JPS6313690A - 銀ろう材 - Google Patents
銀ろう材Info
- Publication number
- JPS6313690A JPS6313690A JP15507686A JP15507686A JPS6313690A JP S6313690 A JPS6313690 A JP S6313690A JP 15507686 A JP15507686 A JP 15507686A JP 15507686 A JP15507686 A JP 15507686A JP S6313690 A JPS6313690 A JP S6313690A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- metal
- brazing
- brazing filler
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 70
- 239000002184 metal Substances 0.000 title claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 56
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 38
- 239000004332 silver Substances 0.000 title claims abstract description 38
- 239000000945 filler Substances 0.000 title claims abstract description 33
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 13
- 239000011669 selenium Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000011573 trace mineral Substances 0.000 claims abstract description 12
- 235000013619 trace mineral Nutrition 0.000 claims abstract description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 239000011574 phosphorus Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 11
- 230000000694 effects Effects 0.000 abstract description 16
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 230000003746 surface roughness Effects 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000005304 joining Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15507686A JPS6313690A (ja) | 1986-07-03 | 1986-07-03 | 銀ろう材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15507686A JPS6313690A (ja) | 1986-07-03 | 1986-07-03 | 銀ろう材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6313690A true JPS6313690A (ja) | 1988-01-20 |
| JPH0469519B2 JPH0469519B2 (enExample) | 1992-11-06 |
Family
ID=15598129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15507686A Granted JPS6313690A (ja) | 1986-07-03 | 1986-07-03 | 銀ろう材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6313690A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313697A (ja) * | 1987-06-15 | 1988-12-21 | Ngk Spark Plug Co Ltd | 銀ろう合金 |
| CN102554508A (zh) * | 2012-02-22 | 2012-07-11 | 南京航空航天大学 | 一种适用于无铅易切削铜合金钎焊的银钎料 |
| CN102581510A (zh) * | 2012-02-22 | 2012-07-18 | 金华市双环钎焊材料有限公司 | 一种用于无铅易切削铜合金钎焊的银钎料 |
| US20130094990A1 (en) * | 2003-10-16 | 2013-04-18 | Ishifuku Metal Industry Co., Ltd. | Sputtering target material |
-
1986
- 1986-07-03 JP JP15507686A patent/JPS6313690A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313697A (ja) * | 1987-06-15 | 1988-12-21 | Ngk Spark Plug Co Ltd | 銀ろう合金 |
| US20130094990A1 (en) * | 2003-10-16 | 2013-04-18 | Ishifuku Metal Industry Co., Ltd. | Sputtering target material |
| US8858877B2 (en) * | 2003-10-16 | 2014-10-14 | Ishifuku Metal Industry Co., Ltd. | Sputtering target material |
| CN102554508A (zh) * | 2012-02-22 | 2012-07-11 | 南京航空航天大学 | 一种适用于无铅易切削铜合金钎焊的银钎料 |
| CN102581510A (zh) * | 2012-02-22 | 2012-07-18 | 金华市双环钎焊材料有限公司 | 一种用于无铅易切削铜合金钎焊的银钎料 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0469519B2 (enExample) | 1992-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3795797B2 (ja) | はんだ材 | |
| KR100377232B1 (ko) | 무연땜납합금 | |
| US5817194A (en) | Tin base soldering/brazing material | |
| US4135656A (en) | Nickel base brazing alloy | |
| CN104526181A (zh) | 一种应用于真空电子器件钎焊封接的电真空银基合金钎料及其制备方法 | |
| JPH02101132A (ja) | 低融点ハンダ合金 | |
| JPS6247117B2 (enExample) | ||
| JPS6313690A (ja) | 銀ろう材 | |
| CN100589918C (zh) | 焊锡及使用它的电路基板装置 | |
| CN110238557B (zh) | 一种ZnSn基高温无铅焊料及其制备方法 | |
| CN1311950C (zh) | 无铅焊接合金和焊接材料以及使用这些材料的焊接接点 | |
| JPS6313691A (ja) | 銀ろう材 | |
| JPS61242787A (ja) | 銀ろう材 | |
| JP2008030047A (ja) | 無鉛ハンダ | |
| WO2016139848A1 (ja) | Au-Sn-Ag系はんだペースト並びにこのAu-Sn-Ag系はんだペーストを用いて接合もしくは封止された電子部品 | |
| WO1982000790A1 (en) | Low-silver cu-ag alloy solder having good soldering properties and low vapor pressure | |
| US20040208779A1 (en) | Lead-free alloy | |
| JPS63159B2 (enExample) | ||
| JPH0679494A (ja) | 金属接合用Zn基合金 | |
| JPS6247119B2 (enExample) | ||
| JPH02179387A (ja) | 低融点Agはんだ | |
| JPS6397394A (ja) | 銀ろう材 | |
| JP2000061683A (ja) | はんだめっき線 | |
| JPS5812117B2 (ja) | 金属ろう | |
| CN107999993A (zh) | 一种用于温控器波纹管铁底板软钎焊的无铅焊料及其制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |