and/or silver powder is used.
本発明組成物のポリエステル樹脂に用いられる芳香族二
塩基酸は例えば、フタル酸、イソフタル酸、テレフタル
酸、クロルフタル酸、ニトロフタル酸、ジフェニル酢酸
、ナフタリン−１，４−ジカルボン酸等の６０〜９５モ
ル％と、炭素数４以上の脂肪族二塩基酸、例えば、コハ
ク酸、グルタル酸、アジピン酸、セバシン酸、マレイン
酸、フマル酸等の４０〜５モル％との組み合わせから成
る二塩基酸であり、好ましい、芳香族二塩基酸はイソフ
タル酸及びテレフタル酸であり、好ましい脂肪族二塩基
酸はセバシン酸である。The aromatic dibasic acid used in the polyester resin of the composition of the present invention is, for example, 60 to 95 mol of phthalic acid, isophthalic acid, terephthalic acid, chlorophthalic acid, nitrophthalic acid, diphenylacetic acid, naphthalene-1,4-dicarboxylic acid, etc. % and 40 to 5 mol% of an aliphatic dibasic acid having 4 or more carbon atoms, such as succinic acid, glutaric acid, adipic acid, sebacic acid, maleic acid, fumaric acid, etc. The preferred aromatic dibasic acids are isophthalic acid and terephthalic acid, and the preferred aliphatic dibasic acid is sebacic acid.
また、アルコール成分としては、二価以上のアルコール
が用いられ、好ましくはエチレングリコール、ジエチレ
ングリコール、トリエチレングリコール、プロピレング
リコール、ジプロピレングリコール、ネオペンチルグリ
コール、１．３−ブチレンゲリコール、２．３−７’チ
レングリコール等の二価アルコールが用いられ、特に好
ましいアルコールとしてはエチレングリコール、ジエチ
レングリコール及びネオペンチルグリコールがあげられ
る。アルコール成分としては直鎖状アルコールと分枝状
アルコールの併用が好ましい。Further, as the alcohol component, an alcohol having a valence of two or more is used, and preferably ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, neopentyl glycol, 1.3-butylene gelicol, 2.3- Dihydric alcohols such as 7' ethylene glycol are used, and particularly preferred alcohols include ethylene glycol, diethylene glycol and neopentyl glycol. As the alcohol component, it is preferable to use a linear alcohol and a branched alcohol in combination.
二塩基酸中の芳香族二塩基酸成分が６０モル％未満であ
ると、塗膜の強度、導電性が低下する。If the aromatic dibasic acid component in the dibasic acid is less than 60 mol%, the strength and conductivity of the coating film will decrease.
また、脂肪族二塩基酸成分が５モル％未満であると、Ｆ
ＰＣ基板への密着性、可撓性、折り曲げ性が低下する。Further, when the aliphatic dibasic acid component is less than 5 mol%, F
Adhesion to the PC board, flexibility, and bendability are reduced.
二価アルコール成分中の直鎖状アルコール例えばエチレ
ングリコール、ジエチレングリコールと分枝状アルコー
ル例えばプロピレングリコール、ネオペンチルグリコー
ルとの比率は特に限定されないが、直鎖状アルコールの
比率が高いと、導電性塗膜の強度が高くなる一方で可撓
性が低下し、もろくなる。また、分枝状アルコールの比
率が高いと、導電性塗膜の耐湿性、耐熱性等の耐久性が
低下する。従っ、て、両者の比率は７対３〜３対７の範
囲が好ましい。The ratio of linear alcohols such as ethylene glycol, diethylene glycol and branched alcohols such as propylene glycol and neopentyl glycol in the dihydric alcohol component is not particularly limited, but if the ratio of linear alcohols is high, the conductive coating will While the strength of the material increases, its flexibility decreases and it becomes brittle. Moreover, when the proportion of branched alcohol is high, durability such as moisture resistance and heat resistance of the conductive coating film decreases. Therefore, the ratio between the two is preferably in the range of 7:3 to 3:7.
即ち、本発明組成物に用いられるポリエステル樹脂は、
上記芳香族二塩基酸成分とアルコール成分とを通常の方
法で縮合重合して得られる、重量平均分子量１０，００
０〜１５０．０００の樹脂である。That is, the polyester resin used in the composition of the present invention is
Weight average molecular weight 10,00, obtained by condensation polymerization of the above aromatic dibasic acid component and alcohol component by a normal method.
0 to 150,000 resin.
本発明組成物に用いられる導電性粉末（以下、成分（Ａ
）という）及びポリエステル樹脂（以下、成分（Ｂ）と
いう）の配合量は使用目的に応じて任意に決めることが
できるが、とりわけ、成分（Ａ）１００重量部に対し、
成分ＣＢ）１０〜５０重量部の範囲で用いるのが好まし
い。成分（Ｂ）が１０重量部未満であると、ＦＰＣ基板
への密着性が低下する傾向がある。また成分（Ｂ）が５
０重量部をこえると、導電性が低下する傾向がある。Conductive powder (hereinafter referred to as component (A)) used in the composition of the present invention
)) and polyester resin (hereinafter referred to as component (B)) can be arbitrarily determined depending on the purpose of use, but especially for 100 parts by weight of component (A),
Component CB) is preferably used in an amount of 10 to 50 parts by weight. When component (B) is less than 10 parts by weight, the adhesiveness to the FPC board tends to decrease. In addition, component (B) is 5
If it exceeds 0 parts by weight, the conductivity tends to decrease.
なお、本発明組成物は、本発明の目的を損わない範囲（
例えば成分（Ａ）１００重量部に対して１０重量部以下
の範囲）で上記成分（Ｂ）以外の樹脂として、例えば、
（メタ）アクリル酸アルキルエステル、塩化ビニル、酢
酸ビニル、スチレン、アクリロニトリル、ビニル基を有
する不飽和カルボン酸等のモノマーを５０重量％以上含
むビニル重合体、セルロースアセテートブチレートのよ
うな酢酸繊維素樹脂、エポキシ樹脂、フェノール樹脂、
アルキド樹脂、ウレタン樹脂、シリコーン樹脂、メラミ
ン樹脂等を含有することができる。また、その他、導電
性印刷インキ組成物に用いられる通常の成分、例えば、
溶剤、添加剤及び顔料を含有することができる。The composition of the present invention may be used within a range that does not impair the purpose of the present invention (
For example, as a resin other than the above component (B) in a range of 10 parts by weight or less per 100 parts by weight of component (A), for example,
Vinyl polymers containing 50% by weight or more of monomers such as (meth)acrylic acid alkyl esters, vinyl chloride, vinyl acetate, styrene, acrylonitrile, unsaturated carboxylic acids having vinyl groups, and acetic acid cellulose resins such as cellulose acetate butyrate. , epoxy resin, phenolic resin,
It can contain alkyd resins, urethane resins, silicone resins, melamine resins, and the like. In addition, other usual components used in conductive printing ink compositions, such as
It may contain solvents, additives and pigments.
以下実施例にもとづき、本発明を具体的に説明する。 The present invention will be specifically described below based on Examples.
なお、以下の記載において「部」とあるのは重量部を意
味する。In addition, in the following description, "parts" means parts by weight.
去鳳■エ
イソフタル酸ジメチル８７．３部（酸成分中４５モル％
）、テレフタル酸ジメチル（酸成分中４５モル％）、セ
バシン酸ジメチル（酸成分中１０モル％）、エチレング
リコール６８．２部（グリコール成分中５０モル％）、
ネオペンチルグリコール１１４．４部（グリコール成分
中５０モル％）、酢酸カルシウム０．２部及び三酸化ア
ンチモン０．１部を０．５〜１．０ ｍＨＨの真空下で
１８０℃で２時間、次いで２８０℃で２時間反応させる
ことにより重量平均分子１７０．０００のポリエステル
樹脂を得た。次に、このポリエステル樹脂３０部を酢酸
３−メトキシブチル４０部に溶解し、ニッケル粉末１０
０部を添加し、高速撹拌により本実施例の導電性印刷イ
ンキ組成物にッケルインキ）を得た０次に、この導電性
印刷インキ組成物をポリエステルフィルム上に１５０メ
ツシユのスクリーンを用いてスクリーン印刷を行い、こ
の印刷物品を８０℃で２０分間乾燥した後、表面抵抗、
密着性、折り曲げ性、耐熱性及び耐湿性の評価を行った
。結果を第１表に示す。Dimethyl eisophthalate 87.3 parts (45 mol% in acid component)
), dimethyl terephthalate (45 mol% in the acid component), dimethyl sebacate (10 mol% in the acid component), 68.2 parts of ethylene glycol (50 mol% in the glycol component),
114.4 parts of neopentyl glycol (50 mol% in glycol component), 0.2 parts of calcium acetate and 0.1 part of antimony trioxide were mixed at 180°C for 2 hours under a vacuum of 0.5 to 1.0 mHH, and then A polyester resin having a weight average molecular weight of 170,000 was obtained by reacting at 280°C for 2 hours. Next, 30 parts of this polyester resin was dissolved in 40 parts of 3-methoxybutyl acetate, and 10 parts of nickel powder was dissolved in 40 parts of 3-methoxybutyl acetate.
Next, this conductive printing ink composition was screen printed on a polyester film using a 150 mesh screen. After drying the printed product at 80°C for 20 minutes, the surface resistance,
Adhesion, bendability, heat resistance, and moisture resistance were evaluated. The results are shown in Table 1.
２〜８、 ′ １〜４
ポリエステル樹脂成分の量又は酸成分並びにグリコール
成分の組成が互に異なる各種導電性印刷インキ組成物を
実施例１と同様の方法により調製した。この導電性印刷
インキ組成物の組成並びに評価結果を実施例２〜８及び
比較例１〜４としてそれぞれ第１表に示す。2-8, ' 1-4 Various conductive printing ink compositions having different amounts of polyester resin components or compositions of acid components and glycol components were prepared in the same manner as in Example 1. The composition and evaluation results of this conductive printing ink composition are shown in Table 1 as Examples 2 to 8 and Comparative Examples 1 to 4, respectively.
９〜１１、 ′ １５〜７
導電性粉末として銀粉末を用い、ポリエステル樹脂成分
の量、又は、酸成分並びにグリコール成分の組成が互い
に異なる各種導電性印刷インキ組成物（銀インキ）を実
施例１と同様の方法により作成した。その組成並びに評
価結果をそれぞれ実施例９〜１１及び比較例５〜７とし
て第２表に示す。9-11, ' 15-7 Example 1 Various conductive printing ink compositions (silver inks) using silver powder as the conductive powder and having different amounts of polyester resin components or compositions of acid components and glycol components were prepared. It was created using the same method as . The compositions and evaluation results are shown in Table 2 as Examples 9 to 11 and Comparative Examples 5 to 7, respectively.
（以下余白、次頁につづく。）
注１） ＴＰＡ；テレフタル酸
ＩＰＡ；イソフタル酸
ＳＶＡ；セバシン酸
ＡｄＡ：アジピン酸
ＭＩＡ ；マロン酸
ＥＧ；エチレングリコール
ＮＰＧ ｉネオペンチルグリコール
ＤＥＣ、ジエチレングリコール
注２） 極間距離２０及び電極長さ２ｃｍの電極を用い
てデジタルボルトメーター（Ｔ
Ｒ−６８４３、タケダ理研工業■製）
で測定した。(The following margins are continued on the next page.) Note 1) TPA; Terephthalic acid IPA; Isophthalic acid SVA; Sebacic acid AdA: Adipic acid MIA; Malonic acid EG; Ethylene glycol NPG i Neopentyl glycol DEC, diethylene glycol Note 2) Between the poles Measurement was performed using a digital voltmeter (TR-6843, manufactured by Takeda Riken Kogyo ■) using electrodes with a distance of 20 cm and an electrode length of 2 cm.
注３） セロテープ剥離試験による。記号の意味は次の
通りである。Note 3) Based on Sellotape peel test. The meanings of the symbols are as follows.
■非常に優れている
Ｏ優れている
Δやや劣る
×非常に劣る
注４） 塗面を外側にして１ｆｉφの心棒の回りに１８
０”折り曲げた評価結果を示す。■Excellent O Excellent Δ Slightly inferior × Very inferior Note 4) 18 around the 1fiφ shaft with the painted surface outside
The evaluation results are shown with 0" bending.
注５） 塗面上の２点間（間隔２０）の抵抗を、印刷物
品を折り曲げる前と折り曲げた
後で測定し、次式に従って求めた。Note 5) The resistance between two points (distance 20) on the painted surface was measured before and after bending the printed product, and was determined according to the following formula.
注６） ８５℃で１４日間放置した後の評価結果を示す
。Note 6) The evaluation results are shown after being left at 85°C for 14 days.
注７） ５０℃及び９８％ＲＨで１４日間放置した後の
評価結果を示す。Note 7) The evaluation results are shown after being left at 50°C and 98% RH for 14 days.
本発明は、導電性印刷インキ組成物が、導電性粉末及び
、芳香族二塩基酸６０〜９５モル％と炭素数４以上の脂
肪族二塩基酸４０〜５モル％とからなる酸成分を用いた
ポリエステル樹脂をそれぞれ含むようにしている。The present invention provides a conductive printing ink composition using a conductive powder and an acid component consisting of 60 to 95 mol% of an aromatic dibasic acid and 40 to 5 mol% of an aliphatic dibasic acid having 4 or more carbon atoms. It is made to contain polyester resin.
このため、本発明の導電性印刷インキ組成物は、導電性
、密着性、可撓性、折り曲げ性、及び耐環境性において
優れた性能を有し、ＦＰＣ基板に回路を形成する上で求
められる種々の特性を満足し、その工業的価値は極めて
大きい。Therefore, the conductive printing ink composition of the present invention has excellent performance in terms of conductivity, adhesion, flexibility, bendability, and environmental resistance, which are required for forming circuits on FPC boards. It satisfies various properties and has extremely great industrial value.
Claims (1)
上の脂肪族二塩基酸４０〜５モル％とからなる酸成分を
用いたポリエステル樹脂 をそれぞれ含む導電性印刷インキ組成物。 ２、導電性粉末１００重量部に対し、ポリエステル樹脂
１０〜５０重量部を含有する特許請求の範囲第１項記載
の導電性印刷インキ組成物。 ３、導電性粉末がニッケル粉末及び／又は銀粉末である
特許請求の範囲第１項又は第２項記載の導電性印刷イン
キ組成物。[Claims] 1. (A), conductive powder, and (B), an acid consisting of 60 to 95 mol% of an aromatic dibasic acid and 40 to 5 mol% of an aliphatic dibasic acid having 4 or more carbon atoms; Conductive printing ink compositions each comprising a polyester resin using the components. 2. The conductive printing ink composition according to claim 1, which contains 10 to 50 parts by weight of polyester resin per 100 parts by weight of conductive powder. 3. The conductive printing ink composition according to claim 1 or 2, wherein the conductive powder is nickel powder and/or silver powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61202559A JPS6357677A (en) | 1986-08-28 | 1986-08-28 | Conductive printing ink composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61202559A JPS6357677A (en) | 1986-08-28 | 1986-08-28 | Conductive printing ink composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6357677A true JPS6357677A (en) | 1988-03-12 |
Family
ID=16459501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61202559A Pending JPS6357677A (en) | 1986-08-28 | 1986-08-28 | Conductive printing ink composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6357677A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6322620B1 (en) | 2000-11-16 | 2001-11-27 | National Starch And Chemical Investment Holding Corporation | Conductive ink composition |
| JP2008134409A (en) * | 2006-11-28 | 2008-06-12 | Fuji Xerox Co Ltd | Fixing device and image forming apparatus |
| US8285182B2 (en) | 2006-11-30 | 2012-10-09 | Brother Kogyo Kabushiki Kaisha | Fixing device used for image forming device with heating roller and peeler |
| US9416290B2 (en) | 2012-12-28 | 2016-08-16 | Nthdegree Technologies Worldwide Inc. | Nickel inks and oxidation resistant and conductive coatings |
| CN109777202A (en) * | 2017-11-10 | 2019-05-21 | 上海宝银电子材料有限公司 | A kind of electronic tag electrically conductive ink and preparation method thereof |
-
1986
- 1986-08-28 JP JP61202559A patent/JPS6357677A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6322620B1 (en) | 2000-11-16 | 2001-11-27 | National Starch And Chemical Investment Holding Corporation | Conductive ink composition |
| JP2008134409A (en) * | 2006-11-28 | 2008-06-12 | Fuji Xerox Co Ltd | Fixing device and image forming apparatus |
| US8285182B2 (en) | 2006-11-30 | 2012-10-09 | Brother Kogyo Kabushiki Kaisha | Fixing device used for image forming device with heating roller and peeler |
| US9416290B2 (en) | 2012-12-28 | 2016-08-16 | Nthdegree Technologies Worldwide Inc. | Nickel inks and oxidation resistant and conductive coatings |
| US9815998B2 (en) | 2012-12-28 | 2017-11-14 | Printed Energy Pty Ltd | Nickel inks and oxidation resistant and conductive coatings |
| US10329444B2 (en) | 2012-12-28 | 2019-06-25 | Printed Energy Pty Ltd | Nickel inks and oxidation resistant and conductive coatings |
| US10961408B2 (en) | 2012-12-28 | 2021-03-30 | Printed Energy Pty Ltd | Nickel inks and oxidation resistant and conductive coatings |
| CN109777202A (en) * | 2017-11-10 | 2019-05-21 | 上海宝银电子材料有限公司 | A kind of electronic tag electrically conductive ink and preparation method thereof |
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