JP2015028981A - Processing method for laminate plate object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to satisfactorily perform a cutting process by suppressing detachment of a laminate plate object that is liable to separate in layers during cutting it into individual pieces.SOLUTION: After a first resin bonding step is performed, a first cut-groove formation step is carried out to form first cut grooves 7 in a laminate plate object 1. Then, a second resin filling step is performed, thereby filling the first cut grooves 7 with second resin 8 not to change a cured state of first resin 6. Accordingly, when the second resin 8 is cured, all the first cut grooves 7 can be filled with the second resin 8 without softening the first resin 6. When a second cut-groove formation step is performed after the second resin filling step being performed, the first cut grooves 7 formed orthogonal to a second dividing line 3 have been filled with the second resin 8. Therefore, when a cutting blade 22 cuts the laminate plate object 1, movement of chips 4 inside the laminate plate object 1 to which the first resin 6 has not been applied can be suppressed.

Description

  The present invention relates to a cutting method for cutting a laminated plate-like object that is bonded and fixed to a support substrate with a resin.

  In the case of cutting a plate-like object or a hard-to-cut material with severe warping with a cutting blade or the like, for example, after fixing the plate-like object with a resin to a support substrate such as a rigid plate, the plate-like object is cut. Is going. In this way, when a plate-like object is attached to the support substrate via the resin, and the resin is cured and fixed, the holding force of the plate-like object on the support substrate becomes stronger compared to, for example, only fixing by dicing tape. Therefore, even a difficult-to-cut material such as sapphire can be processed (see, for example, Patent Document 1 below).

JP 2000-182997 A

  However, for example, in the case of a laminated plate formed from a large number of laminates such as mica ceramics, there is a problem in that the laminate is peeled off when cut into pieces due to the influence of cutting water or a cutting load. There is.

  The present invention has been made in view of the above circumstances, and the solution of the invention is to suppress the separation of the laminated plate-like material when cutting into individual pieces and to perform cutting well. There are issues to be addressed.

The present invention relates to a laminated plate-like object formed by laminating a plurality of or single material members, and a plurality of first division schedule lines and a plurality of second division schedules orthogonal to the first division schedule lines. A method of processing a laminated plate that is cut along a line with a cutting blade and divided into individual chips. The first resin is applied to a rigid substrate and placed on the back side of the laminated plate facing each other. Then, after the first resin is cured and the laminated resin sheet is adhered and fixed on the rigid substrate, and the first resin adhesive process is performed, the laminated resin sheet A first cutting groove forming step in which a plurality of first cutting grooves are formed by cutting along the first division line by cutting from the surface side of the object to the rigid substrate with a cutting blade; and the first cutting groove After performing the forming process, the second resin is raised up to the surface of the laminated plate-like object in the first cutting groove. After carrying out the second resin filling step of filling and curing, and the second resin filling step, cut into the rigid substrate with a cutting blade from the surface side of the laminated plate-like material to the second division line A second cutting groove forming step of cutting a plurality of second cutting grooves along,
A resin peeling step of removing the first resin and the second resin from the rigid substrate to obtain individual chips after performing the second cutting groove forming step, The second resin is a resin that does not change the cured state of the first resin when the first cutting groove is filled.

  When the first resin and the second resin are thermoplastic, the softening point of the second resin is lower than the softening point of the first resin.

  When at least one of the rigid substrate and the laminated plate is formed of a material that transmits ultraviolet rays, and the first resin and the second resin are ultraviolet curable liquid resins, In the resin adhering step, the first resin is irradiated with ultraviolet rays and cured to adhere the laminated plate-like material onto the rigid substrate, and after performing the first cutting groove forming step, the second In the resin filling step, the second resin is poured into the first cutting groove, filled, and irradiated with ultraviolet rays to be cured.

  In the present invention, after the first cutting groove forming step is performed and the first cutting groove is formed in the laminated plate-like product, the second resin filling step is performed and the second cutting resin is formed in the first cutting groove. Fill. Therefore, after that, when the second cutting groove forming step is carried out, the second resin is filled in the first cutting groove formed orthogonal to the second scheduled dividing line, and Since the second resin is a resin that does not change the cured state of the first resin when the second resin is filled, the laminate is used when the cutting blade cuts into the laminate in the second cutting groove forming step. It is possible to suppress the movement of the chip to which the first resin on the inside of the object is not attached. Therefore, when the laminated plate-like material is separated into individual chips, peeling of the laminated body constituting the laminated plate-like material can be prevented, and cutting can be performed satisfactorily.

In the present invention, the thermoplastic resin is used as the first resin and the second resin resin, and the second resin is filled by using a resin that does not soften the first resin at the softening point of the second resin. It is possible to reliably prevent the first resin from being softened during the process. In addition, when an ultraviolet curable liquid resin is used as the first resin and the second resin, the second resin is filled as described above. The second resin can be filled in all of the first cutting grooves without softening the first resin during the process.

It is a perspective view which shows the structure of a laminated plate-shaped object, a chuck table, and a cutting means. It is sectional drawing which shows a 1st resin sticking process. It is sectional drawing which shows a 1st cutting groove formation process. It is sectional drawing which shows a 2nd resin filling process. It is sectional drawing which shows a 2nd cutting groove formation process.

  Below, the process which divides | segments a laminated plate-shaped object into each chip | tip is demonstrated, referring attached drawing.

1 First Embodiment A chuck table 10 shown in FIG. 1 has a holding surface 11 for holding a laminated plate-like object, can rotate and move in the X-axis direction, and the periphery of the chuck table 10 is covered by a cover 12. Covered. The cutting means 20 includes at least a spindle 21 that is disposed in parallel to the holding surface 11 of the chuck table 10 and has an axis in the Y-axis direction, and a cutting blade 22 that is attached to the tip of the spindle 21. When the spindle 21 rotates at a predetermined rotation speed, the cutting blade 22 can be rotated at a predetermined rotation speed.

(1) 1st resin sticking process As shown in FIG.1 and FIG.2, the laminated board 1 is stuck to the rigid board | substrate 5 with the 1st resin 6. FIG. The laminated plate-like object 1 is formed by laminating a plurality of or single material members. The laminated plate 1 is, for example, mica ceramics. The laminated plate 1 shown in FIG. 1 has a chip 4 in each region partitioned by a first scheduled division line 2 and a second scheduled division line 3 orthogonal to the first planned division line 2. Have. Further, at least one of the laminated plate 1 and the rigid substrate 5 is formed of a material that transmits ultraviolet rays. As the first resin 6, an ultraviolet curable liquid resin is used. The ultraviolet curable first resin 6 has a property of swelling when immersed in warm water.

  As shown in FIG. 2, the first resin 6 is applied to the upper surface of the rigid substrate 5, the back surface 1 b side of the laminated plate 1 is opposed to the upper surface of the rigid substrate 5, and is buried in the first resin 6. The laminated plate 1 is pressed and placed until the first resin 6 rises up to the surface 1a of the laminated plate 1 over the entire circumference of the laminated plate 1. Thereafter, ultraviolet rays are irradiated toward the first resin 6 from above the laminated plate 1 or below the rigid base 5 by ultraviolet irradiation means (not shown) to cure the first resin 6 and laminate the laminated plate. The object 1 is adhered and fixed to the rigid substrate 5. When only the laminated plate 1 is formed of a material that transmits ultraviolet rays, the ultraviolet rays are irradiated from above the laminated plate 1. On the other hand, when only the rigid substrate 5 is formed of a material that transmits ultraviolet rays, the ultraviolet rays are irradiated from below the rigid substrate 5. When both the laminated plate 1 and the rigid substrate 5 are formed of a material that transmits ultraviolet rays, ultraviolet rays are irradiated from either or both of the upper side of the laminated plate 1 and the lower side of the rigid substrate 5. Then, the first resin 6 is cured, and the first resin 6 is raised so as to surround the entire outer periphery of the laminated plate 1, so that a laminated body such as mica ceramics constituting the laminated plate 1. Is fixed so that it does not move.

(2) First cutting groove forming step After performing the first resin adhering step, the first cutting groove forming step 2 is adhered and fixed to the rigid substrate 5 so that the first division line 2 shown in FIG. 1 faces the X-axis direction. The laminated plate 1 is placed on the holding surface 11 of the chuck table 10, and the laminated plate 1 is sucked and held on the holding surface 11 of the chuck table 10 by a suction source (not shown).

  Next, the chuck table 10 is moved in the X-axis direction, and the cutting means 20 is lowered in the Z-axis direction while the cutting blade 22 is rotated by the rotation of the spindle 21. Then, as shown in FIG. 3 (a), the cutting blade 22 is cut from the surface 1a of the laminated plate 1 to the rigid substrate 5, and the first divided scheduled line 2 shown in FIG. The first cutting groove 7 is formed by cutting along.

  Next, every time when the cutting blade 22 cuts the first scheduled dividing line 2 in a row to form the first cutting groove 7, the cutting blade 22 is indexed in the Y-axis direction, and all the first scheduled divisions are performed. The same cutting is repeated along the line 2. Thus, as shown in FIG. 3B, a plurality of first cutting grooves 7 are formed in the laminated plate 1.

(3) Second resin filling step After performing the first cutting groove forming step, the second resin supply nozzle 30 capable of flowing out the liquid resin is formed in a laminated plate shape as shown in FIG. The first cutting groove 7 formed in the article 1 is moved above. The second resin supply nozzle 30 flows out of the second resin 8 and fills the inside of the first cutting groove 7 until the second resin 8 rises to the surface 1 a of the laminated plate 1. For example, an ultraviolet curable liquid resin can be used as the second resin 8. This ultraviolet curable second resin 8 has a property of swelling when immersed in warm water.

  Next, ultraviolet rays are irradiated from above the laminated plate 1 or below the rigid base 5 toward the second resin 8 by an ultraviolet irradiation means (not shown) as in the first resin sticking step. To cure. At this time, the first resin 6 has already been cured, and the cured state of the first resin 6 does not change due to the ultraviolet irradiation for curing the second resin 8, so that the laminated plate 1 can move. Absent. In this way, when the second resin 8 is filled in all of the first cutting grooves 7 and the second resin 8 is cured, the first resin 6 of the laminated plate 1 shown in FIG. The inner part that is not worn is fixed by the second resin 8.

(4) Second cutting groove forming step After performing the second resin filling step, the laminated plate 1 is cut by the same operation as the first cutting groove forming step. That is, the laminated plate 1 adhered and fixed to the rigid substrate 5 is placed on the holding surface 11 of the chuck table 10 so that the second scheduled division line 3 shown in FIG. The laminated plate 1 is sucked and held on the holding surface 11 of the chuck table 10 by a suction source (not shown). Then, the cutting blade 22 shown in FIG. 3 (a) is cut from the surface 1a of the laminated plate 1 to the rigid substrate 5, and as shown in FIG. 5 (a), all of the cutting blade 22 is rotated by the rotating cutting blade 22. Cutting along the second division line 3. Then, as shown in FIG. 5 (b), a plurality of second cutting grooves 9 are formed in the laminated plate 1.

  When the cutting blade 22 cuts the laminated plate 1 along the second division line 3, the second resin 8 is filled in the first cutting groove 7 orthogonal to the second division line 3. Therefore, it is possible to suppress the movement of the chip 4 inside the laminated plate 1 to which the first resin 6 is not adhered when the cutting blade 22 cuts the laminated plate 1.

(5) Resin peeling process After implementing the 2nd cutting groove formation process, the laminated plate-shaped object 1 stuck and fixed to the rigid board | substrate 5 is immersed in warm water. Then, the first resin 6 and the second resin 8 swell, and the divided individual chips 4 can be easily peeled from the rigid substrate 5.

  As described above, in the first embodiment, by using an ultraviolet curable resin as the first resin 6 and the second resin, the cured state of the first resin does not change in the second resin filling step. For this reason, the laminated plate 1 does not move. And when performing the 2nd cutting groove formation process, since the 2nd resin 8 is filled in the 1st cutting groove 7 formed orthogonally to the 2nd division | segmentation scheduled line 3, it cuts. When the blade 22 cuts the laminated plate 1, it is possible to suppress the movement of the chip 4 inside the laminated plate 1 to which the first resin 6 is not adhered. Thereby, when the laminated plate-like object 1 is separated into individual chips 4, peeling of the laminated body constituting the laminated plate-like object 1 can be prevented, and cutting can be performed satisfactorily.

2 Second Embodiment A thermoplastic resin may be used as the first resin used in the first resin sticking step and the second resin used in the second resin filling step. In this case, the softening point of the second resin is lower than the softening point of the first resin. For example, the first resin is a resin having a softening point of 200 ° C., and the second resin is a resin having a softening point of 70 ° C.

(1) 1st resin sticking process The 1st resin 6a is apply | coated to the upper surface of the rigid board | substrate 5 by heating and softening the thermoplastic 1st resin 6a shown in FIG. The back surface 1 b side of the sheet 1 is made to face the upper surface of the rigid substrate 5 and is buried in the first resin 6 a, and the first resin 6 a extends over the entire outer periphery of the laminate plate 1 to the surface 1 a of the laminate plate 1. The laminated plate-like object 1 is pressed and placed until it rises to the top. Then, the 1st resin 6a is hardened by cooling the 1st resin 6a and removing heat, and the laminated board 1 is stuck and fixed to the rigid substrate 5.

(2) First cutting groove forming step After performing the first resin adhering step, as in the first embodiment, the cutting blade 22 is lowered in the Z-axis direction while rotating, as shown in FIG. As shown, the cutting blade 22 is cut by cutting from the surface 1a of the laminated plate 1 to the rigid substrate 5, and each time the first cutting groove 7 is formed, the cutting blade 22 is indexed in the Y-axis direction. Then, the same cutting as described above is repeated along all the first scheduled division lines 2. Thus, as shown in FIG. 3B, a plurality of first cutting grooves 7 are formed in the laminated plate-like object 1.

(3) Second resin filling step After performing the first cutting groove forming step, the thermoplastic second resin 8a shown in FIG. 4 (b) is softened by heating at 70 ° C. All the grooves 7 are filled with the second resin 8a. At this time, since the softening point of the first resin 6a is 200 ° C., even if the second resin 8a is heated at 70 ° C., the first resin 6a in the vicinity of the second resin 8a is cured. It does not change state. Therefore, the laminated plate 1 does not move in this step.

(4) Second cutting groove forming step After performing the second resin filling step, the laminated plate 1 is cut by the same operation as the first cutting groove forming step. As shown in FIG. 5 (a), cutting is performed along all the second scheduled dividing lines 3 by a rotating cutting blade 22, and a plurality of second plates are formed on the laminated plate-like object 1 as shown in FIG. 5 (b). Two cutting grooves 9 are formed. At this time, since the second resin 8a is filled in the first cutting groove 7 orthogonal to the second scheduled dividing line 3, the first resin is cut when the cutting blade 22 cuts the laminated plate-like object 1. It is possible to suppress the movement of the chip 4 inside the laminated plate 1 to which 6a is not attached.

(5) Resin peeling step After performing the second cutting groove forming step, the first resin 6a and the second resin 8a are softened by heating to a temperature equal to or higher than the softening point of the first resin 6a. The individual chips 4 divided from the rigid substrate 5 are removed.

  As described above, in the second embodiment, the first resin 6a and the second resin 8a having thermoplasticity are used, and the first resin 6a is not softened at the softening point of the second resin 8a. For use, when filling the first cutting groove 7 with the second resin 8a in the second resin filling step and curing it, the first cutting groove 7 is not softened without softening the first resin 6a. All can be filled with the second resin 8a. And when implementing the 2nd cutting groove formation process, since the 2nd resin 8a is filled in the 1st cutting groove 7 formed orthogonally to the 2nd division | segmentation scheduled line 3, it cuts. When the blade 22 cuts the laminated plate 1, it is possible to suppress the movement of the chip 4 inside the laminated plate 1 to which the first resin 6 a is not attached. Thereby, when the laminated plate-like object 1 is separated into individual chips 4, peeling of the laminated body constituting the laminated plate-like object 1 can be prevented, and cutting can be performed satisfactorily.

1: Laminated plate-like material 2: First division planned line 3: Second division planned line 4: Chip 5: Rigid substrate 6, 6a: First resin 7: First cutting groove 8, 8a: Second Resin 9: Second cutting groove 10: Chuck table 11: Holding surface 12: Cover 20: Cutting means 21: Spindle 22: Cutting blade 30: Second resin supply nozzle

Claims (3)

A laminated plate-like object formed by laminating a plurality of or single material members, along a plurality of first division lines and a plurality of second division lines orthogonal to the first division lines. A method of processing a laminated plate-like material that is cut with a cutting blade and divided into individual chips,
A first resin is applied to a rigid substrate and placed with the back side of the laminated plate facing each other, and the first resin is cured and the laminated plate is stuck and fixed on the rigid substrate. Resin pasting process,
After performing the first resin adhering step, a plurality of first cutting grooves are formed by cutting from the surface side of the laminated plate-like object to the rigid substrate with a cutting blade and cutting along the first division line. A first cutting groove forming step to be formed;
After performing the first cutting groove forming step, a second resin filling step of filling and curing the second resin in the first cutting groove until it rises up to the surface of the laminated plate-like object;
After carrying out the second resin filling step, a plurality of second cutting grooves are formed by cutting from the surface side of the laminated plate-like object to the rigid substrate with a cutting blade and cutting along the second division line. A second cutting groove forming step,
After performing the second cutting groove forming step, a resin peeling step of removing the first resin and the second resin from the rigid substrate to obtain individual chips, and
The second resin is a resin that does not change the cured state of the first resin when the second resin is filled in the first cutting groove. Method.   The laminated plate shape according to claim 1, wherein the first resin and the second resin are thermoplastic, and the softening point of the second resin is lower than the softening point of the first resin. Processing method of things. At least one of the rigid substrate and the laminated plate is formed of a material that transmits ultraviolet rays, and the first resin and the second resin are ultraviolet curable liquid resins,
In the first resin sticking step, the first resin is irradiated with ultraviolet rays to be cured, and the laminate is stuck on the rigid substrate,
After performing the first cutting groove forming step, in the second resin filling step, filling the second cutting resin into the first cutting groove and irradiating it with ultraviolet rays and curing it. The method for processing a laminated plate-like product according to claim 1, wherein:

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