JPH0438519B2 - - Google Patents
Info
- Publication number
- JPH0438519B2 JPH0438519B2 JP19861484A JP19861484A JPH0438519B2 JP H0438519 B2 JPH0438519 B2 JP H0438519B2 JP 19861484 A JP19861484 A JP 19861484A JP 19861484 A JP19861484 A JP 19861484A JP H0438519 B2 JPH0438519 B2 JP H0438519B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- melting point
- alloy
- effect
- spreadability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 13
- 229910045601 alloy Inorganic materials 0.000 description 12
- 239000000956 alloy Substances 0.000 description 12
- 230000008018 melting Effects 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 229910017942 Ag—Ge Inorganic materials 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000006104 solid solution Substances 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Contacts (AREA)
- Ceramic Products (AREA)
Description
〔産業上の利用分野〕
本発明は真空中もしくは雰囲気中等で使用する
銀ろう材に関する。
〔従来の技術〕
従来より金属のろう付には銀ろう,金ろう,パ
ラジウムろうおよび白金ろう等が用いられてい
る。その中でも銀ろうは融点が比較的低く作業性
がよいことおよび価格が比較的低廉であることか
ら広く用いられている。銀ろうの中でも特に
72Ag−Cu合金(BAg−8)が電子部品などをは
じめとして多用されており、また、融点あるいは
価格を考慮して銀の含有量を増減させたAg−Cu
合金が使用されている。
〔発明が解決しようとする問題点〕
しかし、上記Ag−Cu合金は、28%(Wt%であ
り、以下も同様である。)Cuを含むため、ろう付
雰囲気の条件によつては温度上昇時に酸化変色す
る高温耐食性に問題があり、またろう付け後のめ
つき工程において酸洗処理の酸が表面に残留して
表面が腐食するなどの問題がある。
〔問題点を解決するための手段〕
本発明はAgにGe,PdおよひLiを加えてろう材
とし、さらにそれにFe,CoおよびNiの1種また
は2種以上を加えたろう材として使用時および後
処理工程における耐食性にすぐれると共に充分な
拡がり性およひ濡れ性を有し、ろう付引張強度も
充分であるのである。
まず、AgにGeを加えると、Ag−Ge合金とし
て融点の低下をはかることができる。Geが0.05
%未満では実質的融点低下はほとんど無いが、
0.05%から共晶組成を与えるGe19%迄は、Geを
加える量が増すにてれて順次融点が低下してゆ
く。19%を越えるGeの添加は、融点を再び上昇
させるとともにAg−Ge合金は脆弱化して機械的
加工性が阻害される。
このAg−Ge系合金にPdを添加すると、Fe,
Ni,Coおよびこれらの合金、例えば42Fe−Ni,
コバール,スレンレス等の母材上における濡れ
性,拡がり性が向上する。添加量が0.01%未満で
はその添加効果は無きに等しく、10%を越えると
合金の融点を上昇をきたし、Ge添加による融点
低下の効果が相殺されてしまう。
さらに、Ag−Ge系合金にLiを添加すると、
Fe,Ni,Coおよびこれらの合金、例えば42Fe−
Ni,コバール,ステンレス等の母材上における
濡れ性,拡がり性が向上する。添加量が0.01%未
満ではその添加効果が無きに等しく、2%を越え
ると偏析が大きく実用的でない。
上記のようにPdおよびLiは共にFe,Ni,Coお
よびこれらの合金を母材としたときの濡れ性,拡
がり性を向上させるが、その作用機構は異なる。
すなわち、Liはこれら母材表面の酸化物を還元除
去する作用および母材と溶融したろうとの界面エ
ネルギーを低下させる作用があり、PdはAgが
Fe,Co,Niとはほとんど固溶しないのに対して
これらと全率に固溶し、これらとの親和力が大き
い性質を有するからである。従つてPdとLiの両
者を同時に添加することによつて、これらの相乗
効果によりさらに濡れ性および拡がり性が向上さ
れる。
さらに、Ag−Ge−Pd−Ni系合金にFe,Co,
Niを1種または2種以上を添加することによつ
て、Fe,Co,Niおよびこれらの合金、例えば
42Fe−Ni,コバール,ステンレス等の母材をろ
う付した際、金属組織を微細化するとともにろう
付強度の向上をはかることができる。0.01%未満
の添加ではその効果が無きに等しく、3%を越え
る添加は主成分であるAgとこれらが固溶し難い
故、これらと固溶するGeやPdをその上限より多
く含有せしめなければならなくなつて不適であ
る。
〔実施例〕
以下にAg−Ge−Pd−Liの4元系による本発明
の実施例を説明する。
(1) Ag80% Ge11.95% Pd8% Li0.05%
(2) Ag86% Ge 7.9% Pd6% Li0.1%
(3) Ag90% Ge8% Pd1.7% Li0.3%
以上の試料について融点,拡がり面積および引
張度についての試験結果を第1表に示す。
なお、拡がり試験は、厚さ0.1mm,10mm角ろう
材を用いて、角ろう材の液晶温度より40℃高い温
度にて真空中または水素雰囲気中で行ない2分間
保持した。
また、ろう付引張強度測定は、各母材、断面4
mm×4mmの突合せ継手についてアムスラー材料試
験機により行なつた。なお、ろう付は各ろう材の
液相温度により40℃高い温度にて真空中または水
素雰囲気で行なつた。
[Industrial Application Field] The present invention relates to a silver brazing material used in a vacuum or an atmosphere. [Prior Art] Conventionally, silver solder, gold solder, palladium solder, platinum solder, etc. have been used for brazing metals. Among these, silver solder is widely used because it has a relatively low melting point, good workability, and is relatively inexpensive. Especially among silver wax
72Ag-Cu alloy (BAg-8) is widely used in electronic parts, etc., and Ag-Cu with increased or decreased silver content taking into account melting point or price.
alloy is used. [Problems to be solved by the invention] However, since the above Ag-Cu alloy contains 28% (Wt%, the same applies hereinafter) Cu, the temperature may rise depending on the conditions of the brazing atmosphere. There are problems with high-temperature corrosion resistance, which sometimes causes oxidative discoloration, and there are also problems such as acid from pickling treatment remaining on the surface during the plating process after brazing, resulting in surface corrosion. [Means for Solving the Problems] The present invention provides a brazing material by adding Ge, Pd and Li to Ag, and further adding one or more of Fe, Co and Ni when used as a brazing material. It also has excellent corrosion resistance in the post-treatment process, sufficient spreadability and wettability, and sufficient brazing tensile strength. First, by adding Ge to Ag, the melting point can be lowered as an Ag-Ge alloy. Ge is 0.05
If it is less than %, there is almost no substantial decrease in the melting point;
From 0.05% to 19% Ge, which gives a eutectic composition, the melting point gradually decreases as the amount of Ge added increases. Adding more than 19% of Ge raises the melting point again and makes the Ag-Ge alloy brittle, inhibiting mechanical workability. When Pd is added to this Ag-Ge alloy, Fe,
Ni, Co and their alloys, such as 42Fe-Ni,
Improves wettability and spreadability on base materials such as Kovar and stainless steel. If the amount added is less than 0.01%, the effect of the addition is negligible, and if it exceeds 10%, the melting point of the alloy increases, canceling out the effect of lowering the melting point due to the addition of Ge. Furthermore, when Li is added to Ag-Ge alloy,
Fe, Ni, Co and their alloys, e.g. 42Fe−
Improves wettability and spreadability on base materials such as Ni, Kovar, and stainless steel. If the amount added is less than 0.01%, the effect of the addition is negligible, and if it exceeds 2%, segregation will be large and it is not practical. As mentioned above, both Pd and Li improve the wettability and spreadability when Fe, Ni, Co, and their alloys are used as base materials, but their mechanisms of action are different.
In other words, Li has the effect of reducing and removing oxides on the surface of the base material and lowering the interfacial energy between the base material and the molten wax, while Pd has the effect of reducing the oxides on the surface of the base material and reducing the interfacial energy between the base material and the molten wax.
This is because, while Fe, Co, and Ni hardly form a solid solution, it completely forms a solid solution with these and has a high affinity with them. Therefore, by adding both Pd and Li at the same time, the wettability and spreadability are further improved due to their synergistic effect. Furthermore, Fe, Co,
By adding one or more types of Ni, Fe, Co, Ni and alloys thereof, such as
When brazing base materials such as 42Fe-Ni, Kovar, and stainless steel, it is possible to refine the metal structure and improve the brazing strength. Addition of less than 0.01% is equivalent to no effect, and addition of more than 3% makes it difficult for these to form a solid solution with Ag, the main component, so Ge and Pd, which form a solid solution with these, must be contained in an amount greater than the upper limit. It is inappropriate to do so. [Example] Examples of the present invention using a quaternary system of Ag-Ge-Pd-Li will be described below. (1) Ag80% Ge11.95% Pd8% Li0.05% (2) Ag86% Ge 7.9% Pd6% Li0.1% (3) Ag90% Ge8% Pd1.7% Li0.3% Melting point for samples with or above, The test results for the spreading area and tensile strength are shown in Table 1. The spreading test was carried out in a vacuum or in a hydrogen atmosphere at a temperature 40° C. higher than the liquid crystal temperature of the square brazing filler metal for 2 minutes using a square brazing filler metal with a thickness of 0.1 mm and 10 mm. In addition, brazing tensile strength measurement is performed for each base material, cross section 4
The tests were conducted using an Amsler material testing machine for a mm x 4 mm butt joint. Note that brazing was performed in vacuum or in a hydrogen atmosphere at a temperature 40° C. higher depending on the liquidus temperature of each brazing filler metal.
【表】
次に、Ag−Ge−Pd−LiにFe,Co,Niを1種
または2種以上添加した4元以上の本発明の実施
例を説明する。
(4) Ag80% Ge11.45% Pd8%
Li0.05% Ni0.5%
(5) Ag85% Ge 8.4% Pd5%
Li0.1% Fe1%Co1.5%
(6) Ag94% Ge 4% Pd0.5%
Fe0.5% Ni0.5%
以上の試料について融点,拡がり面積および引
張強度についての試験結果を第2表に示す。
なお、これらの試験については上記の第1表に
示した試験方法と同様である。[Table] Next, examples of the present invention in which one or more of Fe, Co, and Ni are added to Ag-Ge-Pd-Li will be described. (4) Ag80% Ge11.45% Pd8% Li0.05% Ni0.5% (5) Ag85% Ge 8.4% Pd5% Li0.1% Fe1%Co1.5% (6) Ag94% Ge 4% Pd0.5 Table 2 shows the test results for the melting point, spreading area, and tensile strength of samples containing 0.5% Fe0.5% Ni0.5% or more. Note that these tests are the same as the test methods shown in Table 1 above.
以上説明した本発明によると、Ag−Ge−Pd−
Liが主成分である合金であるために高温時の耐食
性にすぐれ、しかも充分な拡がり性と濡れ性を有
し、引張強度も充分にあり、さらにろう付後のめ
つき工程における酸洗処理により表面に残留した
酸によつて腐食するような問題が解決されて広範
囲に使用することができる銀ろう材となる。
According to the present invention explained above, Ag−Ge−Pd−
Since it is an alloy whose main component is Li, it has excellent corrosion resistance at high temperatures, sufficient spreadability and wettability, and sufficient tensile strength. This solves the problem of corrosion caused by acid remaining on the surface, resulting in a silver brazing material that can be used over a wide range of areas.
第1図は本発明の金属組織の表面の顕微鏡写
真、第2図はAg−Geの金属組織の表面の顕微鏡
写真である。
FIG. 1 is a photomicrograph of the surface of the metal structure of the present invention, and FIG. 2 is a photomicrograph of the surface of the Ag-Ge metal structure.
Claims (1)
を0.01〜2Wt%および残部をAgとしたことを特
徴とする銀ろう材。 2 Geを0.05〜19Wt%,Pdを0.01〜10Wt%,Li
を0.01〜2Wt%さらにFe,Co,Niの内の1種ま
たは2種以上を0.01〜3Wt%および残部をAgと
したことを特徴とする銀ろう材。[Claims] 1 Ge: 0.05-19Wt%, Pd: 0.01-10Wt%, Li
A silver brazing filler metal characterized by containing 0.01 to 2 Wt% of Ag and the balance being Ag. 2 Ge 0.05-19Wt%, Pd 0.01-10Wt%, Li
0.01 to 2 Wt%, and 0.01 to 3 Wt% of one or more of Fe, Co, and Ni, and the balance being Ag.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19861484A JPS6178592A (en) | 1984-09-25 | 1984-09-25 | Silver solder material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19861484A JPS6178592A (en) | 1984-09-25 | 1984-09-25 | Silver solder material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6178592A JPS6178592A (en) | 1986-04-22 |
JPH0438519B2 true JPH0438519B2 (en) | 1992-06-24 |
Family
ID=16394116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19861484A Granted JPS6178592A (en) | 1984-09-25 | 1984-09-25 | Silver solder material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6178592A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4499752B2 (en) * | 2006-03-03 | 2010-07-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Electronic components |
-
1984
- 1984-09-25 JP JP19861484A patent/JPS6178592A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6178592A (en) | 1986-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |