JPS6292488A - 発光ダイオ−ドチツプを用いた発光表示体 - Google Patents
発光ダイオ−ドチツプを用いた発光表示体Info
- Publication number
- JPS6292488A JPS6292488A JP60233942A JP23394285A JPS6292488A JP S6292488 A JPS6292488 A JP S6292488A JP 60233942 A JP60233942 A JP 60233942A JP 23394285 A JP23394285 A JP 23394285A JP S6292488 A JPS6292488 A JP S6292488A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- light
- conductive
- diode chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 230000000295 complement effect Effects 0.000 claims abstract description 18
- 238000002955 isolation Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052737 gold Inorganic materials 0.000 abstract description 5
- 239000010931 gold Substances 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 abstract description 5
- 239000004332 silver Substances 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60233942A JPS6292488A (ja) | 1985-10-18 | 1985-10-18 | 発光ダイオ−ドチツプを用いた発光表示体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60233942A JPS6292488A (ja) | 1985-10-18 | 1985-10-18 | 発光ダイオ−ドチツプを用いた発光表示体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6292488A true JPS6292488A (ja) | 1987-04-27 |
| JPH0467791B2 JPH0467791B2 (enrdf_load_stackoverflow) | 1992-10-29 |
Family
ID=16963030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60233942A Granted JPS6292488A (ja) | 1985-10-18 | 1985-10-18 | 発光ダイオ−ドチツプを用いた発光表示体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6292488A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013165170A (ja) * | 2012-02-10 | 2013-08-22 | Oki Data Corp | 半導体発光装置、画像表示装置、携帯端末、ヘッドアップディスプレイユニット、画像投影装置、ヘッドマウントディスプレイ及び画像形成装置 |
| WO2013153938A1 (ja) * | 2012-04-11 | 2013-10-17 | 東芝ライテック株式会社 | 光半導体光源及び車両用照明装置 |
| US9178115B2 (en) | 2012-02-10 | 2015-11-03 | Oki Data Corporation | Semiconductor light emitting apparatus, image displaying apparatus, mobile terminal, head-up display apparatus, image projector, head-mounted display apparatus, and image forming apparatus |
| WO2021156207A1 (en) | 2020-02-07 | 2021-08-12 | Signify Holding B.V. | Led-based device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49106283U (enrdf_load_stackoverflow) * | 1972-12-27 | 1974-09-11 | ||
| JPS57163757U (enrdf_load_stackoverflow) * | 1981-04-08 | 1982-10-15 |
-
1985
- 1985-10-18 JP JP60233942A patent/JPS6292488A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49106283U (enrdf_load_stackoverflow) * | 1972-12-27 | 1974-09-11 | ||
| JPS57163757U (enrdf_load_stackoverflow) * | 1981-04-08 | 1982-10-15 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013165170A (ja) * | 2012-02-10 | 2013-08-22 | Oki Data Corp | 半導体発光装置、画像表示装置、携帯端末、ヘッドアップディスプレイユニット、画像投影装置、ヘッドマウントディスプレイ及び画像形成装置 |
| US9178115B2 (en) | 2012-02-10 | 2015-11-03 | Oki Data Corporation | Semiconductor light emitting apparatus, image displaying apparatus, mobile terminal, head-up display apparatus, image projector, head-mounted display apparatus, and image forming apparatus |
| WO2013153938A1 (ja) * | 2012-04-11 | 2013-10-17 | 東芝ライテック株式会社 | 光半導体光源及び車両用照明装置 |
| WO2021156207A1 (en) | 2020-02-07 | 2021-08-12 | Signify Holding B.V. | Led-based device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0467791B2 (enrdf_load_stackoverflow) | 1992-10-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100570883C (zh) | 具有多个发光元件的发光装置 | |
| JP4585014B2 (ja) | 発光装置 | |
| US9349912B2 (en) | Light emitting device having a plurality of light emitting cells | |
| JP2004006582A (ja) | 発光装置 | |
| CN109873060A (zh) | 一种微发光二极管阵列制作方法、键合基板及发光芯片 | |
| KR20130045793A (ko) | 발광 다이오드 어레이 | |
| US12057541B2 (en) | White-light-emitting LED structures | |
| JP6186999B2 (ja) | ライン光源装置 | |
| JPS6292488A (ja) | 発光ダイオ−ドチツプを用いた発光表示体 | |
| CN109411578A (zh) | 一种led芯片及led模组 | |
| CN217485040U (zh) | 一种led显示装置 | |
| US7102283B2 (en) | Full-color light emitting device with four leads | |
| CN209842290U (zh) | 一种led背光器件及背光模组 | |
| JPH01157577A (ja) | 半導体発光装置 | |
| JPH0241649Y2 (enrdf_load_stackoverflow) | ||
| CN209747542U (zh) | 一种led芯片结构 | |
| Niina et al. | A high-brightness GaP green LED flat-panel device for character and TV display | |
| JP2002075662A (ja) | 有機ｅｌ素子 | |
| CN113012629A (zh) | 显示面板及电子设备 | |
| CN222916535U (zh) | 一种发光器件结构 | |
| TWI259739B (en) | Electrode lead layout structure of organic light-emitting diode display device | |
| JPS6275697A (ja) | 発光ダイオ−ドチツプを用いた発光表示体 | |
| TW451248B (en) | Multiplex anode matrix vacuum fluorescent display and the driving device therefor | |
| CN217562213U (zh) | 透明led显示屏 | |
| CN211350642U (zh) | 一种红外发光二极管 |