JPH0461888U

JPH0461888U -

Info

Publication number: JPH0461888U
Application number: JP10462390U
Authority: JP
Priority date: 1990-10-04
Filing date: 1990-10-04
Publication date: 1992-05-27

Description

[Brief explanation of the drawing]

第１図ａ，ｂはそれぞれ本考案の第１の実施例
を示す部分断面側面図及びこの実施例の放熱器部
分の斜視図、第２図ａ，ｂは第１図ａ，ｂに示さ
れた実施例の効果を説明するためのＩＣソケツト
の部分断面側面図及び放熱器部分の斜視図、第３
図は第１図ａ，ｂに示された実施例の放熱基板及
び放熱駒の拡大断面図、第４図は本考案の第２の
実施例を示す部分断面側面図、第５図ａ，ｂはそ
れぞれ従来のＩＣソケツトの一例を示す部分断面
側面図及びこのＩＣソケツトの放熱器の斜視図で
ある。１……ソケツト基板、２……押圧板、３……放
熱基板、４……放熱駒、５……ストツパ、６……
放熱ブロツク、７……放熱器、１１……集積回路
搭載部、１２……接触端子、３１……溝、３２…
…ばね、６１……脚部、６２……放熱フイン、７
１……放熱基板、７２……放熱フイン、１００…
…集積回路、１０１……リード端子。 Figures 1a and b are a partial cross-sectional side view and a perspective view of a radiator portion of this embodiment, respectively, and Figures 2a and b are respectively shown in Figures 1a and b. A partial cross-sectional side view of an IC socket and a perspective view of a heat sink portion for explaining the effects of the above embodiments, Part 3
The figure is an enlarged sectional view of the heat dissipation board and heat dissipation piece of the embodiment shown in Figs. 1a and b, Fig. 4 is a partially sectional side view showing the second embodiment of the present invention, and Figs. 1 is a partially sectional side view showing an example of a conventional IC socket and a perspective view of a heat sink of this IC socket, respectively. 1... Socket board, 2... Pressing plate, 3... Heat dissipation board, 4... Heat dissipation piece, 5... Stopper, 6...
Heat dissipation block, 7... Heat sink, 11... Integrated circuit mounting part, 12... Contact terminal, 31... Groove, 32...
... Spring, 61 ... Leg, 62 ... Heat radiation fin, 7
1... Heat dissipation board, 72... Heat dissipation fin, 100...
...Integrated circuit, 101...Lead terminal.

Claims

[Scope of claims for utility model registration] 1. An integrated circuit mounting part for mounting an integrated circuit;
and a socket board provided with a plurality of contact terminals for contacting each lead terminal of the integrated circuit;
A pressing plate that connects each lead terminal of the integrated circuit mounted on the integrated circuit mounting portion with the corresponding contact terminal; and a plurality of grooves, the integrated circuit is connected to the pressing plate and mounted on the integrated circuit mounting portion. 1. An IC socket comprising: a heat dissipation board that contacts the surface of an integrated circuit; and a plurality of heat dissipation pieces inserted and fixed into respective grooves of the heat dissipation board. 2. An integrated circuit mounting section for mounting an integrated circuit;
and a socket board provided with a plurality of contact terminals for contacting each lead terminal of the integrated circuit;
A pressing plate that connects each lead terminal of the integrated circuit mounted on the integrated circuit mounting portion with the corresponding contact terminal; and a plurality of grooves, the integrated circuit is connected to the pressing plate and mounted on the integrated circuit mounting portion. A heat dissipation board that is in contact with the surface of the integrated circuit, a plurality of legs provided corresponding to each groove of the heat dissipation board, and a plurality of heat dissipation fins are integrally formed, and each of the legs is connected to the corresponding groove. An IC socket characterized by having a heat dissipation block that is inserted and fixed.