JPH0468777B2 - - Google Patents

Info

Publication number
JPH0468777B2
JPH0468777B2 JP8475887A JP8475887A JPH0468777B2 JP H0468777 B2 JPH0468777 B2 JP H0468777B2 JP 8475887 A JP8475887 A JP 8475887A JP 8475887 A JP8475887 A JP 8475887A JP H0468777 B2 JPH0468777 B2 JP H0468777B2
Authority
JP
Japan
Prior art keywords
ball
bonding
chip
wire
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8475887A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63250828A (ja
Inventor
Hitoshi Oonuki
Masahiro Koizumi
Hitoshi Suzuki
Isao Araki
Susumu Okikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62084758A priority Critical patent/JPS63250828A/ja
Priority to US07/134,458 priority patent/US4976393A/en
Priority to EP87311245A priority patent/EP0276564B1/en
Priority to DE8787311245T priority patent/DE3777384D1/de
Priority to KR870014962A priority patent/KR880008437A/ko
Publication of JPS63250828A publication Critical patent/JPS63250828A/ja
Publication of JPH0468777B2 publication Critical patent/JPH0468777B2/ja
Priority to SG40094A priority patent/SG40094G/en
Priority to HK59294A priority patent/HK59294A/en
Granted legal-status Critical Current

Links

Classifications

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP62084758A 1986-12-26 1987-04-08 半導体装置 Granted JPS63250828A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP62084758A JPS63250828A (ja) 1987-04-08 1987-04-08 半導体装置
US07/134,458 US4976393A (en) 1986-12-26 1987-12-17 Semiconductor device and production process thereof, as well as wire bonding device used therefor
EP87311245A EP0276564B1 (en) 1986-12-26 1987-12-21 Wire bonding
DE8787311245T DE3777384D1 (de) 1986-12-26 1987-12-21 Drahtverbindung.
KR870014962A KR880008437A (ko) 1986-12-26 1987-12-26 반도체 장치 및 그 제조방법과 이에 사용하는 와이어 본딩장치
SG40094A SG40094G (en) 1986-12-26 1994-03-21 Wire bonding
HK59294A HK59294A (en) 1986-12-26 1994-06-23 Wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62084758A JPS63250828A (ja) 1987-04-08 1987-04-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS63250828A JPS63250828A (ja) 1988-10-18
JPH0468777B2 true JPH0468777B2 (cg-RX-API-DMAC7.html) 1992-11-04

Family

ID=13839583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62084758A Granted JPS63250828A (ja) 1986-12-26 1987-04-08 半導体装置

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US5229646A (en) * 1989-01-13 1993-07-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with a copper wires ball bonded to aluminum electrodes
JPH0817189B2 (ja) * 1989-01-13 1996-02-21 三菱電機株式会社 半導体装置の製造方法

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