JPH0436798B2 - - Google Patents
Info
- Publication number
- JPH0436798B2 JPH0436798B2 JP59198612A JP19861284A JPH0436798B2 JP H0436798 B2 JPH0436798 B2 JP H0436798B2 JP 59198612 A JP59198612 A JP 59198612A JP 19861284 A JP19861284 A JP 19861284A JP H0436798 B2 JPH0436798 B2 JP H0436798B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- melting point
- alloy
- addition
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005219 brazing Methods 0.000 claims description 18
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 14
- 230000008018 melting Effects 0.000 description 11
- 238000002844 melting Methods 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229910017942 Ag—Ge Inorganic materials 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Contacts (AREA)
Description
〔産業上の利用分野〕
本発明は真空中もしくは雰囲気中等で使用する
銀ろう材に関する。
〔従来の技術〕
従来より金属のろう材には銀ろう、金ろう、パ
ラジウムろうおよび白金ろう等が用いられてい
る。その中でも銀ろうは融点が比較的低く作業性
がよいことおよび価格が比較的低廉であることか
ら広く用いられている。銀ろうの中でも特に
72Ag−Cu合金(BAg−8)が電子部品などをは
じめとして多用されており、また、融点あるいは
価格を考慮して銀の含有量を増減させたAg−Cu
合金が使用されている。
〔発明が解決しようとする問題点〕
しかし、上記Ag−Cu合金は、28%(Wt%であ
り、以下も同様である。)Cuを含むため、ろう付
雰囲気の条件によつては温度上昇時に酸化変色す
る高温耐食性に問題があり、またろう付け後のめ
つき工程において酸洗処理の酸が表面に残留して
表面が腐食するなどの問題がある。
〔問題点を解決するための手段〕
本発明は、AgにGeおよびPdを加えてろう材と
し、さらにはそれにFe、CoおよびNiの1種また
は2種以上を加えたろう材として使用時および後
処理工程における耐食性にすぐれると共に充分な
拡がり性および濡れ性を有し、ろう付引張強度も
充分にあるものである。
まず、AgにGeを加えると、Ag−Ge合金とし
て融点の低下がはかれる。Geが0.05%未満では
実質的融点低下はほとんど無いが0.05%から共晶
組成を与えるGe19%迄は、Geを加える量が増す
につれて順次融点が低下してゆく。19%を越える
Geの添加は、融点を再び上昇させるとともにAg
−Ge合金は脆弱化して機械的加工性が阻害され
る。
このAg−Ge系合金にPdを添加すると、Fe、
Ni、Coおよびこれらの合金例えば42Fe−Ni、コ
バール、ステンレス等の母材上における濡れ性お
よび拡がり性が向上する。添加量が0.01未満では
その添加効果は無きに等しく、10%を越えると合
金の融点の上昇をきたし、Ge添加による融点低
下の効果が相殺されてしまうものである。しか
し、ろう材には高価な材料であるためにその経済
性を考慮して融点低下の効果を得るには0.5%以
下がよい。
さらにAg−Ge−Pd系合金にFe、Co、Niを1
種または2種以上添加することによつて、Fe、
Ca、Niおよびこれらの合金例えば42Fe−Ni、コ
バール、ステンレス等の母材をろう付けした際金
属組織を微細化するとともにろう付強度の向上を
はかることができる。0.01%未満の添加ではその
効果が無きに等しく、3%を越える添加は主成分
であるAgとこれらが固溶し難いため、これらと
固溶するGeやPdをその上限より多く含有させな
ければならなくなつて不適である。
〔実施例〕
以下のAg−Ge−Pdの3元系による本発明の実
施例を説明する。
(1) Ag 97.05% Ge 2.5% Pd 0.45%
(2) Ag 92.80% Ge 7.0% Pd 0.2%
(3) Ag 86.95% Ge 13.0% Pd 0.05%
以上の試料について融点、拡がり面積および引
張強度についての試験結果を第1表に示す。
なお、拡がり試験は、厚さ0.1mm、10mm角のろ
う材を用い、各ろう材の液相温度より40℃高い温
度にて真空中または水素雰囲気中で行ない2分間
保持した。
また、ろう付引張強度測定は、各母材、断面4
mm×4mmの突合せ継手についてアムスラー材料試
験機により行なつた。なお、ろう付は各ろう材の
液相温度より40℃高い温度にて、真空中または水
素雰囲気中で行なつた。
[Industrial Application Field] The present invention relates to a silver brazing material used in a vacuum or an atmosphere. [Prior Art] Conventionally, silver solder, gold solder, palladium solder, platinum solder, etc. have been used as metal brazing materials. Among these, silver solder is widely used because it has a relatively low melting point, good workability, and is relatively inexpensive. Especially among silver wax
72Ag-Cu alloy (BAg-8) is widely used in electronic parts, etc., and Ag-Cu with increased or decreased silver content taking into account melting point or price.
alloy is used. [Problems to be solved by the invention] However, since the above Ag-Cu alloy contains 28% (Wt%, the same applies hereinafter) Cu, the temperature may rise depending on the conditions of the brazing atmosphere. There are problems with high-temperature corrosion resistance, which sometimes causes oxidative discoloration, and there are also problems such as acid from pickling treatment remaining on the surface during the plating process after brazing, resulting in surface corrosion. [Means for Solving the Problems] The present invention provides a brazing material by adding Ge and Pd to Ag, and further adding one or more of Fe, Co, and Ni to the brazing material during and after use. It has excellent corrosion resistance in processing steps, sufficient spreadability and wettability, and sufficient brazing tensile strength. First, when Ge is added to Ag, the melting point of the Ag-Ge alloy is lowered. When Ge is less than 0.05%, there is almost no substantial decrease in the melting point, but from 0.05% to 19% Ge, which gives a eutectic composition, the melting point gradually decreases as the amount of Ge added increases. over 19%
Addition of Ge raises the melting point again and Ag
-Ge alloy becomes brittle and mechanical workability is inhibited. When Pd is added to this Ag-Ge alloy, Fe,
The wettability and spreadability on base materials such as Ni, Co, and alloys thereof such as 42Fe-Ni, Kovar, and stainless steel are improved. If the addition amount is less than 0.01%, the effect of the addition is negligible, and if it exceeds 10%, the melting point of the alloy will increase, canceling out the effect of lowering the melting point due to the addition of Ge. However, since the brazing filler metal is an expensive material, in order to obtain the effect of lowering the melting point, considering its economic efficiency, the content should be 0.5% or less. In addition, Fe, Co, and Ni are added to the Ag-Ge-Pd alloy.
By adding a species or two or more species, Fe,
When base metals such as Ca, Ni, and their alloys such as 42Fe-Ni, Kovar, and stainless steel are brazed, the metal structure can be refined and the brazing strength can be improved. Addition of less than 0.01% is equivalent to no effect, and addition of more than 3% makes it difficult for these to form a solid solution with Ag, the main component, so Ge and Pd, which are solid solution with these, must be contained in amounts greater than the upper limit. It is inappropriate to do so. [Example] The following example of the present invention using a ternary system of Ag-Ge-Pd will be described. (1) Ag 97.05% Ge 2.5% Pd 0.45% (2) Ag 92.80% Ge 7.0% Pd 0.2% (3) Tests on melting point, spreading area, and tensile strength of samples with Ag 86.95% Ge 13.0% Pd 0.05% or more The results are shown in Table 1. The spreading test was conducted using a 10 mm square brazing filler metal with a thickness of 0.1 mm at a temperature 40° C. higher than the liquidus temperature of each brazing filler metal in a vacuum or in a hydrogen atmosphere and held for 2 minutes. In addition, brazing tensile strength measurement is performed for each base material, cross section 4
The tests were conducted using an Amsler material testing machine for a mm x 4 mm butt joint. Note that brazing was performed at a temperature 40° C. higher than the liquidus temperature of each brazing filler metal in vacuum or in a hydrogen atmosphere.
【表】
次に、Ag−Ge−PdにFe、Co、Niを1種また
は2種以上添加した4元以上の本発明の実施例を
説明する。
(4) Ag 96.05% Ge 3.0% Pd 0.45% Ni 0.5
%
(5) Ag 92.30% Ge 6.0% Pd 0.2% Fe 1.5
%
(6) Ag 85.95% Ge 12.0% Pd 0.05% Co
1.0%
Ni 1.0%
以上の試料について融点、拡がり面積および引
張強度についての試験結果を第2表に示す。
なお、これらの試験については上記の第1表に
示した試験方法と同様である。[Table] Next, examples of the present invention in which one or more of Fe, Co, and Ni are added to Ag-Ge-Pd will be described. (4) Ag 96.05% Ge 3.0% Pd 0.45% Ni 0.5
% (5) Ag 92.30% Ge 6.0% Pd 0.2% Fe 1.5
% (6) Ag 85.95% Ge 12.0% Pd 0.05% Co
Table 2 shows the test results regarding melting point, spreading area, and tensile strength for samples containing 1.0% Ni or more. Note that these tests are the same as the test methods shown in Table 1 above.
以上説明した本発明によると、Ag−Ge−Pdが
主成分である合金であるために高温時の耐食性に
すぐれ、しかも充分な拡がり性と濡れ性を有し、
引張強度も充分にあり、さらにろう付後のめつき
工程における酸洗処理により表面に残留した酸に
よつても腐食するような問題が解決されて広範囲
に使用することができる銀ろう材となる。
According to the present invention explained above, since it is an alloy mainly composed of Ag-Ge-Pd, it has excellent corrosion resistance at high temperatures, and has sufficient spreadability and wettability.
It has sufficient tensile strength and also solves the problem of corrosion due to acid remaining on the surface due to pickling treatment in the plating process after brazing, making it a silver brazing material that can be used in a wide range of areas. .
第1図は本発明の金属組織の表面の顕微鏡写
真、第2図はAg−Geの金属組織の表面の顕微鏡
写真である。
FIG. 1 is a photomicrograph of the surface of the metal structure of the present invention, and FIG. 2 is a photomicrograph of the surface of the Ag-Ge metal structure.
Claims (1)
よび残部をAgとしたことを特徴とする銀ろう材。 2 Geを0.05〜19Wt%、Pdを0.01〜0.49Wt%さ
らにFe、Co、Niの内の1種または2種以上を
0.01〜3Wt%および残部をAgとしたことを特徴
とする銀ろう材。[Claims] 1. A silver brazing material characterized by containing 0.05 to 19 Wt% of Ge, 0.01 to 0.49 Wt% of Pd, and the balance being Ag. 2 Ge 0.05-19Wt%, Pd 0.01-0.49Wt%, and one or more of Fe, Co, and Ni.
A silver brazing filler metal characterized by containing 0.01 to 3 Wt% and the balance being Ag.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19861284A JPS6178590A (en) | 1984-09-25 | 1984-09-25 | Silver solder material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19861284A JPS6178590A (en) | 1984-09-25 | 1984-09-25 | Silver solder material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6178590A JPS6178590A (en) | 1986-04-22 |
JPH0436798B2 true JPH0436798B2 (en) | 1992-06-17 |
Family
ID=16394082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19861284A Granted JPS6178590A (en) | 1984-09-25 | 1984-09-25 | Silver solder material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6178590A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4499752B2 (en) * | 2006-03-03 | 2010-07-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Electronic components |
JP6749048B2 (en) * | 2015-01-10 | 2020-09-02 | 京セラ株式会社 | Metal alloys, decorations, and chains |
CN110951987A (en) * | 2019-12-18 | 2020-04-03 | 浙江皇城工坊文化发展有限公司 | Silver alloy with anti-sulfuration performance and preparation process thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5745462A (en) * | 1980-09-03 | 1982-03-15 | Jeco Co Ltd | Tachometer |
JPS58745A (en) * | 1981-06-03 | 1983-01-05 | ナシヨナル・ニユ−クリア・コ−ポレイシヨン・リミテツド | Method and device for deciding heat transmission rate from surface |
JPS5814004A (en) * | 1981-07-17 | 1983-01-26 | Hitachi Electronics Eng Co Ltd | Laser beam scanning method |
-
1984
- 1984-09-25 JP JP19861284A patent/JPS6178590A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5745462A (en) * | 1980-09-03 | 1982-03-15 | Jeco Co Ltd | Tachometer |
JPS58745A (en) * | 1981-06-03 | 1983-01-05 | ナシヨナル・ニユ−クリア・コ−ポレイシヨン・リミテツド | Method and device for deciding heat transmission rate from surface |
JPS5814004A (en) * | 1981-07-17 | 1983-01-26 | Hitachi Electronics Eng Co Ltd | Laser beam scanning method |
Also Published As
Publication number | Publication date |
---|---|
JPS6178590A (en) | 1986-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |