JPH0471707B2 - - Google Patents
Info
- Publication number
- JPH0471707B2 JPH0471707B2 JP59142152A JP14215284A JPH0471707B2 JP H0471707 B2 JPH0471707 B2 JP H0471707B2 JP 59142152 A JP59142152 A JP 59142152A JP 14215284 A JP14215284 A JP 14215284A JP H0471707 B2 JPH0471707 B2 JP H0471707B2
- Authority
- JP
- Japan
- Prior art keywords
- polyimide film
- metal foil
- polyimide
- etching
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001721 polyimide Polymers 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 238000005530 etching Methods 0.000 claims description 28
- 239000011888 foil Substances 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 239000004642 Polyimide Substances 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000004080 punching Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14215284A JPS6122937A (ja) | 1984-07-11 | 1984-07-11 | 印刷配線板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14215284A JPS6122937A (ja) | 1984-07-11 | 1984-07-11 | 印刷配線板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6122937A JPS6122937A (ja) | 1986-01-31 |
| JPH0471707B2 true JPH0471707B2 (zh) | 1992-11-16 |
Family
ID=15308567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14215284A Granted JPS6122937A (ja) | 1984-07-11 | 1984-07-11 | 印刷配線板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6122937A (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0686534B2 (ja) * | 1985-10-31 | 1994-11-02 | 三井東圧化学株式会社 | フレキシブルプリント回路基板の製造法 |
| JPH07119087B2 (ja) * | 1987-09-30 | 1995-12-20 | 日立化成工業株式会社 | フレキシブル両面金属張り積層板の製造法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5518426A (en) * | 1978-07-27 | 1980-02-08 | Asahi Chem Ind Co Ltd | Heat-resistant flexible electronic parts |
-
1984
- 1984-07-11 JP JP14215284A patent/JPS6122937A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5518426A (en) * | 1978-07-27 | 1980-02-08 | Asahi Chem Ind Co Ltd | Heat-resistant flexible electronic parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6122937A (ja) | 1986-01-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1022645A (ja) | キャビティ付きプリント配線板の製造方法 | |
| JPH0471707B2 (zh) | ||
| GB2249219A (en) | Manufacturing single sided printed wiring boards | |
| EP0835046B1 (en) | Component mounting board, process for producing the board, and process for producing the module | |
| JP2006100703A (ja) | リジッド−フレキシブル基板及びその製造方法 | |
| JP2864276B2 (ja) | プリント配線基板の製造方法 | |
| JP2749685B2 (ja) | 回路基板の製造方法 | |
| JP2787228B2 (ja) | 可撓性回路基板の製造法 | |
| JP3048360B1 (ja) | 両面プリント配線板およびその製造方法 | |
| JP2000133943A (ja) | 多層基板の製造方法 | |
| JPH01133392A (ja) | プリント配線板の製造方法 | |
| JPS6372192A (ja) | 回路板の製造方法 | |
| JPS58168293A (ja) | プリント配線板の製造方法 | |
| JPH04312995A (ja) | 銅張り積層板の製造方法 | |
| JPH10126058A (ja) | 多層プリント配線板の製造方法 | |
| JPS58154291A (ja) | プリント配線板の製造方法 | |
| JPS588600B2 (ja) | リヨウメンプリントハイセンバンノセイゾウホウホウ | |
| JP2004158672A (ja) | 多層基板の製造方法 | |
| JPS6158294A (ja) | 印刷配線板の製造法 | |
| JP2000244118A (ja) | ビルドアップ多層配線板の製造方法 | |
| JPH0832235A (ja) | 多層プリント配線板の製造方法 | |
| JP2869616B2 (ja) | 回路配線基板の製造法 | |
| JPS6392092A (ja) | 多層配線板の製造方法 | |
| JPH06177539A (ja) | 多層プリント配線板製造方法 | |
| JPH0846322A (ja) | 印刷配線板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |