JPS61135710A - Method of dicing semiconductor wafer - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field to which the invention pertains]

The present invention relates to a semiconductor wafer dicing method for dividing devices from a semiconductor wafer during a semiconductor device manufacturing process.

[Prior art and its problems]

A dicing method is known as a method for dividing a semiconductor wafer on which a plurality of semiconductor elements are fabricated into individual elements. In this method, as shown in FIG. 2, a semiconductor wafer 1 is adhered to an adhesive sheet 2 and fixed by suction on a support 3, and a cut 4 is made using a diamond blade rotating at high speed until it reaches the adhesive sheet 2. This is a method of completely dividing the However, in this case, if there are air bubbles on the adhesive surface between the wafer 1 and the adhesive sheet 2, the chips may be scattered during the dicing operation, and in order to separate the chips 11 attached to the adhesive sheet 2', it is necessary to peel them off by force. One possible method is to dissolve the adhesive using a solvent, but when removed, adhesive residue may be left on the chip 11 as shown in FIG. 3. may remain, resulting in deterioration of device characteristics and poor conduction. On the other hand, even if a solvent is used, there is a problem that it is difficult to obtain an adhesive that completely dissolves in the solvent.

[Purpose of the invention] The present invention solves the above-mentioned problems and provides a semiconductor wafer that can be completely divided into chips without having to deal with the logic of chips during processing, and without degrading characteristics or causing conduction defects due to residual adhesive on elements after division. The purpose is to provide a dicing method. [Key points of the invention]

According to the present invention, a semiconductor wafer is fixed to a fixing plate via a thin spacer using wax melted by heating as an adhesive,
The above objective is achieved by fixing the fixing plate on a support and using a dicing plate to make cuts that reach the spacer.

[Practice of the invention, examples]

FIG. 1 shows the state of an embodiment of the present invention after cutting, in which a semiconductor wafer l is first cut into a wafer of 0.1 to 0.5 m.
Sandwich the filter spacer 6 using paper or the like having a certain thickness,
Wax 7 melted by heating is used as adhesive on both sides to adhere to the fixed plate 8. For fixing [8], for example, a glass plate with a flat surface and a uniform thickness or an easily available glass plate is used. Thereafter, the fixing plate 8 is suctioned and fixed to the support base 3, and the slits 4 are inserted into the spacers 6 using a dicing plate (not shown) to completely cut the wafer 1. The separation of the chip 11 from the spacer 6 and fixing plate 8 caused by the cut 4 can be easily achieved by dissolving the wax 7 with a heated organic solvent, such as trichloride, and washing it. Will not stick. The wax used as the adhesive melts at a heat of about 100 degrees and has fluidity, so that the spacer 6 and the wafer 1 can be bonded without leaving any air bubbles between them. Furthermore, by adhering the spacer 6 to the wafer 1 in advance, bubble-free adhesion can be achieved between the wafer 1 and the spacer 6, and by using the spacer 6, the dicing plate does not need to be cut into the fixing plate 8 (wafer It is possible to completely cut the dicing plate, extending the life of the dicing plate.
The fixed plate 8, which requires a high degree of flatness and uniform thickness, can be used repeatedly, resulting in cost reduction. [Effects of the Invention] The present invention uses wax to bond a semiconductor wafer to be diced onto a support stand of a dicing device, for example, onto a fixing plate that can be fixed by suction, using a thin spacer.
By using wax that becomes highly fluid when melted by heating and by using a spacer, bubble-free bonding is possible, which prevents chips from scattering during cutting. The wax used in the adhesive can be easily remelted by heating, making it easy to change the pasting process, and it can also be completely removed using an organic solvent when making chips, making it possible to create high-quality products without deteriorating device characteristics. Semiconductor chips can be created.

[Brief explanation of drawings]

FIG. 1 shows the state after cutting in an embodiment of the present invention 1: semiconductor wafer, 3: support stand, 4: cut, 6: spacer, 7
: Wax, 8: Fixed plate. Figure 2 Third cause

Claims (1)

[Claims] 1) A semiconductor wafer is heated and melted using wax as an adhesive to adhere to a fixing plate via a thin spacer, the fixing plate is fixed on a support stand, and a cut is made to reach the spacer using a dicing plate. A semiconductor wafer dicing method.