JPH0461498B2 - - Google Patents

Info

Publication number
JPH0461498B2
JPH0461498B2 JP7240986A JP7240986A JPH0461498B2 JP H0461498 B2 JPH0461498 B2 JP H0461498B2 JP 7240986 A JP7240986 A JP 7240986A JP 7240986 A JP7240986 A JP 7240986A JP H0461498 B2 JPH0461498 B2 JP H0461498B2
Authority
JP
Japan
Prior art keywords
gas
parts
atmosphere
heated
forming cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7240986A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62232132A (ja
Inventor
Shuichi Oosaka
Jiro Oosedo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7240986A priority Critical patent/JPS62232132A/ja
Publication of JPS62232132A publication Critical patent/JPS62232132A/ja
Publication of JPH0461498B2 publication Critical patent/JPH0461498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP7240986A 1986-04-01 1986-04-01 雰囲気形成カバ− Granted JPS62232132A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7240986A JPS62232132A (ja) 1986-04-01 1986-04-01 雰囲気形成カバ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7240986A JPS62232132A (ja) 1986-04-01 1986-04-01 雰囲気形成カバ−

Publications (2)

Publication Number Publication Date
JPS62232132A JPS62232132A (ja) 1987-10-12
JPH0461498B2 true JPH0461498B2 (enExample) 1992-10-01

Family

ID=13488453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7240986A Granted JPS62232132A (ja) 1986-04-01 1986-04-01 雰囲気形成カバ−

Country Status (1)

Country Link
JP (1) JPS62232132A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100596326B1 (ko) 2004-08-20 2006-07-06 주식회사 에이디피엔지니어링 플라즈마 처리장치

Also Published As

Publication number Publication date
JPS62232132A (ja) 1987-10-12

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