JPH0467791B2 - - Google Patents

Info

Publication number
JPH0467791B2
JPH0467791B2 JP60233942A JP23394285A JPH0467791B2 JP H0467791 B2 JPH0467791 B2 JP H0467791B2 JP 60233942 A JP60233942 A JP 60233942A JP 23394285 A JP23394285 A JP 23394285A JP H0467791 B2 JPH0467791 B2 JP H0467791B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
conductive
light
diode chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60233942A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6292488A (ja
Inventor
Masanobu Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takiron Co Ltd
Original Assignee
Takiron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takiron Co Ltd filed Critical Takiron Co Ltd
Priority to JP60233942A priority Critical patent/JPS6292488A/ja
Publication of JPS6292488A publication Critical patent/JPS6292488A/ja
Publication of JPH0467791B2 publication Critical patent/JPH0467791B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP60233942A 1985-10-18 1985-10-18 発光ダイオ−ドチツプを用いた発光表示体 Granted JPS6292488A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60233942A JPS6292488A (ja) 1985-10-18 1985-10-18 発光ダイオ−ドチツプを用いた発光表示体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60233942A JPS6292488A (ja) 1985-10-18 1985-10-18 発光ダイオ−ドチツプを用いた発光表示体

Publications (2)

Publication Number Publication Date
JPS6292488A JPS6292488A (ja) 1987-04-27
JPH0467791B2 true JPH0467791B2 (enrdf_load_stackoverflow) 1992-10-29

Family

ID=16963030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60233942A Granted JPS6292488A (ja) 1985-10-18 1985-10-18 発光ダイオ−ドチツプを用いた発光表示体

Country Status (1)

Country Link
JP (1) JPS6292488A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2626901A1 (en) 2012-02-10 2013-08-14 Oki Data Corporation Semiconductor light emitting apparatus, image displaying apparatus, mobile terminal, head-up display apparatus, image projector, head-mounted display apparatus, and image forming apparatus
JP2013165170A (ja) * 2012-02-10 2013-08-22 Oki Data Corp 半導体発光装置、画像表示装置、携帯端末、ヘッドアップディスプレイユニット、画像投影装置、ヘッドマウントディスプレイ及び画像形成装置
WO2013153938A1 (ja) * 2012-04-11 2013-10-17 東芝ライテック株式会社 光半導体光源及び車両用照明装置
US20230207758A1 (en) 2020-02-07 2023-06-29 Signify Holding B.V. Led-based device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5531825Y2 (enrdf_load_stackoverflow) * 1972-12-27 1980-07-29
JPS57163757U (enrdf_load_stackoverflow) * 1981-04-08 1982-10-15

Also Published As

Publication number Publication date
JPS6292488A (ja) 1987-04-27

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