JPH046223Y2 - - Google Patents
Info
- Publication number
- JPH046223Y2 JPH046223Y2 JP1986023288U JP2328886U JPH046223Y2 JP H046223 Y2 JPH046223 Y2 JP H046223Y2 JP 1986023288 U JP1986023288 U JP 1986023288U JP 2328886 U JP2328886 U JP 2328886U JP H046223 Y2 JPH046223 Y2 JP H046223Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- axis
- jig
- printed
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986023288U JPH046223Y2 (ref) | 1986-02-19 | 1986-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986023288U JPH046223Y2 (ref) | 1986-02-19 | 1986-02-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62136568U JPS62136568U (ref) | 1987-08-28 |
| JPH046223Y2 true JPH046223Y2 (ref) | 1992-02-20 |
Family
ID=30821456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986023288U Expired JPH046223Y2 (ref) | 1986-02-19 | 1986-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046223Y2 (ref) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210092219A (ko) * | 2018-11-20 | 2021-07-23 | 가부시키가이샤 아루멕쿠스 테크놀로지스 | 지그 반송 부재 그리고 표면처리 장치 및 방법 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58124472U (ja) * | 1982-02-19 | 1983-08-24 | 上村工業株式会社 | メツキ処理装置 |
| JPS61206298A (ja) * | 1985-03-11 | 1986-09-12 | 日立化成工業株式会社 | 板状体の小径穴内薬液処理法 |
-
1986
- 1986-02-19 JP JP1986023288U patent/JPH046223Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62136568U (ref) | 1987-08-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100296780B1 (ko) | 도금방법및도금장치 | |
| GB2123036A (en) | Electroplating non-metallic surfaces | |
| KR102435955B1 (ko) | 인쇄회로기판의 무전해 도금방법 | |
| JPH046223Y2 (ref) | ||
| EP0446522B1 (en) | Electroless copper plating process | |
| US20060046481A1 (en) | Manufacturing methods and electroless plating apparatus for manufacturing wiring circuit boards | |
| US6292372B1 (en) | Solder thieving pad for wave soldered through-hole components | |
| US4878851A (en) | Electrical socket apparatus with temporary housing | |
| JPH09307209A (ja) | 電子部品の実装構造及び実装方法 | |
| CN219497733U (zh) | 一种金属剥离浸泡治具 | |
| JPH0719690Y2 (ja) | ユニバーサル型基板吸着治具 | |
| JP2002261436A (ja) | プリント基板の電子部品実装方法と半田付け方法及び連結手段を有するプリント基板 | |
| CN221529895U (zh) | 一种应用于晶圆级表面贴装技术的载具及真空台 | |
| JPS62154797A (ja) | プリント基板製造装置 | |
| JPS6232690A (ja) | プリント基板のめつき方法 | |
| JPH0319707A (ja) | 印刷配線板の穴あけ装置 | |
| CN216943131U (zh) | 一种pcb板搬运车 | |
| CN219843798U (zh) | 电路板挂架和垂直生产线 | |
| CN218183630U (zh) | 一种沉金工艺中的多层pcb板 | |
| CN115379647B (zh) | 一种pcb金手指slot槽的钻孔工艺 | |
| CN220972072U (zh) | 用于mems麦克风单元的辅助检查夹具 | |
| JPH08104998A (ja) | 薄形基板のめっき装置 | |
| CN209676619U (zh) | 薄板处理固定装置 | |
| CN101578013A (zh) | 电路板镀铜装置 | |
| CN115182030A (zh) | 基板夹具装置 |