JPS6296855U - - Google Patents
Info
- Publication number
- JPS6296855U JPS6296855U JP18809085U JP18809085U JPS6296855U JP S6296855 U JPS6296855 U JP S6296855U JP 18809085 U JP18809085 U JP 18809085U JP 18809085 U JP18809085 U JP 18809085U JP S6296855 U JPS6296855 U JP S6296855U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat
- semiconductor component
- back surface
- conducting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す正面図、第２
図は第１図の分解斜視図、第３図は従来例の正面
図、第４図は第２図の分解斜視図である。
１…半導体部品、２，３…放熱部材、４，５…
プリント板、６…半田端子、７…ヒートシンク、
８…挾着金具、９…脚部、１０，１１…穴、１２
…ネジ穴、１３…ネジ、１４…介挿突起、１５…
間隙、１７，１８…導熱部、７１…基板、７２…
突起。
Figure 1 is a front view showing one embodiment of the present invention;
1, FIG. 3 is a front view of the conventional example, and FIG. 4 is an exploded perspective view of FIG. 2. 1... Semiconductor component, 2, 3... Heat dissipation member, 4, 5...
Printed board, 6...solder terminal, 7...heat sink,
8... Clamping metal fittings, 9... Legs, 10, 11... Holes, 12
...screw hole, 13...screw, 14...interposition projection, 15...
Gap, 17, 18... Heat conducting part, 71... Substrate, 72...
protrusion.
Claims (1)
を有し、長方体状の半導体部品と、長方体状の基
板、前記基板の裏面の中央部に突出し前記基板と
一体形成される第二の導熱部、および前記基板の
表面に前記基板と一体形成される複数の突起を有
し、前記第二の導熱部の一端面を前記第一の導熱
部に接着、固定され、前記基板の裏面と前記半導
体部品の表面との間に間隙を形成して配設される
ヒートシンクと、裏面を前記突起に接して配設さ
れる放熱部材と、コの字状断面を有し、２つの脚
部間に前記放熱部材および前記ヒートシンクを収
容し、前記２つの脚部の先端部にもつ介挿突起を
前記間隙内に弾性により挿入して前記放熱部材お
よびヒートシンクを圧着、固定する挾着金具とを
具備することを特徴とする半導体部品放熱構造。 It has a plateau-shaped first heat conductive part that protrudes at the center of the surface, and includes a rectangular semiconductor component, a rectangular substrate, and a rectangular parallelepiped substrate that protrudes from the center of the back surface of the substrate and is integrally formed with the substrate. a second heat conducting part, and a plurality of protrusions formed integrally with the substrate on the surface of the substrate, one end surface of the second heat conducting part is bonded and fixed to the first heat conducting part; a heat sink disposed with a gap formed between the back surface of the substrate and the front surface of the semiconductor component; a heat dissipation member disposed with the back surface in contact with the protrusion; and a U-shaped cross section; A clamp that accommodates the heat radiating member and the heat sink between the two leg parts, and elastically inserts an insertion protrusion at the tip of the two leg parts into the gap to press and fix the heat radiating member and the heat sink. A semiconductor component heat dissipation structure characterized by comprising metal fittings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18809085U JPS6296855U (en) | 1985-12-05 | 1985-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18809085U JPS6296855U (en) | 1985-12-05 | 1985-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6296855U true JPS6296855U (en) | 1987-06-20 |
Family
ID=31139132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18809085U Pending JPS6296855U (en) | 1985-12-05 | 1985-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6296855U (en) |
-
1985
- 1985-12-05 JP JP18809085U patent/JPS6296855U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6296855U (en) | ||
| JPS62160552U (en) | ||
| JPS6228768Y2 (en) | ||
| JPS5940733Y2 (en) | transformer mounting device | |
| JPS5923794U (en) | heat dissipation device | |
| JPH0351978Y2 (en) | ||
| JPH0617310Y2 (en) | Heat sink fixing structure | |
| JPS6221593U (en) | ||
| JPS5977235U (en) | Module mounting structure | |
| JPH01113392U (en) | ||
| JPS6234437U (en) | ||
| JPH02102741U (en) | ||
| JPH03104794U (en) | ||
| JPS58180684U (en) | Fixing device for electronic parts | |
| JPS5860995U (en) | Heat sink mounting device | |
| JPS61104556U (en) | ||
| JPS6037247U (en) | Transistor heat dissipation mounting structure | |
| JPS58118471U (en) | Display tube mounting structure | |
| JPS6291495U (en) | ||
| JPH0461888U (en) | ||
| JPS5825095U (en) | Parts mounting structure | |
| JPS62204395U (en) | ||
| JPS59185846U (en) | transistor heat sink | |
| JPH0541197U (en) | Power IC mounting structure | |
| JPS5970348U (en) | Transistor mounting parts |