JPH0466688B2 - - Google Patents
Info
- Publication number
- JPH0466688B2 JPH0466688B2 JP59156161A JP15616184A JPH0466688B2 JP H0466688 B2 JPH0466688 B2 JP H0466688B2 JP 59156161 A JP59156161 A JP 59156161A JP 15616184 A JP15616184 A JP 15616184A JP H0466688 B2 JPH0466688 B2 JP H0466688B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- firing
- substrate
- ceramic
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 43
- 239000000919 ceramic Substances 0.000 claims description 42
- 238000010304 firing Methods 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 229910052726 zirconium Inorganic materials 0.000 claims description 14
- 239000006023 eutectic alloy Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 230000005496 eutectics Effects 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 5
- 239000011224 oxide ceramic Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims 1
- 239000010949 copper Substances 0.000 description 58
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000005211 surface analysis Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 229910000505 Al2TiO5 Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Ceramic Products (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15616184A JPS6132752A (ja) | 1984-07-25 | 1984-07-25 | セラミツクス回路板の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15616184A JPS6132752A (ja) | 1984-07-25 | 1984-07-25 | セラミツクス回路板の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6132752A JPS6132752A (ja) | 1986-02-15 |
| JPH0466688B2 true JPH0466688B2 (ko) | 1992-10-26 |
Family
ID=15621679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15616184A Granted JPS6132752A (ja) | 1984-07-25 | 1984-07-25 | セラミツクス回路板の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6132752A (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0273227A3 (en) * | 1986-12-22 | 1989-01-25 | Kalman F. Zsamboky | A method of improving bond strength between a metal layer and a non-metallic substrate |
| JPS63254031A (ja) * | 1987-04-10 | 1988-10-20 | 昭和電工株式会社 | 回路基板の製造方法 |
| JPH0292872A (ja) * | 1988-09-28 | 1990-04-03 | Kyocera Corp | セラミック体と銅材の接合方法 |
| JP3495052B2 (ja) * | 1992-07-15 | 2004-02-09 | 株式会社東芝 | メタライズ体およびその製造方法 |
| DE102020111700A1 (de) * | 2020-04-29 | 2021-11-04 | Rogers Germany Gmbh | Trägersubstrat und Verfahren zur Herstellung eines Trägersubstrats |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5195777A (ja) * | 1975-02-06 | 1976-08-21 | Handotaiyoki | |
| JPS5645318A (en) * | 1979-09-11 | 1981-04-25 | Hitachi Metals Ltd | Combined milling tool and preparation thereof |
| JPS593077A (ja) * | 1982-06-29 | 1984-01-09 | 株式会社東芝 | セラミツク部材と金属との接合方法 |
-
1984
- 1984-07-25 JP JP15616184A patent/JPS6132752A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5195777A (ja) * | 1975-02-06 | 1976-08-21 | Handotaiyoki | |
| JPS5645318A (en) * | 1979-09-11 | 1981-04-25 | Hitachi Metals Ltd | Combined milling tool and preparation thereof |
| JPS593077A (ja) * | 1982-06-29 | 1984-01-09 | 株式会社東芝 | セラミツク部材と金属との接合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6132752A (ja) | 1986-02-15 |
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