JPH0469533B2 - - Google Patents
Info
- Publication number
- JPH0469533B2 JPH0469533B2 JP61253192A JP25319286A JPH0469533B2 JP H0469533 B2 JPH0469533 B2 JP H0469533B2 JP 61253192 A JP61253192 A JP 61253192A JP 25319286 A JP25319286 A JP 25319286A JP H0469533 B2 JPH0469533 B2 JP H0469533B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- press
- molding
- pot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
- B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25319286A JPS63107530A (ja) | 1986-10-23 | 1986-10-23 | マルチ成形用樹脂封止金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25319286A JPS63107530A (ja) | 1986-10-23 | 1986-10-23 | マルチ成形用樹脂封止金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63107530A JPS63107530A (ja) | 1988-05-12 |
JPH0469533B2 true JPH0469533B2 (enrdf_load_stackoverflow) | 1992-11-06 |
Family
ID=17247829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25319286A Granted JPS63107530A (ja) | 1986-10-23 | 1986-10-23 | マルチ成形用樹脂封止金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63107530A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6923502B2 (ja) * | 2018-11-21 | 2021-08-18 | Towa株式会社 | トランスファ駆動機構、樹脂成形装置および樹脂成形品の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5623059Y2 (enrdf_load_stackoverflow) * | 1977-10-21 | 1981-05-29 | ||
JPS6038717U (ja) * | 1983-08-25 | 1985-03-18 | ロ−ム株式会社 | マルチ式トランスフア成形装置 |
JPS6339054U (enrdf_load_stackoverflow) * | 1986-08-30 | 1988-03-14 | ||
JPH0642223Y2 (ja) * | 1989-08-31 | 1994-11-02 | 横河電機株式会社 | 磁気検出回路 |
-
1986
- 1986-10-23 JP JP25319286A patent/JPS63107530A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63107530A (ja) | 1988-05-12 |
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