JPH0469838B2 - - Google Patents
Info
- Publication number
- JPH0469838B2 JPH0469838B2 JP62250573A JP25057387A JPH0469838B2 JP H0469838 B2 JPH0469838 B2 JP H0469838B2 JP 62250573 A JP62250573 A JP 62250573A JP 25057387 A JP25057387 A JP 25057387A JP H0469838 B2 JPH0469838 B2 JP H0469838B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- circuit
- conductor
- conductive base
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25057387A JPH0194695A (ja) | 1987-10-06 | 1987-10-06 | 導体回路板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25057387A JPH0194695A (ja) | 1987-10-06 | 1987-10-06 | 導体回路板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0194695A JPH0194695A (ja) | 1989-04-13 |
| JPH0469838B2 true JPH0469838B2 (cs) | 1992-11-09 |
Family
ID=17209898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25057387A Granted JPH0194695A (ja) | 1987-10-06 | 1987-10-06 | 導体回路板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0194695A (cs) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100601485B1 (ko) * | 2004-12-30 | 2006-07-18 | 삼성전기주식회사 | Bga 패키지 기판 및 그 제조방법 |
| KR100782403B1 (ko) * | 2006-10-25 | 2007-12-07 | 삼성전기주식회사 | 회로기판 제조방법 |
| KR100782407B1 (ko) * | 2006-10-30 | 2007-12-05 | 삼성전기주식회사 | 회로기판 제조방법 |
| KR100966336B1 (ko) * | 2008-04-07 | 2010-06-28 | 삼성전기주식회사 | 고밀도 회로기판 및 그 형성방법 |
| JP6381997B2 (ja) * | 2014-06-30 | 2018-08-29 | 京セラ株式会社 | 印刷配線板の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249468A (en) * | 1975-10-20 | 1977-04-20 | Fujitsu Ltd | Method of producing bothhside printed circuit board |
| JPS5939917B2 (ja) * | 1980-12-29 | 1984-09-27 | 株式会社小糸製作所 | プリント回路用導体及びその導体を用いたプリント回路板 |
-
1987
- 1987-10-06 JP JP25057387A patent/JPH0194695A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0194695A (ja) | 1989-04-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |