JPH0469949A - Method for dividing work - Google Patents

Abstract

PURPOSE:To prevent chips from dispersing by forming grooves through cutting in a first direction a work fixed on a support material with a bonding agent, and by making a filler having a bonding or adhering force flow into the formed grooves, and by cutting thereafter the work in a second direction and then removing the bonding agent and the filler. CONSTITUTION:A work 3 fixed on a support base board 1 with wax 2 is cut in a first direction fully to the extent of eating into a part of the surface of the support base board 1, using the blade of a dicing machine rotated at a high speed. When the cuts of necessary times in the first direction are completed, a filler 5 is made to flow into a plurality of grooves 4 formed by cutting. Then, after turning the direction of the work 3 by 90 degrees, it is cut fully in a second direction orthogonal to the first direction. Thus, by dipping the work 3 in a solvent together with the support base board 1, the wax 2 and the filler 5 are dissolved, and the work 3 is divided into individual chips. Since in this manner, the work 3 is cut in the second direction after filling the grooves 4 with the filler 5, such positional discrepancies due to deformation of the work 3 as the widths of the grooves 4 change, are prevented. Thereby, the stresses applied to the chips are reduced, and the chips can be prevented from dispersing.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for dividing a work such as a semiconductor wafer or a ceramic substrate into microchips such as semiconductor chips or ceramic chips.

(Prior Art) In the manufacture of semiconductor devices, there is a step of forming a large number of semiconductor devices in alignment on one semiconductor wafer and then dividing the semiconductor wafer into individual semiconductor devices. After pasting the semiconductor wafer onto a support material made of materials such as wafers using an adhesive, the semiconductor wafer is completely cut in two orthogonal directions using a dicing machine, etc., to the extent that only a portion of the support material is cut into the chip. I am getting .

Furthermore, Japanese Patent Publication No. 52-34342 discloses that a wafer is fixed on a support table (supporting material) via a first adhesive,
After cutting this wafer into individual chips, the grooves created by this cutting are filled with a second adhesive different from the first adhesive to bond the individual chips, and then the first Melt only the adhesive, take out the chips glued with the adhesive 's2, and paste them onto a tape or the like on which a sticky substance has been formed on the surface. By not melting the second adhesive, a certain positional relationship is established. A method is disclosed for obtaining a group of chips aligned in the following manner.

(Problem to be Solved by the Invention) However, in the conventional chip dividing method, the
Since the semiconductor wafer pasted through the ticing agent is completely cut in two perpendicular directions, if the chip area is small, the contact area with the support material is also small, so the blade rotating at high speed of the tying machine There is a problem in that the chips that have been cut are scattered due to the force received from the blade and the pressure of the cutting water supplied to the blade.

In addition, if a wafer thinner than the normal thickness is used to obtain high-frequency devices, etc., when cutting in the second direction, deformation or positional shift may occur such that the groove width changes due to warping or deflection. This tends to cause stress, and the stress at this time may deteriorate the characteristics of the chip.

This invention was made to solve these problems, and its purpose is to prevent chips from scattering when chips are cut out from a workpiece such as a semiconductor wafer, and to prevent chips from scattering in a second direction perpendicular to the first direction. It is an object of the present invention to provide a dividing method that can reduce the stress applied to chips during cutting and improve the yield when dividing chips.

(Means for Solving the Problems) In order to solve the above problems, a method for dividing a workpiece according to claim 1 provides a method for dividing a workpiece by cutting a workpiece fixed onto a supporting material via an adhesive into a groove in a first direction. The method is characterized in that after pouring a filler having an adhesive or adhesive force into the workpiece, the workpiece is cut in the second direction, and then the adhesive and the filler are removed.

Note that it is desirable to use adhesives and fillers that can be dissolved in the same solvent.

The method for dividing a workpiece according to claim 3 includes cutting a workpiece fixed onto a supporting material via an adhesive in a first direction, and then pasting a film on the surface of the workpiece via an adhesive or a pressure-sensitive adhesive. The method is characterized in that the workpiece to which the film is attached is cut in the second direction, and then the film and the adhesive on the surface of the workpiece are removed.

Note that it is desirable to use adhesives for fixing the workpiece and adhesives or adhesives for pasting the film that are soluble in the same solvent.

(Function) The dividing method according to claim 1 fills the groove formed by cutting in the first direction, and the dividing method according to claim 2 applies a film to the surface of the workpiece after cutting in the first direction. Since the chip is cut in the second direction after being attached, it is possible to prevent chips from scattering.

Furthermore, deformation and positional shift of the workpiece, such as a change in the groove width when cutting in the second direction, are prevented.

In addition, an adhesive for fixing the workpiece on the support material, and
By using adhesives or pressure-sensitive adhesives used for pasting the groove filler or film that are soluble in the same solvent, the removal process can be simplified.

(Example) Hereinafter, an example of the present invention will be described based on the accompanying drawings.

FIG. 1 is a process diagram showing the workpiece dividing method according to claim 1, in which A is a workpiece fixing, B is a first direction cut, C is a groove filling, D is a second direction cut, and E is a dividing method. This figure shows the process of movement.

First, a wax 2 containing an adhesive or adhesive as an adhesive having adhesive force or adhesive force is applied to a support substrate l which is a support material made of a silicon substrate or the like. The wax 2 used is one that softens when heated. While the support substrate 1 and the wax 2 are heated to a temperature at which the viscosity of the wax 2 is sufficiently reduced, a workpiece 3 such as a semiconductor wafer is heated to prevent air bubbles from forming between the workpiece 3 and the support substrate 2, and the wax 2 is After pasting so that the thickness is uniform and as thin as possible, the workpiece 3 is returned to room temperature and fixed on the support substrate 1 (step A).

The workpiece 3 fixed on the support substrate 1 via the wax 2 is cut in the first direction to the extent that a part of the surface of the support substrate 1 is cut using a high-speed rotating blade of a dicing machine (not shown). Make a full cut (Step B).

When the necessary number of cuts in the first direction are completed, the filler 5 is poured into the plurality of holes formed by the cuts (Step C). The filler 5 is made of a resin or the like containing a material having adhesive force or adhesive force, and is cured at room temperature. Further, the filler 5 used is one that can be dissolved with a solvent that dissolves the wax 2.

Note that the filler 5 may be applied not only within the groove 4 but also to cover the surface of the work 3 thinly. In this case, the filler 5 is preferably colorless and transparent so that the surface of the work 3 can be observed.

Next, the direction of the workpiece 3 is rotated by 90 degrees, and the workpiece 3 is fully cut in a second direction perpendicular to the first direction using a dicing machine (not shown) (d).

Then, the workpiece 3 that has been cut in both directions is put into a solvent 6 together with the support substrate 1 to dissolve the wax 2 and filler 5 and separate into individual chips 7. After washing, they are strained through a filter paper 8 and dried. This completes the series of decomposition operations.

As described above, since the cutting in the second direction is performed after filling the groove 4, deformation and displacement of the workpiece 3 that would cause the width of the groove 4 to change is prevented, and the stress applied to the chip 7 is reduced. It is possible to prevent the chip 7 from scattering.

Furthermore, since the wax 2 and the filler 5 are meltable in the same solvent, the chips 7 can be separated in one melting step.

FIG. 2 is a process diagram showing a method for dividing a workpiece according to claim 3.

The work fixing in process A and the cutting in the first direction in process B are the same as those shown in FIG. After pasting the film 9 on the surface of the workpiece 3 that has been cut in the first direction (step C), the workpiece 3 is cut in the second direction from above the film 9 (step D), and then the workpiece 3 is placed in the solvent 6. The film 9 is peeled off and the wax is melted to obtain separated chips 7.

In step C, the film 9 may be attached after applying an adhesive or a pressure-sensitive adhesive to the surface of the workpiece 3, or the film 9 coated with an adhesive or a pressure-sensitive adhesive may be used. The adhesive or adhesive used is one that dissolves in the solvent used in Wax 2.

As described above, after cutting in the first direction, the surface of the workpiece 3 is covered with the film 9 before being cut in the second direction, so it is possible to prevent the chips 7 from scattering, and further,
Deformation and positional shift of the workpiece 3 that would cause the width of the workpiece 3 to change is suppressed.

Furthermore, since the wax 2 for fixing the workpiece 3 and the adhesive or adhesive for attaching the film 9 are meltable in the same solvent, the chips 7 can be separated in one melting step.

(Effects of the Invention) As explained above, the chip dividing method according to the present invention can be applied to the workpiece surface after filling the grooves formed by cutting in the first direction or after cutting in the first direction. Since cutting in the second direction is performed after the film is pasted, it is possible to prevent chips from scattering.

Further, since the deformation and positional shift of the workpiece that would cause the groove width to change when cutting in the second direction is suppressed, the stress applied to the chip is reduced, and the yield when dividing the chip can be improved.

In addition, the adhesive used to fix the workpiece to the supporting material and the adhesive or adhesive used when pasting the groove filler or film are soluble in the same solvent, simplifying the removal process. , the work time can be shortened.

[Brief explanation of drawings]

FIG. 1 is a process diagram showing a method for dividing a workpiece according to a first aspect, and FIG. 2 is a process diagram showing a method for dividing a workpiece according to a second aspect. DESCRIPTION OF SYMBOLS 1... Supporting substrate which is a supporting material, 2... Wax which is an adhesive having adhesive force or adhesive force, 3... Workpiece, 4... Groove, 5... Filler, 6...・Solvent, 7
...chip, 9...film. Patent applicant: Honda Motor Co., Ltd. Agent
Person Patent Attorney Part 2 1) Yong-Immediate Question Patent Attorney
Kuni Ohashi Opened the store Patent attorney Kuni
Mountain, there is a school that despises ω φ 田

Claims (4)

[Claims] (1) A work fixed on a support material via an adhesive having adhesive force or adhesive force is cut in the first direction, and a filler material having adhesive force or adhesive force is poured into the groove formed by this cut. After that, the workpiece is cut in a second direction, and then the adhesive and the filler are removed. (2) The workpiece dividing method according to claim 1, wherein the adhesive and the filler are dissolved in the same solvent. (3) After cutting in the first direction the workpiece fixed on the supporting material via an adhesive having adhesive force or adhesive force, a film is pasted on the surface of the workpiece via the adhesive or adhesive; A method for dividing a workpiece, comprising cutting a workpiece to which a film is attached in a second direction, and then removing the film and removing the adhesive. (4) The method for dividing a workpiece according to claim 3, wherein the adhesive for fixing the workpiece and the adhesive or pressure-sensitive adhesive for pasting the film are soluble in the same solvent.