JPH0469519B2 - - Google Patents
Info
- Publication number
- JPH0469519B2 JPH0469519B2 JP15507686A JP15507686A JPH0469519B2 JP H0469519 B2 JPH0469519 B2 JP H0469519B2 JP 15507686 A JP15507686 A JP 15507686A JP 15507686 A JP15507686 A JP 15507686A JP H0469519 B2 JPH0469519 B2 JP H0469519B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- silver
- metal
- brazing filler
- selenium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 72
- 239000002184 metal Substances 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 38
- 229910052709 silver Inorganic materials 0.000 claims description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 32
- 239000004332 silver Substances 0.000 claims description 32
- 239000000945 filler Substances 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 13
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 11
- 229910052711 selenium Inorganic materials 0.000 claims description 11
- 239000011669 selenium Substances 0.000 claims description 11
- 239000011573 trace mineral Substances 0.000 claims description 11
- 235000013619 trace mineral Nutrition 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 description 16
- 150000002739 metals Chemical class 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000005304 joining Methods 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
Description
＜産業上の利用分野＞
開示技術は真空中、或は、所定のガス雰囲気中
で電気製品や電子部品等の接合に使用する銀ろう
材の組成の技術分野に属する。
＜要旨の概要＞
而して、この出願の発明は電気製品や電子部品
の電気導伝度を良好に維持する接合材として用い
られる銀ろう材であつて、その組成の基材を成す
銀に対しろう材としての機能の重要なろう流れ性
を良好にする他の元素を添加すると共に、金属組
織を微細、且つ、緻密化するために、微量元素を
添加した銀ろう材に関する発明であり、特に、各
元素の添加重量％において、上記他の元素として
ろう材の基本的な流動特性を向上させるべく銅を
５〜50％、そして、ろう材の金属組織の緻密微細
化、分散化を良好に現出することが出来るように
セレンを0.001〜0.1％、或は、更に、これに対し
て燐を0.001〜0.5％添加し、残量は全組成重量
100％以内で銀を50〜95％とするようにした銀ろ
う材に係る発明である。
＜従来技術＞
周知の如く、金属相互の物理、化学的特性を維
持しながら接合を図るには所謂ろう材が広く用い
られており、接合金属の性質や目的に応じて各種
のろう材が種々開発されて広く用いられている。
このうちでも、電気製品の接合等には融点が低
く、加工性や作業性が良いうえに資材供給が安定
し、価格も比較的に低廉である等の利点から銀ろ
う材が広範囲に用いられており、就中、72％Ag
−Cu合金（所謂BAg−８）はエレクトロニクス
産業の隆盛に伴つて電子部品接合等に極めて広く
用いられており、電子工業や精密機械産業におい
ては融点、或は、電気伝導特性等の物理化学的性
質、及び、コストを考慮してろう材の素材組成の
うち最も大きな含有量を有する銀の量を所定に設
計したAg−Cu合金等の銀ろう材がかなりの量で
用いられいる。
＜発明が解決しようとする問題点＞
而して、各種の工業製品、就中、電子工業製品
においては、単に複数の金属素材をろう材によつ
て単に接合するばかりでないことは周知の通りで
あり、特に、エレクトロニクス製品を中心とする
電子工業においてはろう材による複数金属の接合
後において多くの機械的、物理的、化学的な複数
の工程をたどる場合が多く、したがつて、ろう付
け後の各工程での接合素材の強度や化学的安定性
が強く望まれ、ろう材による接合時のろう材の母
材に対するぬれ性とろう付け後の表面の平滑度が
厳しく要求されるようになつてきている。
蓋し、ろう付け工程におけるろう材のぬれ性が
悪く、ろう付け後の母材表面に対する面あらさが
大きいと、上述ろう付け後の各工程での加工性が
低下したり、作業性を阻害したり、製品精度を低
下する欠点があるからである。
例えば、ろう付け後のメツキ工程において、ろ
う付けのぬれ性が悪いことによつて、メツキの前
工程における脱脂が充分でなかつたり、酸洗処理
工程での酸が表面に残留してその後の各工程中に
おける、或は、製品における経時的な腐蝕を招来
する等の難点があり、結果的に製品歩留を低下
し、信頼度が低下したりする不利点があつた。
さりながら、これまでに開発されてきた銀ろう
材、特に、Ag−Cuろう材においては微細、且
つ、精密な電子部品に対するろう付け時のぬれ性
が充分でなく、母材金属組成に対する接合性に乏
しく、金属組織における微細金属の分散性が充分
でないために、母材に対する面あらさが大きいと
いう不具合があつた。
＜発明の目的＞
この出願の発明の目的は上述従来技術に基づく
精密機械工業や電子工業におけるろう材、特に、
銀らう材の問題点を解決すべき技術的課題とし、
Ag−Cu合金ろう材の電気伝導度や熱伝導性のろ
う材としての基本的初期特性を充分に維持しなが
らも加工時における流動性が良く、ぬれ性に富
み、充分な設計通りの平滑度を保持し、ろう付け
後の各処理工程における加工性や作業性を向上さ
せ、しかも、製品の精度に対する信頼度を向上さ
せることが出来るようにして、機械工業、電子工
業等の先端産業における加工処理技術利用分野に
益する優れた銀ろう材を提供せんとするものであ
る。
＜問題点を解決するための手段・作用＞
上述目的に沿い先述特許請求の範囲を要旨とす
るこの出願の発明の構成は前述問題点を解決する
ために、基本的なAg−Cu合金の銀ろう材素材に
対し、更に、ぬれ性等のろう付け特性を向上させ
る微量元素を添加するようにして精密機械工業や
エレクトロニクスを中心とする電子工業におい
て、複数の金属素材を接合する銀ろう材がその組
成を全組成重量100％において電気伝導と熱伝導
等の基本的基材の特性に与る銀の融点を下げ、加
工性に富むべく流動性を良くし、併せて耐蝕性を
充分に保つように維持する銅を５〜50％の範囲に
し、接合金属に対するぬれ性と面あらさを低く
し、後工程における各処理段階での加工性や作業
性を向上する微量元素としてセレンを0.001〜0.1
％、或は、更に、セレンに加えてろう材自体の製
造、及び、素材金属に対するろう付けに際して脱
ガス効果を促進させ、更には、脱酸効果を具備
し、銅の流動性を促進させるように燐を0.001〜
0.5％添加し、銀ろう材の基本的性質である電気
伝導度や熱伝導性を充分に維持する銀を50〜95％
の範囲で残量とした銀ろう材として加工性に優れ
ると共に作業性を阻害せず、ぬれ性が良く、面あ
らさは極めて低くすることが出来るようにした技
術的手段を講じたものである。
尚、組成重量、及び、その重量範囲については
その背景的理由は理論、及び、実験に基づいて次
のように得られたものである。
即ち、銅についてはろう材の基本的な初期特性
の流動性を保証するものであり、５％未満では流
動性が悪く、50％を越えると融点が上昇し、ろう
付け条件が悪化し、耐蝕性も低下して製品に対す
る信頼性が落ちるからである。
又、セレンについては、金属組織を微細化して
均一分散化を促進し、面あらさを著しく低下さ
せ、又、ろう流れ性を改善し、ろう材のぬれ性を
向上するのに著しく寄与し、その含有量が0.001
％未満ではぬれ性改善の効果が期待出来ず、又、
0.1％を越えるとセレン自体が比較的蒸気圧の高
い金属であるためにろう付け工程における周辺機
器や作業環境を汚染し、更に、接合金属に対する
ろう付け特性を阻害するからで、その最も良好な
範囲が0.001〜0.1％の微量元素としたものであ
る。
又、燐については銀ろう材自体の製造時や接合
金属に対するろう付け時に脱ガス効果が著しく、
特に、脱酸効果に優れ、ろう材の流動性を改善す
るのに極めて有効であり、その添加量は0.001％
未満では良好な効果が期待出来ず、0.5％を越え
るとろう付け強度が低下するために、0.001〜0.5
％の微量元素の範囲にしたものである。
そして、先述した如く、銀ろう材の基本的特性
の電気伝導度や熱伝導性に基本的に与る銀はその
中心的組成として残量とし、100％重量範囲にお
いて50〜95％としたものである。
＜実施例＞
次に、この出願の発明の実施例を図面を参照し
て説明すれば以下の通りである。
まず、この出願の発明の実施例と従来材料のろ
う材の態様のものを次の表１に比較して示す。
<Industrial Field of Application> The disclosed technology belongs to the technical field of composition of silver braze used for joining electrical products, electronic parts, etc. in vacuum or in a predetermined gas atmosphere. <Summary of the gist> The invention of this application is a silver brazing material used as a bonding material to maintain good electrical conductivity in electrical products and electronic parts, and the invention relates to a silver brazing material that is used as a bonding material to maintain good electrical conductivity in electrical products and electronic components. This invention relates to a silver brazing material in which trace elements are added in order to make the metal structure fine and dense, as well as other elements to improve the flowability of the solder, which is important for its function as a brazing material. In particular, in the weight percentage of each element added, copper is added at 5 to 50% in order to improve the basic flow characteristics of the brazing filler metal as the other elements mentioned above, and the metal structure of the brazing filler metal is finely refined and dispersed. Add 0.001 to 0.1% of selenium, or further add 0.001 to 0.5% of phosphorus so that it can appear, and the remaining amount is the total composition weight.
This invention relates to a silver brazing material in which the silver content is 50 to 95% within 100%. <Prior art> As is well known, so-called brazing filler metals are widely used to join metals while maintaining their mutual physical and chemical properties, and various types of brazing filler metals are used depending on the properties and purposes of the metals to be joined. developed and widely used. Among these, silver brazing filler metal is widely used for joining electrical products because of its low melting point, good processability and workability, stable supply of materials, and relatively low price. Among them, 72%Ag
-Cu alloy (so-called BAg-8) has been extremely widely used for joining electronic parts with the rise of the electronics industry. A considerable amount of silver brazing material such as Ag--Cu alloy is used, which is designed to have the largest amount of silver in the material composition of the brazing material in consideration of properties and cost. <Problems to be Solved by the Invention> As is well known, in various industrial products, especially electronic industrial products, it is not enough to simply join multiple metal materials with a brazing material. In particular, in the electronics industry, which focuses on electronic products, many mechanical, physical, and chemical processes are often followed after joining multiple metals using brazing filler metal. The strength and chemical stability of the joining materials in each process are strongly desired, and the wettability of the brazing material to the base material when joining with the brazing material and the smoothness of the surface after brazing are now strictly required. It's coming. If the wettability of the brazing material in the lid and brazing process is poor and the surface roughness of the base material after brazing is large, the workability in each process after brazing described above will decrease or workability will be hindered. This is because they have the disadvantage of lowering product accuracy. For example, in the plating process after brazing, degreasing in the pre-plating process may not be sufficient due to poor brazing wettability, or acid in the pickling process may remain on the surface and There are disadvantages such as corrosion during the process or over time in the product, which results in a decrease in product yield and reliability. However, the silver brazing filler metals that have been developed so far, especially the Ag-Cu brazing filler metals, do not have sufficient wettability when brazing fine and precise electronic components, and have poor bonding properties with respect to the base metal composition. There was a problem that the surface roughness against the base material was large because the dispersibility of fine metals in the metal structure was insufficient. <Object of the invention> The object of the invention of this application is to provide a brazing material in the precision machinery industry and electronic industry based on the above-mentioned prior art, particularly,
We consider the problems of silver-plated materials as technical issues to be solved,
Ag-Cu alloy brazing filler metal maintains the basic initial characteristics of electrical conductivity and thermal conductivity as a brazing filler metal, while maintaining good fluidity during processing, rich wettability, and sufficient smoothness as designed. This makes it possible to improve processability and workability in each processing step after brazing, as well as improve reliability of product accuracy, making it possible to improve processing in cutting-edge industries such as the mechanical industry and the electronics industry. The purpose is to provide an excellent silver brazing material that is useful in processing technology applications. <Means/effects for solving the problems> In order to solve the above problems, the structure of the invention of this application, which is based on the scope of the above claims, is to solve the above problems. By adding trace elements to the brazing material to improve brazing properties such as wettability, silver brazing material is used to join multiple metal materials in the precision machinery industry and the electronics industry, mainly electronics. At 100% of the total composition weight, the melting point of silver, which affects basic properties of the base material such as electrical conduction and thermal conduction, is lowered, fluidity is improved for ease of processing, and corrosion resistance is maintained sufficiently. Selenium is added as a trace element in the range of 0.001 to 0.1 to maintain copper in the range of 5 to 50%, to lower the wettability and surface roughness of the joining metal, and to improve processability and workability at each treatment stage in the post-process.
%, or in addition to selenium, it promotes the degassing effect during the production of the brazing filler metal itself and brazing to the raw metal, and also has a deoxidizing effect and promotes the fluidity of copper. 0.001～
Added 0.5% to 50-95% silver to maintain sufficient electrical conductivity and thermal conductivity, which are the basic properties of silver brazing material.
Technical measures have been taken to ensure that the silver brazing filler metal has excellent workability, has a residual amount within the range of , does not impede workability, has good wettability, and has extremely low surface roughness. The background reasons for the composition weight and its weight range were obtained as follows based on theory and experiment. In other words, with regard to copper, it guarantees the fluidity of the basic initial properties of the brazing material; if it is less than 5%, the fluidity will be poor, and if it exceeds 50%, the melting point will rise, the brazing conditions will deteriorate, and the corrosion resistance will deteriorate. This is because the reliability of the product also decreases and the reliability of the product decreases. Regarding selenium, it refines the metal structure, promotes uniform dispersion, significantly reduces surface roughness, improves the flowability of the solder, and significantly contributes to improving the wettability of the brazing filler metal. Content is 0.001
If it is less than %, the effect of improving wettability cannot be expected, and
If it exceeds 0.1%, selenium itself is a metal with a relatively high vapor pressure, so it contaminates peripheral equipment and the working environment during the brazing process, and furthermore, it inhibits the brazing properties of the joining metal. It is a trace element with a range of 0.001 to 0.1%. In addition, with regard to phosphorus, the degassing effect is significant during the production of the silver brazing material itself and during brazing to the joining metal.
In particular, it has an excellent deoxidizing effect and is extremely effective in improving the fluidity of brazing filler metal, and the amount added is 0.001%.
If it is less than 0.001 to 0.5%, a good effect cannot be expected, and if it exceeds 0.5%, the brazing strength will decrease.
% of trace elements. As mentioned above, silver, which basically contributes to the electrical conductivity and thermal conductivity, which are the basic characteristics of silver brazing filler metal, is the central composition and the remaining amount is 50 to 95% in the 100% weight range. It is. <Example> Next, an example of the invention of this application will be described below with reference to the drawings. First, the embodiments of the invention of this application and the brazing filler metals of conventional materials are compared and shown in Table 1 below.
【表】
そして、上記表１に示すこの出願の発明の銀ろ
う材と従来態様のろう材とについてそれぞれ試験
材料は2.5mmの立方体のろう材試験材を用い、各
ろう材の液相点温度より40゜高い温度で真空中、
及び、水素雰囲気中で５分間維持して行つたもの
であり、引張り強度が２×15mmの断面を有する突
き合せ継手をアムスラー型引張試験器を用いて測
定し、その広がり面積、及び、引張り強度につい
ての試験結果は次の表２に示す通りである。[Table] For the silver brazing filler metal of the invention of this application and the conventional brazing filler metal shown in Table 1 above, a 2.5 mm cube brazing filler metal test material was used as the test material, and the liquidus point temperature of each brazing filler metal was in vacuum at a temperature 40° higher than
The tensile strength was measured by maintaining it in a hydrogen atmosphere for 5 minutes using an Amsler type tensile tester for a butt joint with a cross section of 2 x 15 mm, and its spread area and tensile strength were measured. The test results are shown in Table 2 below.
【表】
上述表２によつてもこの出願の発明の銀ろう材
が在来様態のろう材に比して広がり面積、即ち、
流動性が良く、引張り強度についてもバラつきが
なく、金属組織の微細化平均的分散によつて表面
の平滑性に優れ、ぬれ性が良いことが分る。
又、上記各試験についてろう材の表面あらさの
試料縦断面の拡大形状について示すに各試料番号
と図面番号を同一序列に示すと、第１〜６図に示
す通りである。
即ち、第１〜４図に示すこの出願の発明の銀ろ
う材の表面あらさは滑らかであり、又、平均した
分散度を有しているのに対し第５，６図に示す在
来態様のろう材においてはその面あらさが相当に
大きく、そして、バラつきのある分散度であるこ
とが分る。
尚、この出願の発明の実施態様は上述各実施例
に限るものでないことは勿論であり、例えば、
銀、銅、セレン、燐についての組成重量％の配合
比は上述実施例以外のものも用途別等により採用
出来る等種々の様態が採用可能である。
＜発明の効果＞
以上、この出願の発明によれば、精密機械工業
製品やエレクトロニクスを中心とする工業部品等
の素材金属接合に用いる銀ろう材において従来の
Ag−Cu合金に対し、微量元素を添加し、特に、
先述特許請求の範囲の組成重量％にして添加する
ことにより、在来のろう材に比し引張り強度を充
分に有し、しかも、相当な広がり性に基づく良好
なぬれ性を有し、又、金属組成の微細化、分散化
によつて表面の平滑性が向上し、これによりろう
付け後のメツキ工程等における加工がし易く、酸
洗いによる酸の表面残留による腐蝕がない等の優
れた効果が奏され、結果的に製品に対する信頼性
が向上するという優れた効果が奏される。
又、ろう付け後の各工程における加工性が良い
ことにより、素材金属の歩留も向上し、製品コス
トを下げる等工業生産上に極めて有利な効果が奏
されるものである。
而して、銅の所定重量％範囲内の添加により銀
ろう材の初期流動性が向上し、ろう付け条件も低
下することなく耐蝕性に優れるようにすることが
出来る優れた効果が奏される。
又、微量元素にセレンを用いて所定の重量％の
範囲で添加することにより、ろう材の金属組織が
より微細化し、ぬれ性改善が向上し、メツキ処理
等の工程における金属蒸気が周辺汚染等せず、作
業環境を向上し周辺機器への汚染を防止すること
が、出来るという利点もある。
又、セレンに伴つて燐を設定範囲内で添加する
こにより、ろう付け後の、或は、ろう材そのもの
製造時において、脱ガス効果が奏され、特に、脱
酸効果が向上し、流動性も改善されるという効果
があり、ろう付け強度も低下せず、接合素材の部
品組付け性を常に維持することが出来、この点か
らも製品に対する信頼度が向上するという優れた
効果が奏される。[Table] Table 2 above also shows that the silver brazing material of the invention of this application has a larger area than the conventional brazing material, that is,
It can be seen that the fluidity is good, there is no variation in tensile strength, the surface smoothness is excellent due to the fine and average distribution of the metal structure, and the wettability is good. Further, the enlarged shape of the vertical cross-section of the sample of the surface roughness of the brazing filler metal for each of the above tests is as shown in FIGS. 1 to 6, where each sample number and drawing number are shown in the same order. That is, the surface roughness of the silver brazing material of the invention of this application shown in FIGS. 1 to 4 is smooth and has an average degree of dispersion, whereas that of the conventional embodiment shown in FIGS. It can be seen that the surface roughness of the brazing filler metal is quite large and the degree of dispersion varies. Incidentally, it goes without saying that the embodiments of the invention of this application are not limited to the above-mentioned embodiments; for example,
As for the composition weight % of silver, copper, selenium, and phosphorus, various formulations can be adopted, such as those other than those in the above-mentioned embodiments, depending on the application. <Effects of the Invention> As described above, according to the invention of this application, conventional silver brazing filler metals used for joining raw metals of precision machinery industrial products and industrial parts mainly for electronics can be improved.
Adding trace elements to Ag-Cu alloy, especially
By adding it in the composition weight % as claimed in the above claims, it has sufficient tensile strength compared to conventional brazing filler metals, and also has good wettability based on considerable spreadability. The finer and more dispersed metal composition improves the surface smoothness, which makes it easier to process in the plating process after brazing, and has excellent effects such as no corrosion due to acid residue on the surface due to pickling. As a result, the reliability of the product is improved, which is an excellent effect. Furthermore, since the workability in each step after brazing is good, the yield of raw metal is improved, and extremely advantageous effects on industrial production, such as lowering product costs, are produced. Therefore, the addition of copper within a predetermined weight percent range improves the initial fluidity of the silver brazing filler metal, and has the excellent effect of providing excellent corrosion resistance without degrading the brazing conditions. . In addition, by adding selenium as a trace element within a predetermined weight percent range, the metal structure of the brazing filler metal becomes finer, improving wettability, and preventing metal vapor from contaminating the surrounding area during processes such as plating. There is also the advantage that it is possible to improve the working environment and prevent contamination of peripheral equipment without having to do so. In addition, by adding phosphorus within a set range along with selenium, a degassing effect can be achieved after brazing or during the manufacture of the brazing material itself, and in particular, the deoxidizing effect is improved and fluidity is improved. This has the effect of improving the brazing strength, and the ease of assembling parts of the bonded material can be maintained at all times, and from this point of view, it also has the excellent effect of improving the reliability of the product. Ru.
図面はこの出願の発明、及び、在来態様のろう
材の表面あらさについての縦断面拡大図であり、
第１〜４図はこの出願の発明の銀ろう材の縦断面
拡大図、第５，６図は従来技術に基づく縦断面拡
大図である。
The drawings are enlarged vertical cross-sectional views of the invention of this application and the surface roughness of conventional brazing filler metals,
1 to 4 are enlarged vertical cross-sectional views of the silver brazing material of the invention of this application, and FIGS. 5 and 6 are enlarged vertical cross-sectional views based on the prior art.
Claims (1)
向上する微量元素を添加した銀ろう材において、
全組成重量100％で上記他の元素として銅を５〜
50％、微量元素としてセレンを0.001〜0.1％、残
量を銀としたことを特徴とする銀ろう材。 ２ 銀に流動性を良好にする他元素と金属組織を
向上する微量元素を添加した銀ろう材において、
全組成重量100％で上記他の元素として銅を５〜
50％、微量元素として燐を0.001〜0.5％、更にセ
レンを0.001〜0.1％、残量を銀としたことを特徴
とする銀ろう材。[Claims] 1. A silver brazing material in which other elements that improve fluidity and trace elements that improve metal structure are added to silver,
The total composition weight is 100%, and the other elements mentioned above include copper from 5 to 5.
50% selenium, 0.001 to 0.1% selenium as a trace element, and the balance being silver. 2. In silver brazing filler metal with other elements that improve fluidity and trace elements that improve metal structure added to silver,
The total composition weight is 100%, and the other elements mentioned above include copper from 5 to 5.
50%, phosphorus as trace elements 0.001 to 0.5%, selenium 0.001 to 0.1%, and the balance being silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15507686A JPS6313690A (en) | 1986-07-03 | 1986-07-03 | Silver brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15507686A JPS6313690A (en) | 1986-07-03 | 1986-07-03 | Silver brazing filler metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6313690A JPS6313690A (en) | 1988-01-20 |
| JPH0469519B2 true JPH0469519B2 (en) | 1992-11-06 |
Family
ID=15598129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15507686A Granted JPS6313690A (en) | 1986-07-03 | 1986-07-03 | Silver brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6313690A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313697A (en) * | 1987-06-15 | 1988-12-21 | Ngk Spark Plug Co Ltd | Silver alloy filler metal for brazing |
| JP4309227B2 (en) * | 2003-10-16 | 2009-08-05 | 石福金属興業株式会社 | Sputtering target material |
| CN102581510B (en) * | 2012-02-22 | 2014-04-30 | 金华市双环钎焊材料有限公司 | Silver solder for lead-free free-cutting copper alloy soldering |
| CN102554508B (en) * | 2012-02-22 | 2014-03-05 | 南京航空航天大学 | Silver solder suitable for brazing of lead-free free cutting copper alloy |
-
1986
- 1986-07-03 JP JP15507686A patent/JPS6313690A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6313690A (en) | 1988-01-20 |
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