JPH0469519B2 - - Google Patents
Info
- Publication number
- JPH0469519B2 JPH0469519B2 JP15507686A JP15507686A JPH0469519B2 JP H0469519 B2 JPH0469519 B2 JP H0469519B2 JP 15507686 A JP15507686 A JP 15507686A JP 15507686 A JP15507686 A JP 15507686A JP H0469519 B2 JPH0469519 B2 JP H0469519B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- silver
- metal
- brazing filler
- selenium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 72
- 239000002184 metal Substances 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 38
- 229910052709 silver Inorganic materials 0.000 claims description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 32
- 239000004332 silver Substances 0.000 claims description 32
- 239000000945 filler Substances 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 13
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 11
- 229910052711 selenium Inorganic materials 0.000 claims description 11
- 239000011669 selenium Substances 0.000 claims description 11
- 239000011573 trace mineral Substances 0.000 claims description 11
- 235000013619 trace mineral Nutrition 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 description 16
- 150000002739 metals Chemical class 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000005304 joining Methods 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15507686A JPS6313690A (ja) | 1986-07-03 | 1986-07-03 | 銀ろう材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15507686A JPS6313690A (ja) | 1986-07-03 | 1986-07-03 | 銀ろう材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6313690A JPS6313690A (ja) | 1988-01-20 |
| JPH0469519B2 true JPH0469519B2 (enExample) | 1992-11-06 |
Family
ID=15598129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15507686A Granted JPS6313690A (ja) | 1986-07-03 | 1986-07-03 | 銀ろう材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6313690A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313697A (ja) * | 1987-06-15 | 1988-12-21 | Ngk Spark Plug Co Ltd | 銀ろう合金 |
| JP4309227B2 (ja) * | 2003-10-16 | 2009-08-05 | 石福金属興業株式会社 | スパッタリングターゲット材 |
| CN102554508B (zh) * | 2012-02-22 | 2014-03-05 | 南京航空航天大学 | 一种适用于无铅易切削铜合金钎焊的银钎料 |
| CN102581510B (zh) * | 2012-02-22 | 2014-04-30 | 金华市双环钎焊材料有限公司 | 一种用于无铅易切削铜合金钎焊的银钎料 |
-
1986
- 1986-07-03 JP JP15507686A patent/JPS6313690A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6313690A (ja) | 1988-01-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |