JPH0469820B2 - - Google Patents
Info
- Publication number
- JPH0469820B2 JPH0469820B2 JP24437186A JP24437186A JPH0469820B2 JP H0469820 B2 JPH0469820 B2 JP H0469820B2 JP 24437186 A JP24437186 A JP 24437186A JP 24437186 A JP24437186 A JP 24437186A JP H0469820 B2 JPH0469820 B2 JP H0469820B2
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- printed circuit
- circuit board
- connector portion
- case material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61244371A JPS6398137A (ja) | 1986-10-15 | 1986-10-15 | 混成集積回路 |
| EP87114938A EP0264780B1 (en) | 1986-10-15 | 1987-10-13 | Hybrid integrated circuit device capable of being inserted into socket |
| US07/107,990 US4884125A (en) | 1986-10-15 | 1987-10-13 | Hybrid integrated circuit device capable of being inserted into socket |
| DE8787114938T DE3777324D1 (de) | 1986-10-15 | 1987-10-13 | Integrierte hybridschaltungsanordnung, die in einen sockel eingesteckt werden kann. |
| KR1019870011409A KR900007232B1 (ko) | 1986-10-15 | 1987-10-14 | 혼성집적회로 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61244371A JPS6398137A (ja) | 1986-10-15 | 1986-10-15 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6398137A JPS6398137A (ja) | 1988-04-28 |
| JPH0469820B2 true JPH0469820B2 ( ) | 1992-11-09 |
Family
ID=17117695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61244371A Granted JPS6398137A (ja) | 1986-10-15 | 1986-10-15 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6398137A ( ) |
-
1986
- 1986-10-15 JP JP61244371A patent/JPS6398137A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6398137A (ja) | 1988-04-28 |
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