JPH0469066B2 - - Google Patents
Info
- Publication number
- JPH0469066B2 JPH0469066B2 JP60137533A JP13753385A JPH0469066B2 JP H0469066 B2 JPH0469066 B2 JP H0469066B2 JP 60137533 A JP60137533 A JP 60137533A JP 13753385 A JP13753385 A JP 13753385A JP H0469066 B2 JPH0469066 B2 JP H0469066B2
- Authority
- JP
- Japan
- Prior art keywords
- molding
- pressure
- resin
- stage
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 239000002648 laminated material Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 4
- 239000000499 gel Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 2
- 240000002834 Paulownia tomentosa Species 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 etc. and drying it Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Moulding By Coating Moulds (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60137533A JPS61295038A (ja) | 1985-06-24 | 1985-06-24 | 積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60137533A JPS61295038A (ja) | 1985-06-24 | 1985-06-24 | 積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61295038A JPS61295038A (ja) | 1986-12-25 |
| JPH0469066B2 true JPH0469066B2 (zh) | 1992-11-05 |
Family
ID=15200903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60137533A Granted JPS61295038A (ja) | 1985-06-24 | 1985-06-24 | 積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61295038A (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0757494B2 (ja) * | 1987-05-27 | 1995-06-21 | 新神戸電機株式会社 | 積層板の製造法 |
-
1985
- 1985-06-24 JP JP60137533A patent/JPS61295038A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61295038A (ja) | 1986-12-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105472895A (zh) | 两面覆金属层叠板、印制电路布线板、多层层叠板以及多层印制电路布线板的制造方法 | |
| JPH0469066B2 (zh) | ||
| JPS6365509B2 (zh) | ||
| JPS6130898B2 (zh) | ||
| JPS5947973B2 (ja) | 積層板の製造法 | |
| JP2591378B2 (ja) | コンポジット積層板の製造法 | |
| JPH04155989A (ja) | 金属箔張積層板の製造方法 | |
| CN116528476A (zh) | 一种pcb印制板翘曲的消除方法 | |
| JP2586629B2 (ja) | コンポジット積層板の製造方法 | |
| JPS6228245A (ja) | 積層板の製造法 | |
| JPS5849214A (ja) | 積層板の製造法 | |
| JPH03112658A (ja) | エポキシ樹脂積層板の製造法 | |
| JPH046897A (ja) | 多層板の製造法 | |
| JPH03221417A (ja) | 金属箔張積層板の製造方法 | |
| JPH04348932A (ja) | 積層板の製造法 | |
| JPH03126547A (ja) | 積層板の製造方法 | |
| JPH0334677B2 (zh) | ||
| JPH01157821A (ja) | 積層板の製造方法 | |
| JPS61188133A (ja) | 積層板の製法 | |
| JPS62149427A (ja) | 銅張積層板の製造方法 | |
| JPS60199651A (ja) | 片面金属張積層板の製造方法 | |
| JPH04357028A (ja) | ふっ素樹脂積層板の製造方法 | |
| JPH08228076A (ja) | 多層プリント配線板の製造方法 | |
| JPS637930B2 (zh) | ||
| JPH0453714A (ja) | 積層板の製造方法 |