JPS61137111A - ハイブリツドｉｃ - Google Patents

ハイブリツドｉｃ

Info

Publication number
JPS61137111A
JPS61137111A JP59258997A JP25899784A JPS61137111A JP S61137111 A JPS61137111 A JP S61137111A JP 59258997 A JP59258997 A JP 59258997A JP 25899784 A JP25899784 A JP 25899784A JP S61137111 A JPS61137111 A JP S61137111A
Authority
JP
Japan
Prior art keywords
chip
hard
metal
mounting
signal input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59258997A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0464471B2 (enrdf_load_html_response
Inventor
Yoshitaka Fukuoka
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59258997A priority Critical patent/JPS61137111A/ja
Publication of JPS61137111A publication Critical patent/JPS61137111A/ja
Publication of JPH0464471B2 publication Critical patent/JPH0464471B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
JP59258997A 1984-12-07 1984-12-07 ハイブリツドｉｃ Granted JPS61137111A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59258997A JPS61137111A (ja) 1984-12-07 1984-12-07 ハイブリツドｉｃ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59258997A JPS61137111A (ja) 1984-12-07 1984-12-07 ハイブリツドｉｃ

Publications (2)

Publication Number Publication Date
JPS61137111A true JPS61137111A (ja) 1986-06-24
JPH0464471B2 JPH0464471B2 (enrdf_load_html_response) 1992-10-15

Family

ID=17327918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59258997A Granted JPS61137111A (ja) 1984-12-07 1984-12-07 ハイブリツドｉｃ

Country Status (1)

Country Link
JP (1) JPS61137111A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246410A (ja) * 1988-06-29 1990-02-15 American Teleph & Telegr Co <Att> オプトエレクトロニクス組織化集成装置
JP2001053333A (ja) * 1999-08-04 2001-02-23 Hamamatsu Photonics Kk 投受光装置
CN102814866A (zh) * 2012-08-31 2012-12-12 北京京运通科技股份有限公司 一种准单晶硅锭的切割方法及硅片制造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246410A (ja) * 1988-06-29 1990-02-15 American Teleph & Telegr Co <Att> オプトエレクトロニクス組織化集成装置
JP2001053333A (ja) * 1999-08-04 2001-02-23 Hamamatsu Photonics Kk 投受光装置
CN102814866A (zh) * 2012-08-31 2012-12-12 北京京运通科技股份有限公司 一种准单晶硅锭的切割方法及硅片制造方法

Also Published As

Publication number Publication date
JPH0464471B2 (enrdf_load_html_response) 1992-10-15

Similar Documents

Publication Publication Date Title
US5193053A (en) Plastic packaged semiconductor device
JPS61137111A (ja) ハイブリツドｉｃ
US10674596B2 (en) Electronic component, electronic component manufacturing method, and mechanical component
JPH09289329A (ja) 電子回路モジュール
JPH10242505A (ja) 光通信モジュール
CN218770530U (zh) 一种封装结构及激光发射器
JP2828385B2 (ja) Ｉｃパッケージの構造
JPH09321188A (ja) 半導体装置及びその実装方法
CN210629647U (zh) 感光组件和具有其的摄像模组以及电子设备
CN217655318U (zh) 一种光模块的封装结构及光模块
CN215345245U (zh) 一种贴片模块
JP3162485B2 (ja) マルチチップモジュール
CN223246761U (zh) 电路板及电子设备
CN221201155U (zh) 芯片封装结构及集成电路板
JPH10242328A (ja) 回路基板、この回路基板を有する回路モジュールおよびこの回路モジュールを有する電子機器
CN222380578U (zh) 芯片封装结构及集成电路板
JP2760167B2 (ja) 電子部品搭載装置
JP2746248B2 (ja) チップキャリア及びチップキャリアの半田付け方法
JPS6120772Y2 (enrdf_load_html_response)
JPS61198656A (ja) 半導体装置
WO2025145911A1 (zh) 芯片模组、芯片模组制备方法及电子设备
JPH0714021B2 (ja) 樹脂封止型半導体装置
JPH0697686A (ja) 混成集積回路装置
JPS6257105B2 (enrdf_load_html_response)
JPH1033475A (ja) 内視鏡用撮像ユニット

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term