JPH0470739U - - Google Patents
Info
- Publication number
- JPH0470739U JPH0470739U JP11383590U JP11383590U JPH0470739U JP H0470739 U JPH0470739 U JP H0470739U JP 11383590 U JP11383590 U JP 11383590U JP 11383590 U JP11383590 U JP 11383590U JP H0470739 U JPH0470739 U JP H0470739U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- circuit board
- resin layer
- hybrid integrated
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11383590U JPH0470739U (bs) | 1990-10-30 | 1990-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11383590U JPH0470739U (bs) | 1990-10-30 | 1990-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0470739U true JPH0470739U (bs) | 1992-06-23 |
Family
ID=31861452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11383590U Pending JPH0470739U (bs) | 1990-10-30 | 1990-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0470739U (bs) |
-
1990
- 1990-10-30 JP JP11383590U patent/JPH0470739U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0470739U (bs) | ||
| JPH0375539U (bs) | ||
| JPS6232550U (bs) | ||
| JPS5846453U (ja) | 半導体装置の封止構造 | |
| JPS614436U (ja) | 半導体装置用パツケ−ジ | |
| JPS6169863U (bs) | ||
| JPS5895052U (ja) | 半導体装置 | |
| JPS5895054U (ja) | 半導体装置 | |
| JPS59132641U (ja) | 半導体装置用基板 | |
| JPH0365251U (bs) | ||
| JPS6068652U (ja) | 半導体装置 | |
| JPH01121955U (bs) | ||
| JPS5895046U (ja) | 混成集積回路 | |
| JPS6149453U (bs) | ||
| JPH0165142U (bs) | ||
| JPS6127338U (ja) | 混成集積回路装置 | |
| JPS6157555U (bs) | ||
| JPS6217181U (bs) | ||
| JPH024249U (bs) | ||
| JPS6027444U (ja) | 樹脂封止形半導体装置 | |
| JPS587347U (ja) | 混成集積回路装置 | |
| JPS60125735U (ja) | 多チツプ搭載混成集積回路 | |
| JPH01166565U (bs) | ||
| JPH0189722U (bs) | ||
| JPS6013743U (ja) | 混成集積回路装置 |