JPH05174621A - Conductive composite - Google Patents

Conductive composite

Info

Publication number
JPH05174621A
JPH05174621A JP34357591A JP34357591A JPH05174621A JP H05174621 A JPH05174621 A JP H05174621A JP 34357591 A JP34357591 A JP 34357591A JP 34357591 A JP34357591 A JP 34357591A JP H05174621 A JPH05174621 A JP H05174621A
Authority
JP
Japan
Prior art keywords
compound
group
resin
copper powder
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34357591A
Other languages
Japanese (ja)
Inventor
Mikio Nakano
幹夫 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOF Corp
Original Assignee
Nippon Oil and Fats Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Oil and Fats Co Ltd filed Critical Nippon Oil and Fats Co Ltd
Priority to JP34357591A priority Critical patent/JPH05174621A/en
Publication of JPH05174621A publication Critical patent/JPH05174621A/en
Pending legal-status Critical Current

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  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To enable direct soldering to be carried out on a conductive curing coating so as to improve conductivity and solidity by making a conductive composite to contain copper powder, thermocuring resin, a hologen compound including a specific compound and a specific group. CONSTITUTION:A conductive compound is made to contain copper powder, thermocuring resin, a compound to be expressed by a formula, and a compound simultaneously having a replaceable or unreplaceable amino group or an alkyl amino group, a hydroxyl group or a hydroxy methyl group in one molecule. However in the formula, R1CO- is an acyl group having the carbon number 1 to 22, R2 is a hydrogen atom or an alkyl group or an alkenyl group having the carbon number 1 to 22 and (n) is an integer of 1 to 10. Epoxy resin, urea resin, melamin resin are used as thermocuring resin. The blending rate of a copper powder and that of thermocuring resin are 65 to 95wt.%, for copper powder and 5 to 35wt.% for resin. As a compound to be expressed is caproyl sarcosine, lauroyl sarcosine are used, and as an aromatic compound, o-, m- or p- amino phenol can be used.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、導電性組成物に関し、
更に詳細には、導電性及び半田付け性等に優れ、印刷回
路用等に極めて有用である半田付け可能な導電性組成物
に関する。
FIELD OF THE INVENTION The present invention relates to a conductive composition,
More specifically, it relates to a solderable conductive composition which has excellent conductivity and solderability and is extremely useful for printed circuits.

【0002】[0002]

【従来の技術】従来から電子部品分野において、印刷回
路用導電性組成物としては、金及び銀等の貴金属を主成
分とする導電性組成物が広く用いられている。特に銀
は、最も体積固有抵抗の低い金属であること、酸化した
際も導電性を有していること及び貴金属の中でも比較的
廉価であることから多用されている。
2. Description of the Related Art Conventionally, in the field of electronic parts, as a conductive composition for a printed circuit, a conductive composition containing a noble metal such as gold and silver as a main component has been widely used. In particular, silver is frequently used because it has the lowest volume resistivity, has conductivity even when oxidized, and is relatively inexpensive among noble metals.

【0003】しかしながら、銀を主成分とする導電性組
成物により印刷回路を形成する場合、例えば回路の線間
隔が狭く、しかも電位差が大きい場合には、銀の移行現
象(マイグレーション)が生じ、回路の抵抗増大、更に
は回路の短絡が生じるという欠点がある。また近年、電
子部品業界においては、コスト低減が重要視されてお
り、比較的廉価な銀でさへコスト的に問題がある。
However, when a printed circuit is formed of a conductive composition containing silver as a main component, for example, when the line spacing of the circuit is narrow and the potential difference is large, a silver migration phenomenon (migration) occurs and the circuit However, there is a drawback that the resistance is increased and the circuit is short-circuited. In recent years, cost reduction has been emphasized in the electronic component industry, and there is a problem in terms of cost because silver is relatively inexpensive.

【0004】そこで最近、銀に次いで体積固有抵抗が低
く、しかも銀よりも廉価な銅を主成分とする導電性組成
物の開発が種々検討されている。しかし、該導電性組成
物中の銅粉末は、大きな被酸化性を有しているため、導
電性組成物の貯蔵時、印刷及び加熱等の回路形成時、更
には、形成された回路の使用時において、銅粉末の表面
が酸化され、銅粉末粒子間の接触抵抗が増大し、十分な
導電性を得ることができないという欠点があると同時
に、通常半田付けができないという不都合がある。
Therefore, recently, various studies have been made on the development of a conductive composition containing copper as a main component, which has a volume resistivity lower than that of silver and is cheaper than silver. However, since the copper powder in the conductive composition has a large oxidizability, it is necessary to store the conductive composition, form a circuit such as printing and heating, or use the formed circuit. At times, the surface of the copper powder is oxidized, the contact resistance between the copper powder particles increases, and sufficient conductivity cannot be obtained. At the same time, there is a disadvantage that soldering cannot be normally performed.

【0005】従って、このような銅粉末が有する欠点を
解決するために、種々の添加剤を、銅を主成分とする導
電性組成物中に添加することが提案されているが、添加
剤自体の種々の物理的限界があり、高性能な半田付けを
する場合には問題が生じる。該添加剤としては例えば、
特公昭52−24936号公報には亜燐酸又はその誘導
体が、特公昭61−36796号公報にはアントラセン
又はその誘導体が、特開昭57−55974号公報には
ヒドロキノン類の誘導体が、また特開昭61−2113
78号公報には不飽和脂肪酸が、特公昭61−1417
5号公報には脂肪酸アミドが、特開昭61−20017
9号公報には高級脂肪族アミンが、特開昭58−225
168号公報にはフェニレンジアミン誘導体が提案され
ている。しかし、これらの添加剤を含有する公知の導電
性ペーストは、通常硬化塗膜上に直接半田付けができな
いため、半田付けを行う場合には、半田付けの前に例え
ば、回路の塗膜に活性化処理を施して無電解メッキをす
るか、または塗膜を陰極としてメッキ液中で電気銅メッ
キを施す等の前処理を行う必要がある。従って、これら
の前処理を必要とせずに直接半田付けが可能であって、
電子部品の固着やリードワイヤーの取り出し等における
半田付け工程の大幅な短縮ができ、経済性に優れる導電
性組成物の開発が望まれている。
Therefore, in order to solve the drawbacks of such a copper powder, it has been proposed to add various additives to a conductive composition containing copper as a main component, but the additive itself. There are various physical limitations, and problems arise when performing high-performance soldering. Examples of the additive include
JP-B-52-24936 discloses phosphorous acid or a derivative thereof, JP-B-61-36796 discloses anthracene or a derivative thereof, JP-A-57-55974 discloses a derivative of hydroquinone, and JP-A-57-55974. 61-2113
In Japanese Patent No. 78, unsaturated fatty acids are disclosed in Japanese Patent Publication No. 61-1417
A fatty acid amide is disclosed in JP-A-61-20017.
Higher aliphatic amines are disclosed in JP-A-58-225.
Japanese Patent No. 168 proposes a phenylenediamine derivative. However, known conductive pastes containing these additives usually cannot be soldered directly on the cured coating film. It is necessary to carry out a pretreatment such as chemical treatment for electroless plating, or electrolytic copper plating in a plating solution with the coating film as a cathode. Therefore, direct soldering is possible without the need for these pretreatments,
It is desired to develop a conductive composition which can significantly shorten the soldering process for fixing electronic parts and taking out lead wires and is excellent in economic efficiency.

【0006】[0006]

【発明が解決しようとする課題】従って本発明の目的
は、導電性硬化塗膜上に直接半田付けができ、更に導電
性、堅牢性等に優れ、且つ印刷回路等に極めて有用であ
る半田付け可能な導電性組成物を提供することにある。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solder directly on a conductive cured coating film, and further, it is excellent in conductivity, robustness and the like and is extremely useful for a printed circuit or the like. It is to provide a possible conductive composition.

【0007】[0007]

【課題を解決するための手段】本発明によれば、(a)
銅粉末、(b)熱硬化性樹脂及び(c)下記一般式化2
(式中(R1)CO−は、炭素数1〜22のアシル基を
示し、R2は水素原子又は炭素数1〜22のアルキル基
若しくはアルケニル基を示す。またnは1〜10の整数
を示す)で表わされる化合物(以下化合物(c)と称
す)及び
According to the present invention, (a)
Copper powder, (b) thermosetting resin, and (c) the following general formula 2
(In the formula, (R 1 ) CO— represents an acyl group having 1 to 22 carbon atoms, R 2 represents a hydrogen atom or an alkyl group or an alkenyl group having 1 to 22 carbon atoms, and n is an integer of 1 to 10). Represents a compound (hereinafter referred to as compound (c)) and

【0008】[0008]

【化2】 [Chemical 2]

【0009】(d)置換又は非置換のアミノ基又はアル
キルアミノ基と、置換又は非置換の水酸基又はヒドロキ
シメチル基とを1分子中に同時に有する芳香族化合物を
含有してなる導電性組成物が提供される。
(D) A conductive composition containing an aromatic compound having a substituted or unsubstituted amino group or alkylamino group and a substituted or unsubstituted hydroxyl group or hydroxymethyl group in one molecule at the same time. Provided.

【0010】以下本発明を更に詳細に説明する。The present invention will be described in more detail below.

【0011】本発明の導電性組成物に用いる(a)銅粉
末は、特に限定されるものではないが、例えば電解銅
粉、酸化第一銅、酸化第二銅等を還元した還元銅粉、ア
トマイズ銅粉、金属銅粉砕物等を好ましく挙げることが
できる。該銅粉末の粒径は、0.5〜100μm、特に
0.5〜30μmの範囲であるのが好ましい。粒径が1
00μmを超える場合には、印刷性に問題が生じ、また
0.5μm未満の場合にはでは、銅粉末が酸化されやす
く、得られる塗膜の導電性が低下するので好ましくな
い。
The (a) copper powder used in the conductive composition of the present invention is not particularly limited, but for example, reduced copper powder obtained by reducing electrolytic copper powder, cuprous oxide, cupric oxide, etc., Preferable examples include atomized copper powder and crushed metal copper. The particle size of the copper powder is preferably 0.5 to 100 μm, and particularly preferably 0.5 to 30 μm. Particle size is 1
When it exceeds 00 μm, there is a problem in printability, and when it is less than 0.5 μm, the copper powder is likely to be oxidized and the conductivity of the resulting coating film decreases, which is not preferable.

【0012】本発明の導電性組成物に用いる(b)熱硬
化性樹脂としては、例えばエポキシ樹脂、尿素樹脂、メ
ラミン樹脂、フェノール樹脂、不飽和ポリエステル樹
脂、アルキッド樹脂、ジアリルフタレート等のアリル樹
脂、熱硬化性ウレタン樹脂、ポリイミド樹脂等を好まし
く挙げることができる。
Examples of the thermosetting resin (b) used in the conductive composition of the present invention include epoxy resins, urea resins, melamine resins, phenol resins, unsaturated polyester resins, alkyd resins, allyl resins such as diallyl phthalate, Preferable examples are thermosetting urethane resins and polyimide resins.

【0013】本発明において、前記(a)銅粉末と、
(b)熱硬化性樹脂との配合割合は、好ましくは(a)
銅粉末65〜95重量%、特に好ましくは75〜90重
量%、即ち(b)熱硬化性樹脂5〜35重量%、特に好
ましくは10〜25重量%であるのが望ましい。前記
(a)銅粉末の配合割合が65重量%未満では、導電回
路として要求される比抵抗が得られず、また95重量%
を超える場合には、印刷性が低下するので好ましくな
い。
In the present invention, (a) the copper powder,
The blending ratio with the (b) thermosetting resin is preferably (a).
It is desirable that the copper powder is 65 to 95% by weight, particularly preferably 75 to 90% by weight, that is, (b) the thermosetting resin is 5 to 35% by weight, particularly preferably 10 to 25% by weight. If the compounding ratio of the (a) copper powder is less than 65% by weight, the specific resistance required for a conductive circuit cannot be obtained, and the content is 95% by weight.
When it exceeds, the printability is deteriorated, which is not preferable.

【0014】本発明の導電性組成物に用いる化合物
(c)は、前記一般式化2で表わすことができ、式中
(R1)CO−が、炭素数22を超えるアシル基、R2
炭素数22を超えるアルキル基又はアルケニル基若しく
はnが10を超える場合には、何れも製造が困難であ
る。前記化合物(c)としては、具体的には例えば、カ
プロイルサルコシン、ラウロイルサルコシン、ミリスト
イルサルコシン、パルミトイルサルコシン、ステアロイ
ルサルコシン、オレオイルサルコシン、ベヘノイルサル
コシン等の高級脂肪酸から変成されるN−アシルサルコ
シン、またはヤシ油脂肪酸サルコシン、トール油脂肪酸
サルコシン等の混合脂肪酸サルコシン、N−ラウロイル
−N−メチル−β−アラニン、N−オレオイル−N−メ
チル−β−アラニン、N−ココイル−N−メチル−β−
アラニン、N−カプロイル−N−メチル−β−アラニ
ン、N−ミリストイル−N−メチル−β−アラニン、N
−パルミトイル−N−メチル−β−アラニン、N−ステ
アロイル−N−メチル−β−アラニン、N−ベヘノイル
−N−メチル−β−アラニン等を好ましく挙げることが
できる。該化合物(c)の配合量は、前記銅粉末と、熱
硬化性樹脂との合計量100重量部に対して、好ましく
は0.5〜10重量部、特に好ましくは1.5〜7.5
重量部である。前記配合量が、0.5重量部未満の場合
には、添加による種々の効果が得られず、また10重量
部を超えると、導電性組成物としての物性に悪影響を及
ぼすので好ましくない。
The compound (c) used in the conductive composition of the present invention can be represented by the above general formula 2, wherein (R 1 ) CO— is an acyl group having more than 22 carbon atoms and R 2 is When the alkyl group or alkenyl group having more than 22 carbon atoms or n exceeds 10, it is difficult to produce any of them. Specific examples of the compound (c) include N-acyl sarcosine modified from higher fatty acids such as caproylsarcosine, lauroylsarcosine, myristoylsarcosine, palmitoylsarcosine, stearoylsarcosine, oleoylsarcosine, and behenoylsarcosine. , Or mixed fatty acid sarcosine such as coconut oil fatty acid sarcosine and tall oil fatty acid sarcosine, N-lauroyl-N-methyl-β-alanine, N-oleoyl-N-methyl-β-alanine, N-cocoyl-N-methyl- β-
Alanine, N-caproyl-N-methyl-β-alanine, N-myristoyl-N-methyl-β-alanine, N
Preferable examples include -palmitoyl-N-methyl-β-alanine, N-stearoyl-N-methyl-β-alanine and N-behenoyl-N-methyl-β-alanine. The compounding amount of the compound (c) is preferably 0.5 to 10 parts by weight, particularly preferably 1.5 to 7.5 parts by weight based on 100 parts by weight of the total amount of the copper powder and the thermosetting resin.
Parts by weight. When the content is less than 0.5 parts by weight, various effects due to addition cannot be obtained, and when it exceeds 10 parts by weight, the physical properties of the conductive composition are adversely affected, which is not preferable.

【0015】本発明において用いる(d)置換又は非置
換のアミノ基又はアルキルアミノ基と、置換又は非置換
の水酸基又はヒドロキシメチル基とを1分子中に同時に
有する芳香族化合物(以下化合物(d)と称す)は、導
電性組成物の半田付け性を向上させる成分である。前記
化合物(d)としては、例えば、o−アミノフェノー
ル;m−アミノフェノール;p−アミノフェノール;N,
N−ジメチル−m−アミノフェノール、N,N−ジブチ
ル−m−アミノフェノール等のN,N−ジアルキル誘導
体;N−β−ヒドロキシエチル−m−アミノフェノール
等のN−β−ヒドロキシエチル誘導体;N,N−ジ−
(β−ヒドロキシエチル)誘導体;3,3´−ジメトキ
シ−4,4´−ジアミノビフェニール等のジメトキシ−
ジアミノビフェニ−ル;3,3´−ジヒドロキシ−4,
4´−ジアミノビフェニール等のジヒドロキシ−ジアミ
ノビフェニール等を好ましく挙げることができる。
An aromatic compound (d) which is used in the present invention and which simultaneously has a substituted or unsubstituted amino group or alkylamino group and a substituted or unsubstituted hydroxyl group or hydroxymethyl group in one molecule (the following compound (d) Is referred to as a component) that improves the solderability of the conductive composition. Examples of the compound (d) include o-aminophenol; m-aminophenol; p-aminophenol; N,
N, N-dialkyl derivatives such as N-dimethyl-m-aminophenol and N, N-dibutyl-m-aminophenol; N-β-hydroxyethyl derivatives such as N-β-hydroxyethyl-m-aminophenol; N , N-di-
(Β-Hydroxyethyl) derivative; dimethoxy-, such as 3,3′-dimethoxy-4,4′-diaminobiphenyl
Diaminobiphenyl; 3,3'-dihydroxy-4,
Preferred examples include dihydroxy-diaminobiphenyl and the like such as 4′-diaminobiphenyl and the like.

【0016】前記化合物(d)の配合量は、前記化合物
(c)100重量部に対して、好ましくは2〜50重量
部、特に好ましくは5〜30重量部の範囲である。前記
化合物(d)の配合量が2重量部未満の場合には、前記
化合物(d)を添加することによる所望の効果が得られ
ず、また50重量部を超えると導電性組成物としての物
性に悪影響を及ぼすので好ましくない。
The compounding amount of the compound (d) is preferably 2 to 50 parts by weight, particularly preferably 5 to 30 parts by weight, based on 100 parts by weight of the compound (c). When the compounding amount of the compound (d) is less than 2 parts by weight, the desired effect due to the addition of the compound (d) cannot be obtained, and when it exceeds 50 parts by weight, the physical properties as a conductive composition are obtained. It is not preferable because it adversely affects the

【0017】本発明の導電性組成物を調製するには、例
えば前記(a)銅粉末、(b)熱硬化性樹脂、前記化合
物(c)及び前記化合物(d)を混合し、混練すること
により得ることができる。また前記組成物を調製する際
に、必要に応じて、ブチルカルビトール等の粘度調整
剤、消泡剤、増粘剤、皮はり防止剤等を添加することも
可能である。
To prepare the conductive composition of the present invention, for example, the (a) copper powder, (b) thermosetting resin, the compound (c) and the compound (d) are mixed and kneaded. Can be obtained by When preparing the composition, it is also possible to add a viscosity modifier such as butyl carbitol, an antifoaming agent, a thickener, an anti-skinning agent, etc., if necessary.

【0018】[0018]

【発明の効果】本発明の導電性組成物は、銅及び熱硬化
性樹脂を主成分とするので、従来の銀又は金を主成分と
する導電性組成物に比してコスト的に安価であり、しか
も前記化合物(c)及び前記化合物(d)を含有するた
め、硬化塗膜上に直接半田付けが可能であり、高温、高
湿度の苛酷な環境下においても、優れた導電性を安定的
に得ることができる。従って、例えば本発明の導電性組
成物を絶縁基盤上に焼付け硬化させることにより、導電
性、耐熱性、耐湿性、半田付け性のいずれにも極めて優
れた印刷回路等を製造することができる。
Since the conductive composition of the present invention contains copper and a thermosetting resin as main components, it is less costly than a conventional conductive composition containing silver or gold as a main component. Also, since it contains the compound (c) and the compound (d), it can be directly soldered on the cured coating film, and has excellent conductivity even under severe environment of high temperature and high humidity. Can be obtained Therefore, for example, by baking and curing the conductive composition of the present invention on an insulating substrate, it is possible to manufacture a printed circuit or the like having extremely excellent conductivity, heat resistance, moisture resistance, and solderability.

【0019】[0019]

【実施例】以下本発明を実施例及び比較例により更に詳
細に説明するが、本発明はこれらに限定されるものでは
ない。
The present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

【0020】尚、例中の部は重量部を示す。The parts in the examples are parts by weight.

【0021】[0021]

【実施例1】平均粒径8μmの電解銅粉末85部を、フ
ェノール樹脂(商品名「BLS−364H」昭和高分子
株式会社製、不揮発分65%)15部、ラウロイルサル
コシン100部に、N,N−ジメチル−m−アミノフェ
ノール20部を混合した混合物2.5部及びブチルカル
ビトール5部を充分混合分散させた。次いで得られた組
成物を、150メッシュのステンレススクリーンを用い
て、ガラス−エポキシ基板上に、幅2mm、長さ368
mmの抵抗値測定用パターンを印刷した後、160℃に
保持した恒温槽中で30分間加熱し、焼付け硬化を行な
った。得られた硬化試料について、デジタルマルチメー
タにより初期抵抗値を測定し、また印刷回路の膜厚を測
定して初期比抵抗値を算出した。その結果、初期比抵抗
値は夫々3.0×10~4Ω・cmであった。得られた印
刷回路の硬化塗膜に半田付けを施すため、該基板にロジ
ン系フラックス(商品名「NS−366」日本スペリア
社製)を塗布後、Sn63/Pb37の共晶半田を用
い、230℃の溶融半田槽中に5秒間浸漬し、印刷回路
全面に半田付けを行った。半田コートの厚さは平均15
μmであった。また半田付け後の比抵抗値は、4.0×
10~5Ω・cmであった。化合物(c)の種類、半田濡
れ性、半田コート後の比抵抗値及び化合物(c)と化合
物(d)との重量混合比を表1に示す。
Example 1 85 parts of electrolytic copper powder having an average particle size of 8 μm was added to 15 parts of a phenol resin (trade name “BLS-364H” manufactured by Showa Polymer Co., Ltd., nonvolatile content 65%), 100 parts of lauroyl sarcosine, and N. 2.5 parts of a mixture of 20 parts of N-dimethyl-m-aminophenol and 5 parts of butyl carbitol were thoroughly mixed and dispersed. The resulting composition was then placed on a glass-epoxy substrate using a 150 mesh stainless screen to a width of 2 mm and a length of 368.
After printing the resistance value measuring pattern of mm, it was heated for 30 minutes in a constant temperature bath kept at 160 ° C. to be baked and cured. The initial resistance value of the obtained cured sample was measured with a digital multimeter, and the film thickness of the printed circuit was measured to calculate the initial specific resistance value. As a result, the initial specific resistance values were 3.0 × 10 4 Ω · cm, respectively. In order to apply solder to the cured coating film of the obtained printed circuit, after applying rosin flux (product name “NS-366” manufactured by Nippon Superior Co., Ltd.) to the substrate, Sn63 / Pb37 eutectic solder was used. The printed circuit was entirely soldered by immersing it in a molten solder bath at ℃ for 5 seconds. Average thickness of solder coat is 15
was μm. The specific resistance after soldering is 4.0 x
It was 10 to 5 Ω · cm. Table 1 shows the type of the compound (c), the solder wettability, the specific resistance value after solder coating, and the weight mixing ratio of the compound (c) and the compound (d).

【0022】[0022]

【実施例2〜7、比較例1〜3】ラウロイルサルコシン
にN,N−ジメチル−m−アミノフェノールを混合した
混合物の代わりに、表1に示す化合物3.5部を用いた
以外は、実施例1と同様に組成物を調製し、各測定を行
なった。その結果を表1に示す。
[Examples 2 to 7, Comparative Examples 1 to 3] Examples 2 to 7 and Comparative Examples 1 to 3 were carried out except that 3.5 parts of the compounds shown in Table 1 were used instead of the mixture of lauroyl sarcosine and N, N-dimethyl-m-aminophenol. A composition was prepared in the same manner as in Example 1 and each measurement was performed. The results are shown in Table 1.

【0023】[0023]

【表1】 [Table 1]

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 (a)銅粉末、(b)熱硬化性樹脂、
(c)下記一般式化1(式中(R1)CO−は、炭素数
1〜22のアシル基を示し、R2は水素原子又は炭素数
1〜22のアルキル基若しくはアルケニル基を示す。ま
たnは1〜10の整数を示す)で表わされる化合物及び 【化1】 (d)置換又は非置換のアミノ基又はアルキルアミノ基
と、置換又は非置換の水酸基又はヒドロキシメチル基と
を1分子中に同時に有する芳香族化合物を含有してなる
導電性組成物。
1. (a) Copper powder, (b) Thermosetting resin,
(C) The following general formula 1 (in the formula, (R 1 ) CO— represents an acyl group having 1 to 22 carbon atoms, and R 2 represents a hydrogen atom or an alkyl group or alkenyl group having 1 to 22 carbon atoms. N is an integer of 1 to 10) and a compound represented by the following formula: (D) A conductive composition containing an aromatic compound having at least one substituted or unsubstituted amino group or alkylamino group and a substituted or unsubstituted hydroxyl group or hydroxymethyl group in one molecule.
JP34357591A 1991-12-25 1991-12-25 Conductive composite Pending JPH05174621A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34357591A JPH05174621A (en) 1991-12-25 1991-12-25 Conductive composite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34357591A JPH05174621A (en) 1991-12-25 1991-12-25 Conductive composite

Publications (1)

Publication Number Publication Date
JPH05174621A true JPH05174621A (en) 1993-07-13

Family

ID=18362586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34357591A Pending JPH05174621A (en) 1991-12-25 1991-12-25 Conductive composite

Country Status (1)

Country Link
JP (1) JPH05174621A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015075060A1 (en) * 2013-11-22 2015-05-28 Basf Se Corrosion stabilized copper particles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015075060A1 (en) * 2013-11-22 2015-05-28 Basf Se Corrosion stabilized copper particles

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