JPH0465148B2 - - Google Patents
Info
- Publication number
- JPH0465148B2 JPH0465148B2 JP18188687A JP18188687A JPH0465148B2 JP H0465148 B2 JPH0465148 B2 JP H0465148B2 JP 18188687 A JP18188687 A JP 18188687A JP 18188687 A JP18188687 A JP 18188687A JP H0465148 B2 JPH0465148 B2 JP H0465148B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- substrate
- support base
- reduced pressure
- vapor phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18188687A JPS6425985A (en) | 1987-07-20 | 1987-07-20 | Reduced-pressure vapor growing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18188687A JPS6425985A (en) | 1987-07-20 | 1987-07-20 | Reduced-pressure vapor growing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6425985A JPS6425985A (en) | 1989-01-27 |
| JPH0465148B2 true JPH0465148B2 (enrdf_load_stackoverflow) | 1992-10-19 |
Family
ID=16108595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18188687A Granted JPS6425985A (en) | 1987-07-20 | 1987-07-20 | Reduced-pressure vapor growing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6425985A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995028002A1 (en) * | 1994-04-08 | 1995-10-19 | Hitachi, Ltd. | Method and device for processing semiconductor wafer |
| JP2701767B2 (ja) * | 1995-01-27 | 1998-01-21 | 日本電気株式会社 | 気相成長装置 |
| US6018616A (en) * | 1998-02-23 | 2000-01-25 | Applied Materials, Inc. | Thermal cycling module and process using radiant heat |
| JP4058364B2 (ja) * | 2003-03-18 | 2008-03-05 | 株式会社日立製作所 | 半導体製造装置 |
-
1987
- 1987-07-20 JP JP18188687A patent/JPS6425985A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6425985A (en) | 1989-01-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071019 Year of fee payment: 15 |