JPS62177074A - Electrically conductive printing ink composition - Google Patents
Electrically conductive printing ink compositionInfo
- Publication number
- JPS62177074A JPS62177074A JP61016769A JP1676986A JPS62177074A JP S62177074 A JPS62177074 A JP S62177074A JP 61016769 A JP61016769 A JP 61016769A JP 1676986 A JP1676986 A JP 1676986A JP S62177074 A JPS62177074 A JP S62177074A
- Authority
- JP
- Japan
- Prior art keywords
- printing ink
- ink composition
- component
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 25
- 238000007639 printing Methods 0.000 title claims description 17
- 239000000843 powder Substances 0.000 claims abstract description 17
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 14
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 14
- 229920001225 polyester resin Polymers 0.000 claims abstract description 13
- 239000004645 polyester resin Substances 0.000 claims abstract description 13
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000178 monomer Substances 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 5
- 229920000058 polyacrylate Polymers 0.000 claims abstract 2
- 230000007613 environmental effect Effects 0.000 abstract description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- 239000002253 acid Substances 0.000 description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- -1 alkylene diol Chemical class 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N benzene-dicarboxylic acid Natural products OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 229940058015 1,3-butylene glycol Drugs 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 235000019437 butane-1,3-diol Nutrition 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- ALOUNLDAKADEEB-UHFFFAOYSA-N dimethyl sebacate Chemical compound COC(=O)CCCCCCCCC(=O)OC ALOUNLDAKADEEB-UHFFFAOYSA-N 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- WZHHYIOUKQNLQM-UHFFFAOYSA-N 3,4,5,6-tetrachlorophthalic acid Chemical compound OC(=O)C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1C(O)=O WZHHYIOUKQNLQM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- VSGNNIFQASZAOI-UHFFFAOYSA-L calcium acetate Chemical compound [Ca+2].CC([O-])=O.CC([O-])=O VSGNNIFQASZAOI-UHFFFAOYSA-L 0.000 description 1
- 239000001639 calcium acetate Substances 0.000 description 1
- 235000011092 calcium acetate Nutrition 0.000 description 1
- 229960005147 calcium acetate Drugs 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
- 229940014772 dimethyl sebacate Drugs 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCIBVZXUNDZWRL-UHFFFAOYSA-N ethylene glycol monophosphate Chemical compound OCCOP(O)(O)=O PCIBVZXUNDZWRL-UHFFFAOYSA-N 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BWSZXUOMATYHHI-UHFFFAOYSA-N tert-butyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(C)(C)C BWSZXUOMATYHHI-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は導電性印刷インキ組成物に1架する。[Detailed description of the invention] [Field of application of the invention] The present invention is based on a conductive printing ink composition.
近年、半導体累子の高密度化と共に、電子機器の小型、
軽量、薄型化が進展し、フレキシプルグリント回路基板
(以下、FPC基板という)が空間を有効に利用し得る
ことから注目されている。In recent years, with the increase in the density of semiconductor components, electronic devices have become smaller and smaller.
With advances in light weight and thinness, flexible glint circuit boards (hereinafter referred to as FPC boards) are attracting attention because they can effectively utilize space.
FPC基板の基材として、民生用にポリエステルフィル
ム、産業用にポリイミドフィルムが使用されている。As base materials for FPC boards, polyester films are used for consumer use, and polyimide films are used for industrial use.
ところで、FPC基板、とシわけポリエステルフィルム
を基材とするFPC基板に回路形成する方法として、導
電性印刷インキ組成物を用いてスクリーン印刷する方法
が主流となシつつある。By the way, as a method for forming a circuit on an FPC board, an FPC board having a separated polyester film as a base material, a method of screen printing using a conductive printing ink composition is becoming mainstream.
一般に、ポリエステルフィルムは離密着性素材であるた
め、これに密着し得るインキ素材には限シがある材料選
択に困Rを栖めている。In general, since polyester film is an adhesive material, there is a limit to the number of ink materials that can adhere to it, making it difficult to select a material.
ポリエステルフィルムに密着し得る導電性印刷インキ組
成物として、特公昭60−25055号には、ベンゼン
ジカルボン酸とアルキレンジオールとから罷導される特
定の線状芳香族ポリエステル樹脂を微細な金(」と混合
した組成物が提案されている。As a conductive printing ink composition capable of adhering closely to polyester films, Japanese Patent Publication No. 60-25055 discloses that a specific linear aromatic polyester resin made from benzene dicarboxylic acid and alkylene diol is mixed with fine gold ("). Mixed compositions have been proposed.
しかし、この様にポリエステル樹脂のみを樹脂成分とし
て構成される導電性印刷インキ組成物は、耐熱性、耐湿
性等の耐環境性、とりわけ耐熱性に劣り、この点で回路
の信頼性低下につながる重大な問題を有していた。However, such conductive printing ink compositions composed of only polyester resin as a resin component are inferior in environmental resistance such as heat resistance and moisture resistance, especially heat resistance, which leads to a decrease in circuit reliability. It had a serious problem.
本発明は、従来の問題点全解決し、導箪性並ひにFPC
基板との密着性に優れていると共に、耐環境性とりわけ
耐熱性に優れた導電性印刷インキ組成物を提供すべくな
されたものである。The present invention solves all the conventional problems and improves the guideability and FPC.
This invention was made in order to provide a conductive printing ink composition that has excellent adhesion to a substrate and also has excellent environmental resistance, particularly heat resistance.
即ち、本発明によって提供される導電性印刷インキ組成
物(以下、本発明組成物という)は、(A)導電性粉末
、及Q: (B)ポリエステル樹脂の存在下での重合に
より得られるアクリル樹脂を主成分として含むことを特
徴とするものである。That is, the conductive printing ink composition provided by the present invention (hereinafter referred to as the composition of the present invention) comprises (A) a conductive powder, and (B) an acrylic resin obtained by polymerization in the presence of a polyester resin. It is characterized by containing resin as a main component.
本発明組成物の(8)成分である導電性粉末としては、
銅、銀、ニッケル、鉄、金、白金、パラジウム等の純金
属乃至はこれらの金属全基質とする合金の粉末、炭素粉
末等の導電性を有する粉末の1種又は2種以上が用いら
れる。なかでも、樹板状の金属粉末、とシわけ樹板状の
銅粉を使用した場合に、本発明の効果が顕著に現れる。The conductive powder that is component (8) of the composition of the present invention includes:
One or more types of conductive powders such as pure metals such as copper, silver, nickel, iron, gold, platinum, and palladium, powders of alloys containing these metals as a total matrix, and carbon powders are used. Among these, the effects of the present invention are particularly apparent when a dendritic metal powder or a shredded dendritic copper powder is used.
この理由は明らかではないが、この様な金属粉を含む複
合系導電性材料では、金属粉相互の接触によシ導電性が
発現されるため、単なる球状あるいは、鱗片状の形状全
有するよシも、表面に凹凸を有する樹板状の金属粉が好
ましい結果を与える為であると考えられる。The reason for this is not clear, but in a composite conductive material containing metal powder, conductivity is developed through contact between the metal powders, so it is not possible to create a composite conductive material that has a simple spherical or scale-like shape. This is also believed to be because the dendritic metal powder having an uneven surface gives preferable results.
本発明組成物の(B)成分であるアクリル樹脂は、(メ
タ)アクリル酸アルキルエステル等の(メタ)アクリル
酸エステルをモノマー主成分として、ポリエステル樹脂
の存在で通常の重合方法、好ましくは溶液重合法によシ
調製することができる。The acrylic resin, which is the component (B) of the composition of the present invention, has a (meth)acrylic acid ester such as an alkyl (meth)acrylic acid ester as a main monomer component, and is polymerized by a normal polymerization method, preferably by solution polymerization, in the presence of a polyester resin. It can be legally prepared.
なかでも、とりわけモノマー成分の50〜100重量%
がメタクリル酸メチルであシ、メタクリル酸メチルのみ
を重合させて得られるか、あるいはメタクリル酸メチル
と、(メタ)アクリル酸、炭素数2〜20のアルキル基
を有する(メタ)アクリル酸アルキルエステル、(メタ
)アクリル酸シクロヘキシル、(メタ)アクリル酸ベン
ジル、(メタ)アクリル酸2−ヒドロキシエチル、(メ
タ)アクリル酸2−ヒドロキシプロピル、(メタ)アク
リル酸ジメチルアミノエチル、(メタ)アクリル酸ジエ
チルアミノエチル、(メタ)アクリル酸グレシジル、(
メタ)アクリル酸テトラヒドロフルフリル、(メタ)ア
クリル酸(リン酸ヒドロキシエチルエステル)、等の(
メタ)アクリル酸及びそのエステル群及びスチレン等の
芳香族ビニル化合物、酢酸ビニル等のビニルエステル、
アクリロニトリル等のシチン化ビニル化合物等のその他
の共重合可能なモノマーとを共重合させて得られるアク
リル樹脂が導電性粉末に対してなじみ易く、かつ耐環境
性導電性等の性能を発揮する上で極めて好都合である。Among them, especially 50 to 100% by weight of the monomer component
is methyl methacrylate, obtained by polymerizing only methyl methacrylate, or methyl methacrylate and (meth)acrylic acid, a (meth)acrylic acid alkyl ester having an alkyl group having 2 to 20 carbon atoms, Cyclohexyl (meth)acrylate, benzyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate , (meth)grecidyl acrylate, (
(meth)acrylic acid (tetrahydrofurfuryl), (meth)acrylic acid (phosphoric acid hydroxyethyl ester), etc.
meth)acrylic acid and its esters, aromatic vinyl compounds such as styrene, vinyl esters such as vinyl acetate,
The acrylic resin obtained by copolymerizing with other copolymerizable monomers such as cytinated vinyl compounds such as acrylonitrile is compatible with conductive powder and exhibits performance such as environmental resistance and conductivity. This is extremely convenient.
(B)成分のアクリル樹脂の形成に用いられるぼりエス
テル樹脂は、例えばフタル酸、イソフタル酸、テレフタ
ル酸、テトラヒドロンタル酸、3.6−ニンドメチレン
テトラヒドロフタル酸、コハク酸、アジピン酸、セバシ
ン酸、テトラクロロフタル酸、ヘット酸等の多価カルボ
ン酸と、例えばエチレングリコール、ジエチレングリコ
ール、トリエチレンクリコール、プ四ピレングリコール
、ジプロピレングリコール、ネオインテルグリコール、
1,3−ブチレングリコール、2,3−ブチレングリコ
ール等の多価アルコールと全通常の方法で縮合重合して
製造されるものであ勺、その種類等に特に制限はない。The ester resin used to form the acrylic resin of component (B) is, for example, phthalic acid, isophthalic acid, terephthalic acid, tetrahydrontal acid, 3,6-nindomethylenetetrahydrophthalic acid, succinic acid, adipic acid, sebacic acid, Polyhydric carboxylic acids such as tetrachlorophthalic acid and het-acid; for example, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, neointer glycol,
It is produced by condensation polymerization with polyhydric alcohols such as 1,3-butylene glycol and 2,3-butylene glycol by any conventional method, and there are no particular restrictions on its type.
なかでも、多価カルボン酸としては、芳香族二塩基酸と
炭素数4以上の脂肪族二塩基酸との組合せが好ましい。Among these, as the polyhydric carboxylic acid, a combination of an aromatic dibasic acid and an aliphatic dibasic acid having 4 or more carbon atoms is preferred.
例えば、芳香族二塩基酸として、イソフタル酸、テレフ
タル酸等があげられ、脂肪族二塩基酸としてアジピン酸
、セバシン酸等があげられる。次に、多価アルコールと
しては、エチレングリコール、ネオペンチルグリコール
、1,3−ブチレングリコール等のアルキレンジアルコ
ールが好ましい。さらに好ましくは、芳香族二塩基酸の
60重量%以上、脂肪族二塩基酸の40重量%以下から
成る多価カルボン酸成分と、エチレングリコール及び/
又はネオペンチルグリコールの多価アルコール成分から
成るポリエステルが好ましい0
本発明組成物における前記(A)及び(B)成分の配合
量は使用目的に応じて任意に決めることができるが、と
シわけ(4)成分の導電性粉末100重量部に対し、(
B)成分10〜50重量部の範囲で用いるのが好ましい
。CB)成分が10重量部未満で用いると印刷性が低下
し好ましくない。また(B)成分250重量部を超えて
用いると導電性低下が大きくなる傾向にあシ、好ましく
ない。さらにCB)成分を構成するポリエステル樹脂の
含量が(B)成分のアクリル樹脂中5〜50重Mチの範
囲で用いるのが好ましい。ポリエステル樹脂の(B)成
分中における含量が5重量%未満で用いると、FPC基
板とくにがりエステルフィルムへの密着性が低下する傾
向にあシ、好ましくない。また、ポリエステル樹脂の■
)成分中における含量が50重:!fit %を超える
と、耐環境性、特に熱履歴後の導電性が低下する傾向に
あシ、好ましくない。For example, examples of aromatic dibasic acids include isophthalic acid and terephthalic acid, and examples of aliphatic dibasic acids include adipic acid and sebacic acid. Next, as the polyhydric alcohol, alkylene dialcohols such as ethylene glycol, neopentyl glycol, and 1,3-butylene glycol are preferable. More preferably, a polyhydric carboxylic acid component consisting of 60% by weight or more of aromatic dibasic acid and 40% by weight or less of aliphatic dibasic acid, ethylene glycol and/or
or polyester consisting of a polyhydric alcohol component of neopentyl glycol is preferred. The blending amounts of the components (A) and (B) in the composition of the present invention can be arbitrarily determined depending on the purpose of use, but there are no exceptions. 4) For 100 parts by weight of the conductive powder of the component, (
It is preferable to use component B) in an amount of 10 to 50 parts by weight. If component CB) is used in an amount less than 10 parts by weight, printability deteriorates, which is not preferable. Furthermore, if component (B) is used in an amount exceeding 250 parts by weight, the conductivity tends to decrease significantly, which is not preferable. Furthermore, it is preferable that the content of the polyester resin constituting component CB) be in the range of 5 to 50 weight Mh in the acrylic resin of component (B). If the content of the polyester resin in component (B) is less than 5% by weight, the adhesion to the FPC board and especially the bitter ester film tends to decrease, which is not preferable. In addition, polyester resin ■
) The content in the ingredients is 50 times:! If it exceeds fit %, the environmental resistance, especially the conductivity after thermal history, tends to deteriorate, which is not preferable.
なお、本発明組成物には、本発明の目的を損わない範囲
(例えば囚成分100重量部に対して10重量部以下の
範囲)で、前記(B)及び(C’l成分以外の樹脂とし
て、例えば塩化ビニル、酢酸ビニル、スチレン、アクリ
ロニトリル等のモノマー全重量型量φ以上含むビニル重
合体、セルロースアセテートブチレートのような酢酸繊
維素樹脂、エポキシ樹脂、フェノール樹脂、アルキド樹
脂、ウレタン樹脂、シリコン樹脂、メラミン樹脂などを
含ませることができる。また、その他、導電性印刷イン
キ組成物に用いられる通常の成分として、例えば溶剤、
添加剤、顔料等を含ませることができる。The composition of the present invention may contain resins other than the above (B) and (C'l components) within a range that does not impair the object of the present invention (for example, within a range of 10 parts by weight or less per 100 parts by weight of the prisoner component). For example, vinyl polymers containing monomers such as vinyl chloride, vinyl acetate, styrene, acrylonitrile, etc. in a total weight type amount of φ or more, cellulose acetate resins such as cellulose acetate butyrate, epoxy resins, phenolic resins, alkyd resins, urethane resins, It can contain silicone resin, melamine resin, etc. In addition, as usual components used in conductive printing ink compositions, for example, solvent,
Additives, pigments, etc. can be included.
以下実施例にもとづき、本発明を具体的に説明する。な
お、実施例中「部J、r%Jとあるのは、それぞれ重量
部、重量%を意味する。The present invention will be specifically described below based on Examples. In the examples, "part J" and "r% J" mean parts by weight and % by weight, respectively.
実施例−1
メタクリル酸メチル74.5部、アクリル酸0.5部お
よび重合開始剤カヤエステルO(化薬ヌーリー(株〕製
)1.5部をイソフタル酸ジメチル40部、テレフタル
酸ジメチル40部、セバシン酸ジメチル20部、エチレ
ングリコール60部、ネオペンチルグリコール60部、
酢酸カルシウム0.2部、三酸化アンチモン0.1部を
180℃にて2時間、次いで280℃にて2時間反応さ
せることにより得られたポリエステル樹脂25部、シク
ロヘキサノン145部、 DBE (E、1. da
Pont da Nemours& Coa社製)65
部混合液中で90℃にて9.5時間反応させ2.ポリエ
ステル樹脂変性アクリル樹脂溶液を得た。該樹脂溶液は
、固形分32,3チ重景平均分子量5万5千酸価1.8
の特性を示した。該ポリエステル樹脂変性アクリル樹脂
溶液77.5部にm粉末100部シクロヘキサノン15
部を添加し高速攪拌によシ導電性印刷インキ組成物を得
た。Example-1 74.5 parts of methyl methacrylate, 0.5 part of acrylic acid, and 1.5 parts of polymerization initiator Kayaester O (manufactured by Kayaku Nouri Co., Ltd.) were mixed with 40 parts of dimethyl isophthalate and 40 parts of dimethyl terephthalate. , 20 parts of dimethyl sebacate, 60 parts of ethylene glycol, 60 parts of neopentyl glycol,
25 parts of polyester resin obtained by reacting 0.2 parts of calcium acetate and 0.1 parts of antimony trioxide at 180°C for 2 hours and then at 280°C for 2 hours, 145 parts of cyclohexanone, DBE (E, 1 .da
(manufactured by Pont da Nemours & Coa) 65
2. React in the mixed solution at 90°C for 9.5 hours. A polyester resin-modified acrylic resin solution was obtained. The resin solution has a solid content of 32.3%, a weighted average molecular weight of 55,000, and an acid value of 1.8.
showed the characteristics of To 77.5 parts of the polyester resin-modified acrylic resin solution was added 100 parts of m powder and 15 parts of cyclohexanone.
1 part and stirred at high speed to obtain a conductive printing ink composition.
該導電性印刷インキ組成物をプリエステルフィルム上に
150メツシユのスクリーンを用いて、スクリーン印刷
を行い、該印刷物品全常温で一夜又は80℃で20分乾
燥した後、表面抵抗、密着性、耐熱性、耐湿性等の評価
を行った。The conductive printing ink composition was screen printed on a preester film using a 150 mesh screen, and after drying the printed product overnight at room temperature or for 20 minutes at 80°C, the surface resistance, adhesion, and heat resistance were evaluated. Evaluations were made of properties such as durability and moisture resistance.
実施例−2〜8.比較例−1,2
実施例−1と同様の手法によシ、樹脂組成の異なる各種
印刷物品を作成し、その結果を実施例及び比較例として
第1表にまとめた。Examples-2 to 8. Comparative Examples 1 and 2 Various printed products having different resin compositions were prepared using the same method as in Example 1, and the results are summarized in Table 1 as Examples and Comparative Examples.
注1)樹脂分は銅粉末100部に対する重量部を示す。Note 1) Resin content indicates parts by weight based on 100 parts of copper powder.
注2)表面抵抗は電極間2 信電極長さ2cmの電極を
用いデジタルボルトメーターTR−6843(タケダ埋
研社製)で測定した。Note 2) Surface resistance was measured using a digital voltmeter TR-6843 (manufactured by Takeda Buken Co., Ltd.) using electrodes with a length of 2 cm between two electrodes.
注3)密着性はセロテープ剥離試験によシ、記号は下記
の意味を示す。Note 3) Adhesion was determined by cellophane tape peel test. Symbols have the following meanings.
◎非常に優れている。○優れている。△やや劣る。×非
常に劣る
注4)耐熱性は85℃にて14日後の評価結果を示す。◎Excellent. ○Excellent. △Slightly inferior. ×Very poor Note 4) Heat resistance shows the evaluation results after 14 days at 85°C.
注5)耐湿性は50℃×98ヴRHにて14日後の評価
結果を示す。Note 5) Moisture resistance shows the evaluation results after 14 days at 50°C x 98VRH.
実施例9
メタクリル酸メチル445部、メタクリル酸n−ブチル
30部、アクリル酸0.5部を用いる以外は、実施例と
同様の手法によシ印刷物品を作成し、その結果を第1表
に掲げた。Example 9 A printed product was prepared in the same manner as in Example except that 445 parts of methyl methacrylate, 30 parts of n-butyl methacrylate, and 0.5 part of acrylic acid were used, and the results are shown in Table 1. I raised it.
本発明の導電性印刷インキ組成物は導電性、密着性、耐
環境性において優れた性能を有し、FPC基板に回路を
形成する上で、求められる種々の特性を満足しておシ、
その工業的価値は極めて大きい。The conductive printing ink composition of the present invention has excellent performance in terms of conductivity, adhesion, and environmental resistance, and satisfies various properties required for forming circuits on FPC boards.
Its industrial value is extremely large.
代 理 人 弁理士 山 下 穣 平手続補正書(
rl鋤
昭和61年9月9日
特許庁長官 黒 1) 明 雄 殿1 事件の表
示
昭和61年特許願第16769号
2 発明の名称
導電性印刷インキ組成物
3 補正をする者
事件との関係 特許出願人
名称 (603) 三菱レイヨン株式会社4 代理
人 〒105
住所 東京都港区虎ノ門5丁目13番1号虎ノ門4o
森ビル明細書の発明の詳細な説明の欄
6 補正の内容
(1) 明細書2頁最下行の「・・・がある・・・」を
「・・・があり、・・・」とする。Agent Patent Attorney Johei Yamashita Procedural Amendment (
rl Paku September 9, 1988 Commissioner of the Patent Office Black 1) Toshio Akira 1 Indication of the case Patent Application No. 16769 of 1988 2 Name of the invention Conductive printing ink composition 3 Person making the amendment Relationship with the case Patent Applicant name (603) Mitsubishi Rayon Co., Ltd. 4 Agent 105 Address 40 Toranomon 5-13-1 Toranomon, Minato-ku, Tokyo
Column 6 of Detailed Description of the Invention in the Mori Building Specification Contents of Amendment (1) Change “There is...” on the bottom line of page 2 of the specification to “There is...” .
(2) 同5頁13行の「酸グレシジル・・・」を「酸
グリシジル・・・」とする。(2) "Grecidyl acid..." on page 5, line 13 is changed to "glycidyl acid...".
(3) 同9頁下から5行の「・・・固形分32.3%
重量」を「・・・固形分32.3%、重量」とする。(3) 5 lines from the bottom of page 9: “...Solid content: 32.3%
"Weight" is "...Solid content 32.3%, weight".
(4) 同9頁下から4行の「・・・5万5千酸価・・
・」を「・・・5万5千、酸価・・・」とする。(4) 4 lines from the bottom of page 9, “...55,000 acid value...
・” is changed to “...55,000, acid value...”.
Claims (5)
の存在下での重合により得られるアクリル樹脂を主成分
として含むことを特徴とする導電性印刷インキ組成物。(1) A conductive printing ink composition comprising as main components an acrylic resin obtained by polymerization in the presence of (A) a conductive powder and (B) a polyester resin.
B)のアクリル樹脂10〜50重量部含有する特許請求
の範囲第(1)項記載の導電性印刷インキ組成物。(2) For 100 parts by weight of the conductive powder of component (A), (
The conductive printing ink composition according to claim (1), containing 10 to 50 parts by weight of the acrylic resin B).
特許請求の範囲第(1)項又は第(2)項記載の導電性
印刷インキ組成物。(3) The conductive printing ink composition according to claim (1) or (2), wherein the conductive powder of component (A) is a resinous copper powder.
分を構成するモノマー成分の50〜100重量%がメタ
クリル酸メチルである特許請求の範囲第(1)項乃至第
(3)項のうちの1に記載の導電性印刷インキ組成物。(4) Among the claims (1) to (3), 50 to 100% by weight of the monomer component constituting the acrylic polymer portion in the acrylic resin of component (B) is methyl methacrylate. The conductive printing ink composition according to item 1.
含量が5〜50重量%である特許請求の範囲第(1)項
乃至第(4)項記載の導電性印刷インキ組成物。(5) The conductive printing ink composition according to claims (1) to (4), wherein the acrylic resin as component (B) has a polyester resin content of 5 to 50% by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61016769A JPS62177074A (en) | 1986-01-30 | 1986-01-30 | Electrically conductive printing ink composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61016769A JPS62177074A (en) | 1986-01-30 | 1986-01-30 | Electrically conductive printing ink composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62177074A true JPS62177074A (en) | 1987-08-03 |
Family
ID=11925421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61016769A Pending JPS62177074A (en) | 1986-01-30 | 1986-01-30 | Electrically conductive printing ink composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62177074A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990001048A1 (en) * | 1988-07-28 | 1990-02-08 | Eastman Kodak Co | Ink composition containing a blend of a polyester and an acrylic polymer |
US5395876A (en) * | 1993-04-19 | 1995-03-07 | Acheson Industries, Inc. | Surface mount conductive adhesives |
-
1986
- 1986-01-30 JP JP61016769A patent/JPS62177074A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990001048A1 (en) * | 1988-07-28 | 1990-02-08 | Eastman Kodak Co | Ink composition containing a blend of a polyester and an acrylic polymer |
US5395876A (en) * | 1993-04-19 | 1995-03-07 | Acheson Industries, Inc. | Surface mount conductive adhesives |
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