JPH0466097B2 - - Google Patents

Info

Publication number
JPH0466097B2
JPH0466097B2 JP60117103A JP11710385A JPH0466097B2 JP H0466097 B2 JPH0466097 B2 JP H0466097B2 JP 60117103 A JP60117103 A JP 60117103A JP 11710385 A JP11710385 A JP 11710385A JP H0466097 B2 JPH0466097 B2 JP H0466097B2
Authority
JP
Japan
Prior art keywords
resist
layer
film
heat treatment
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60117103A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61276221A (ja
Inventor
Seiji Sagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60117103A priority Critical patent/JPS61276221A/ja
Publication of JPS61276221A publication Critical patent/JPS61276221A/ja
Publication of JPH0466097B2 publication Critical patent/JPH0466097B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP60117103A 1985-05-30 1985-05-30 半導体装置の製造方法 Granted JPS61276221A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60117103A JPS61276221A (ja) 1985-05-30 1985-05-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60117103A JPS61276221A (ja) 1985-05-30 1985-05-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61276221A JPS61276221A (ja) 1986-12-06
JPH0466097B2 true JPH0466097B2 (hu) 1992-10-22

Family

ID=14703474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60117103A Granted JPS61276221A (ja) 1985-05-30 1985-05-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61276221A (hu)

Also Published As

Publication number Publication date
JPS61276221A (ja) 1986-12-06

Similar Documents

Publication Publication Date Title
JPH0466097B2 (hu)
JPH0458167B2 (hu)
JPS6148771B2 (hu)
JPH0244140B2 (hu)
JPS6211491B2 (hu)
JPS6130278Y2 (hu)
JPS613489A (ja) 半導体装置の製造方法
JPS60110124A (ja) 微細パタ−ン加工方法
KR930006133B1 (ko) 모스소자의 콘택트홀 형성방법
JP2616820B2 (ja) レジストパターンの形成方法
JPS6154629A (ja) フオト・レジストパタ−ンの形成方法
JPH02244663A (ja) リードフレームの製造方法
KR950009293B1 (ko) 식각선택비가 향상된 단층레지스트 패턴 형성방법
JPH0582438A (ja) 半導体装置の製造方法
JPS636557A (ja) 微細パタ−ン形成方法
JPH0294439A (ja) 半導体装置の製造方法
JPH0410217B2 (hu)
JPS6411938B2 (hu)
JPH0551892B2 (hu)
JPH0685083B2 (ja) パタ−ン形成方法
JPS6126221A (ja) 半導体装置等の製造方法
JPH0828318B2 (ja) パターン形成方法
JPS61271838A (ja) 半導体装置の製造方法
JPH0376574B2 (hu)
JPS62117342A (ja) 多層配線構造の形成方法