JPH046208Y2 - - Google Patents

Info

Publication number
JPH046208Y2
JPH046208Y2 JP1982003411U JP341182U JPH046208Y2 JP H046208 Y2 JPH046208 Y2 JP H046208Y2 JP 1982003411 U JP1982003411 U JP 1982003411U JP 341182 U JP341182 U JP 341182U JP H046208 Y2 JPH046208 Y2 JP H046208Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
bonding
element mounting
heating
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982003411U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58122450U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982003411U priority Critical patent/JPS58122450U/ja
Publication of JPS58122450U publication Critical patent/JPS58122450U/ja
Application granted granted Critical
Publication of JPH046208Y2 publication Critical patent/JPH046208Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1982003411U 1982-01-14 1982-01-14 半導体素子搭載台 Granted JPS58122450U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982003411U JPS58122450U (ja) 1982-01-14 1982-01-14 半導体素子搭載台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982003411U JPS58122450U (ja) 1982-01-14 1982-01-14 半導体素子搭載台

Publications (2)

Publication Number Publication Date
JPS58122450U JPS58122450U (ja) 1983-08-20
JPH046208Y2 true JPH046208Y2 (enrdf_load_stackoverflow) 1992-02-20

Family

ID=30016351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982003411U Granted JPS58122450U (ja) 1982-01-14 1982-01-14 半導体素子搭載台

Country Status (1)

Country Link
JP (1) JPS58122450U (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666361B2 (ja) * 1985-10-23 1994-08-24 松下電器産業株式会社 ボンディング装置及びボンディング方法

Also Published As

Publication number Publication date
JPS58122450U (ja) 1983-08-20

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