JPH0467726B2 - - Google Patents
Info
- Publication number
- JPH0467726B2 JPH0467726B2 JP18357987A JP18357987A JPH0467726B2 JP H0467726 B2 JPH0467726 B2 JP H0467726B2 JP 18357987 A JP18357987 A JP 18357987A JP 18357987 A JP18357987 A JP 18357987A JP H0467726 B2 JPH0467726 B2 JP H0467726B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- copper
- alloy
- plating
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 22
- 238000007747 plating Methods 0.000 claims description 22
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000009736 wetting Methods 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- 229910000906 Bronze Inorganic materials 0.000 claims description 4
- 239000010974 bronze Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010956 nickel silver Substances 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Contacts (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture Of Switches (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18357987A JPS6430125A (en) | 1987-07-24 | 1987-07-24 | Manufacture of contactor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18357987A JPS6430125A (en) | 1987-07-24 | 1987-07-24 | Manufacture of contactor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6430125A JPS6430125A (en) | 1989-02-01 |
JPH0467726B2 true JPH0467726B2 (de) | 1992-10-29 |
Family
ID=16138283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18357987A Granted JPS6430125A (en) | 1987-07-24 | 1987-07-24 | Manufacture of contactor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6430125A (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4247339B2 (ja) * | 2002-01-21 | 2009-04-02 | Dowaメタルテック株式会社 | Sn被覆部材およびその製造方法 |
JP4112426B2 (ja) * | 2003-05-14 | 2008-07-02 | 三菱伸銅株式会社 | めっき処理材の製造方法 |
-
1987
- 1987-07-24 JP JP18357987A patent/JPS6430125A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6430125A (en) | 1989-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4233067A (en) | Soft copper alloy conductors | |
US6495001B2 (en) | Method for manufacturing a metallic composite strip | |
WO2007126011A1 (ja) | Cu-Ni-Si合金すずめっき条 | |
JP2002317295A (ja) | リフロー処理Sn合金めっき材料、それを用いた嵌合型接続端子 | |
KR100422026B1 (ko) | 리플로우도금부재의제조방법,그방법으로얻어진리플로우도금부재 | |
JPH04329891A (ja) | 錫めっき銅合金材およびその製造方法 | |
JP3998731B2 (ja) | 通電部材の製造方法 | |
JP2012007242A (ja) | Cu−Ni−Si合金すずめっき条 | |
US4360411A (en) | Aluminum electrical contacts and method of making same | |
KR20170120547A (ko) | 전자 부품용 Sn 도금재 | |
JPH04160200A (ja) | 電気接点材料の製造方法 | |
JPH0467726B2 (de) | ||
JP2647656B2 (ja) | 接触子の製造方法 | |
JP2647657B2 (ja) | 接触子の製造方法 | |
JPH0467725B2 (de) | ||
US5069979A (en) | Plated copper alloy material | |
JP3378717B2 (ja) | リフローめっき部材の製造方法 | |
JP2010168666A (ja) | ウィスカーが抑制されたCu−Zn合金耐熱Snめっき条 | |
JPH02145794A (ja) | 耐熱剥離性に優れたリフロー錫またははんだめっき銅または銅合金材料 | |
JPS6219264B2 (de) | ||
JP4570948B2 (ja) | ウィスカー発生を抑制したCu−Zn系合金のSnめっき条及びその製造方法 | |
US4323393A (en) | Hot dipping lead base coating material | |
JPH03188254A (ja) | はんだめっき銅合金材 | |
JP4014739B2 (ja) | リフローSnめっき材及び前記リフローSnめっき材を用いた端子、コネクタ、又はリード部材 | |
JPS6220895A (ja) | Cu又はCu合金母材にSn又はSn合金めつきを施す方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |