JPH0468776B2 - - Google Patents
Info
- Publication number
- JPH0468776B2 JPH0468776B2 JP546383A JP546383A JPH0468776B2 JP H0468776 B2 JPH0468776 B2 JP H0468776B2 JP 546383 A JP546383 A JP 546383A JP 546383 A JP546383 A JP 546383A JP H0468776 B2 JPH0468776 B2 JP H0468776B2
- Authority
- JP
- Japan
- Prior art keywords
- tool
- arm
- bonding
- linear motor
- capillary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000008188 pellet Substances 0.000 description 9
- 238000003825 pressing Methods 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58005463A JPS59130433A (ja) | 1983-01-17 | 1983-01-17 | ワイヤボンディング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58005463A JPS59130433A (ja) | 1983-01-17 | 1983-01-17 | ワイヤボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59130433A JPS59130433A (ja) | 1984-07-27 |
JPH0468776B2 true JPH0468776B2 (US06811534-20041102-M00003.png) | 1992-11-04 |
Family
ID=11611919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58005463A Granted JPS59130433A (ja) | 1983-01-17 | 1983-01-17 | ワイヤボンディング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59130433A (US06811534-20041102-M00003.png) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62150838A (ja) * | 1985-12-25 | 1987-07-04 | Hitachi Ltd | 検出方法および装置 |
JP2522330B2 (ja) * | 1987-11-16 | 1996-08-07 | 三菱電機株式会社 | ワイヤボンデイング装置 |
JPH01175239A (ja) * | 1987-11-19 | 1989-07-11 | Shinkawa Ltd | ボンデイング装置 |
US5148967A (en) * | 1991-07-15 | 1992-09-22 | Hughes Aircraft Company | Apparatus and method for detecting missing interconnect material |
EP0864392B1 (en) * | 1997-03-13 | 2001-08-16 | F & K Delvotec Bondtechnik GmbH | Bonding head |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5619631A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Wire bonding device |
JPS5630735A (en) * | 1979-08-21 | 1981-03-27 | Nec Corp | Wire-bonding device |
JPS5737250B2 (US06811534-20041102-M00003.png) * | 1976-10-19 | 1982-08-09 | ||
JPS57188840A (en) * | 1981-05-15 | 1982-11-19 | Shinkawa Ltd | Load variable mechanism in wire bonder |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5918677Y2 (ja) * | 1980-08-12 | 1984-05-30 | 株式会社東芝 | ワイヤボンデイング装置 |
-
1983
- 1983-01-17 JP JP58005463A patent/JPS59130433A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5737250B2 (US06811534-20041102-M00003.png) * | 1976-10-19 | 1982-08-09 | ||
JPS5619631A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Wire bonding device |
JPS5630735A (en) * | 1979-08-21 | 1981-03-27 | Nec Corp | Wire-bonding device |
JPS57188840A (en) * | 1981-05-15 | 1982-11-19 | Shinkawa Ltd | Load variable mechanism in wire bonder |
Also Published As
Publication number | Publication date |
---|---|
JPS59130433A (ja) | 1984-07-27 |
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