JP3282199B2 - Method of manufacturing magnetic head chip - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a magnetic head chip which is the basis of a magnetic head used for a magnetic disk device or a video tape recorder as an auxiliary storage device of a computer.

[0002]

2. Description of the Related Art In recent years, devices using a magnetic head, such as a magnetic disk device and a video tape recorder, have rapidly spread, and the demand for the magnetic head has increased. There is a strong demand for improved performance.

Hereinafter, a conventional magnetic head chip will be described. FIG. 3 is an external perspective view of a conventional magnetic head chip.

[0004] 1 is a magnetic head chip manufactured by processing a magnetic material or the like, a is the first side surface of the magnetic head chip 1, b is
Is a second side surface of the magnetic head chip 1.

A method of manufacturing the conventional magnetic head chip having the above-described structure will be described below with reference to FIG.

FIG. 4A is a schematic view showing a polishing step of a first side of a conventional magnetic head chip, and FIG. 4B is a front view of the magnetic head chip with the first side removed from a post-polishing processing jig. FIG. 4C is a schematic view showing a polishing step of the second side surface.

First, as shown in FIG. 4A, the second side surfaces b of the individual magnetic head chips 1 indicated by dotted lines are bonded onto a processing jig 2 using a heat-softening adhesive 3. Then, the exposed first side surface a of the magnetic head chip 1 is polished.

Next, as shown in FIG. 4 (b), the magnetic head chip 1 is removed from the processing jig 2, and FIG.
As shown in FIG. 3, the individual magnetic head chips 1 indicated by the dotted lines are inverted, and the polished first side face a is made of the heat-softening adhesive 3.
Is adhered onto the processing jig 2 by using an unpolished second side surface b.
Is polished, and the polishing of both side surfaces of the magnetic head chip 1 is completed.

[0009]

However, in the above conventional configuration, after polishing one side of the magnetic head chip,
Once the magnetic head chips are individually removed from the processing jig, the magnetic head chips are flipped over, and then individually adhered to the processing jig again, and the other side of the magnetic head chips is polished. It is time-consuming, requires many production steps, has poor workability, and raises costs. In addition, when the magnetic head chip is bonded to the processing jig again, it is necessary to individually check whether the correctly polished surface is the bonding surface to the processing jig, and there is a problem in that it is complicated and lacks productivity. .

The present invention solves the above-mentioned conventional problems, in which a plurality of magnetic head chips can be removed from a processing jig, inverted, and re-adhered to the processing jig at once. It is an object of the present invention to provide a method of manufacturing a magnetic head chip having extremely high productivity and workability with a small number of man-hours, low cost, and excellent mass productivity.

[0011]

To achieve this object, a magnetic head having a first side and a second side to be polished is provided.
First, the first side faces the first processing jig
Bonding via a first heat-softening adhesive so that
Polishing the second side of the head chip and then polishing the second side
The second surface having a higher melt viscosity than the first heat-softening adhesive
The second processing jig is joined via the heat-softening adhesive,
By heating to a certain temperature, the first processing jig moves
And peel off the chip, and use it as a second processing jig.
Magnetic head so that the second side faces the second processing jig.
A method for manufacturing a magnetic head chip according to claim 2, wherein the melt viscosity difference is at least 10 cp, preferably at least 20 cp. The above configuration is provided. here,
As the heat-softening adhesive, wax mixed with rosin or dense wax (trade name: Electron Wax, Nikka Seiko Co., Ltd.) or the like is used.

[0012]

With this configuration, after polishing one side surface of the magnetic head chip on the first processing jig, each magnetic head chip is collectively moved to the second processing jig only by heating. The other side of the magnetic head chip can be polished on the second processing jig.

[0013]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1A is a schematic view showing a polishing step of a first side surface of a magnetic head chip according to an embodiment of the present invention, and FIG. FIG. 2 is a schematic view showing a step of adhering to a first side surface of FIG.
FIG. 1C is a schematic diagram illustrating a peeling step of a first processing jig, and FIG. 1D is a schematic diagram illustrating a polishing step of a second side surface.

Numeral 1 denotes a magnetic head chip, a denotes a first side surface of the magnetic head chip 1, and b denotes a second side surface of the magnetic head chip. Omitted. Reference numeral 4 denotes a first processing jig for fixing the magnetic head chip 1 when the first side surface a of the magnetic head chip 1 is polished, and reference numeral 5 denotes a bonding of the magnetic head chip 1 on the first processing jig 4. A first thermo-softening adhesive 6 having a low melt viscosity, 6 is a second processing jig for fixing the magnetic head chip 1 when polishing the second side surface b of the magnetic head chip 1, 7
Is a second heat-softening adhesive which adheres the magnetic head chip 1 onto the second processing jig 6 and has a high melt viscosity.

First, in FIG. 1 (a), the second side surface b of each magnetic head chip 1 indicated by a dotted line is applied to the first side using a first heat-softening adhesive 5 applied thinly and uniformly. On the processing jig 4. Next, the first side surface a is polished.

Next, in FIG. 1B, the first processing jig 4 is turned over, and the first thermosoftening adhesive 5 is heated and melted. On the other hand, a second heat-softening adhesive 7 having a higher melt viscosity than the first heat-softening adhesive is applied on the second processing jig 6, and the second heat-softening adhesive 7 is applied. Heating at a temperature equal to or lower than the heating temperature of the first heat-softening adhesive 5;
Let melt. Next, the second processing jig 6 is bonded to the polished first side surface a of the magnetic head chip 1 via the second thermosoftening adhesive 7.

Next, in FIG. 1C, the first processing jig 4 is moved upward. Here, since the melt viscosity of the second heat-softenable adhesive 7 is larger than the melt viscosity of the first heat-softenable adhesive 5, the first processing jig 4 is attached to the second side surface b of the magnetic head chip 1. Peel from On the other hand, the magnetic head chip 1 is adhered on the second processing jig 6.

Finally, in FIG. 1D, the unpolished second side surface b of the magnetic head chip 1 is polished, and the polishing of both side surfaces of the magnetic head chip 1 is completed.

The characteristics of the heat-softening adhesive used in this embodiment will be described below. FIG. 2 is a graph showing the relationship between the temperature and the melt viscosity of the thermosoftening adhesive.

C is the first heat-softening adhesive 5 having a low melt viscosity.
And d is the characteristic curve of the second heat-softening adhesive 7 having a high melt viscosity.
E is the softening point of the first heat-softening adhesive 5 at which the first heat-softening adhesive 5 starts to melt, f is the softening point of the second heat-softening adhesive 7, and g is the operable temperature range indicated by the hatched portion. is there.

As is apparent from FIG. 2, if the melting temperature of the second heat-softening adhesive 7 is set to the same temperature as the melting temperature of the first heat-softening adhesive 5, the heat is reduced by one heat source. The one heat-softening adhesive 5 and the second heat-softening adhesive 7 can be heated simultaneously, and the production cost can be reduced. If the melting temperature of the second heat-softening adhesive 7 is set to a temperature lower than the melting temperature of the first heat-softening adhesive 5,
It can be seen that the difference between the melt viscosities of the first heat-softening adhesive 5 and the second heat-softening adhesive 7 increases, and the workability can be improved. If the temperature at which the second thermosoftening adhesive 7 is melted is set to a temperature higher than the temperature at which the first thermosoftening adhesive 5 is melted, the first thermosoftening adhesive 5 and the second Although the difference in melt viscosity from the heat-softening adhesive 7 is small and the workability is deteriorated, it is not preferable. However, even in this case, the melt viscosity of the second heat-softening adhesive 7 is lower than the first. 1 less than the melt viscosity of the heat-softening adhesive 5
If it is higher than 0 cp, preferably higher than 20 cp, the work can be easily performed.

In this embodiment, two types of heat-softening adhesives are used and the difference in melt viscosity is used. As is apparent from FIG. 2, the same type of heat-softening adhesive is used. Also, since the melt viscosity can be adjusted by raising and lowering the temperature, the first heat-softening adhesive 5 and the second heat-softening adhesive 7 are made the same type of heat-softening adhesive, and the second heat-softening adhesive is used. The melting temperature of the adhesive 7 may be lower than the melting temperature of the first thermo-softening adhesive 5 so as to have a difference in melt viscosity. in this case,
Since only one heat-softening adhesive is required, the production cost can be reduced.

As described above, according to the present embodiment, the removal, reversal, and re-adhesion of the magnetic head chip from the processing jig to the processing jig can be performed collectively.

[0025]

As described above, the present invention provides a first polishing method.
First, a magnetic head chip having a side and a second side
The first heat is applied so that the first side faces the first processing jig.
Bonded via a softening adhesive, the second of the magnetic head chip
Side is polished, and then the second side is first heat-softened.
Via a second heat-softening adhesive having a higher melt viscosity than the adhesive
To join the second processing jig and heat it to a predetermined temperature
The magnetic head chip is peeled off from the first processing jig.
And the second side surface of the second processing jig
Is the magnetic head chip stuck so as to face the processing jig
Then, the first side surface is polished, so that a plurality of magnetic head chips can be removed from the processing jig, inverted,
The present invention can realize a method of manufacturing a magnetic head chip excellent in mass productivity, which can perform re-adhesion to a processing jig in a lump and can significantly reduce production steps and production costs.

[Brief description of the drawings]

FIG. 1A is a schematic view showing a polishing step of a first side surface of a magnetic head chip according to an embodiment of the present invention. FIG. 1B is a view showing a bonding step of a second processing jig according to an embodiment of the present invention. Schematic diagram (c) Schematic diagram showing a peeling step of a first processing jig in one embodiment of the present invention (d) Schematic diagram showing a polishing process of a second side surface of a magnetic head chip in one embodiment of the present invention

FIG. 2 is a graph showing the relationship between the temperature and the melt viscosity of the thermosoftening adhesive.

FIG. 3 is an external perspective view of a conventional magnetic head chip.

FIG. 4A is a schematic view showing a polishing step of a first side surface of a conventional magnetic head chip. FIG. 4B is a front view of the magnetic head chip with the conventional first side surface removed from a post-polishing processing jig. Schematic diagram showing a polishing process of the second side surface of the conventional magnetic head chip

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 magnetic head chip 2 conventional processing jig 3 conventional heat-softening adhesive 4 first processing jig 5 first heat-softening adhesive 6 second processing jig 7 second heat-softening A. First side of magnetic head chip b. Second side of magnetic head chip c. Characteristic curve of first thermo-softening adhesive d. Characteristic curve of second thermo-softening adhesive e. Softening point of adhesive f Softening point of second heat-softening adhesive g Working temperature range

Claims (2)

(57) [Claims] 1. A polishing machine having a first side and a second side to be polished.
The magnetic head chip is first processed by the first side surface.
Via the first heat-softening adhesive so as to face the jig
Bonding, polishing the second side surface of the magnetic head chip,
Then, the first heat-softening adhesive is applied to the second side surface.
Through a second heat-softening adhesive having a high melt viscosity.
By joining the processing jigs and heating them to a predetermined temperature,
The magnetic head chip was peeled off from the first processing jig.
And the second side face is attached to the second processing jig.
So that the magnetic head faces the second processing jig.
A method of manufacturing a magnetic head chip, comprising: attaching a chip, and then polishing the first side surface. 2. The method according to claim 1, wherein the difference in melt viscosity is 10 cp or more, preferably 20 cp or more.