JPH0470739U - - Google Patents
Info
- Publication number
- JPH0470739U JPH0470739U JP1990113835U JP11383590U JPH0470739U JP H0470739 U JPH0470739 U JP H0470739U JP 1990113835 U JP1990113835 U JP 1990113835U JP 11383590 U JP11383590 U JP 11383590U JP H0470739 U JPH0470739 U JP H0470739U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- circuit board
- resin layer
- hybrid integrated
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990113835U JPH0470739U (enExample) | 1990-10-30 | 1990-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990113835U JPH0470739U (enExample) | 1990-10-30 | 1990-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0470739U true JPH0470739U (enExample) | 1992-06-23 |
Family
ID=31861452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990113835U Pending JPH0470739U (enExample) | 1990-10-30 | 1990-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0470739U (enExample) |
-
1990
- 1990-10-30 JP JP1990113835U patent/JPH0470739U/ja active Pending
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