JPH0464471B2 - - Google Patents
Info
- Publication number
- JPH0464471B2 JPH0464471B2 JP59258997A JP25899784A JPH0464471B2 JP H0464471 B2 JPH0464471 B2 JP H0464471B2 JP 59258997 A JP59258997 A JP 59258997A JP 25899784 A JP25899784 A JP 25899784A JP H0464471 B2 JPH0464471 B2 JP H0464471B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- metal
- hard
- ceramic substrate
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 239000000919 ceramic Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 239000013307 optical fiber Substances 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 description 7
- 238000005219 brazing Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59258997A JPS61137111A (ja) | 1984-12-07 | 1984-12-07 | ハイブリツドic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59258997A JPS61137111A (ja) | 1984-12-07 | 1984-12-07 | ハイブリツドic |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61137111A JPS61137111A (ja) | 1986-06-24 |
JPH0464471B2 true JPH0464471B2 (enrdf_load_html_response) | 1992-10-15 |
Family
ID=17327918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59258997A Granted JPS61137111A (ja) | 1984-12-07 | 1984-12-07 | ハイブリツドic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61137111A (enrdf_load_html_response) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4861134A (en) * | 1988-06-29 | 1989-08-29 | American Telephone And Telegraph Company, At&T Bell Laboratories | Opto-electronic and optical fiber interface arrangement |
JP4611472B2 (ja) * | 1999-08-04 | 2011-01-12 | 浜松ホトニクス株式会社 | 投受光装置 |
CN102814866B (zh) * | 2012-08-31 | 2014-10-29 | 北京京运通科技股份有限公司 | 一种准单晶硅锭的切割方法及硅片制造方法 |
-
1984
- 1984-12-07 JP JP59258997A patent/JPS61137111A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61137111A (ja) | 1986-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |