JPH0461006U - - Google Patents
Info
- Publication number
- JPH0461006U JPH0461006U JP10437090U JP10437090U JPH0461006U JP H0461006 U JPH0461006 U JP H0461006U JP 10437090 U JP10437090 U JP 10437090U JP 10437090 U JP10437090 U JP 10437090U JP H0461006 U JPH0461006 U JP H0461006U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- jet
- liquid
- height
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims 4
- 238000007689 inspection Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Molten Solder (AREA)
- Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
Description
第１図は本考案の一実施例の測定装置３１を備
える半田付装置３２の構成を示すブロツク図、第
２図は半田付装置３２の平面図、第３図は噴流高
さの測定方法を説明するための図、第４図は半田
付装置３２の全体の構成を示す断面図、第５図は
本考案の他の実施例の検出部７１の斜視図、第６
図は従来技術が用いられる半田付装置１を簡略化
して示す斜視図、第７図は典型的な従来技術の噴
流高さの測定に用いられる治具１１の斜視図、第
８図は前記治具１１を用いた測定状態を説明する
ための平面図、第９図は測定装置１５を用いた他
の従来技術の測定方法を説明するための平面図、
第１０図は磁気センサ２１を用いたさらに他の従
来技術の測定方法を説明するための側面図である
。
３１……測定装置、３２……半田付装置、３３
……半田、３５……ノズル、３６……管体、３７
……噴流半田、４０……ポンプ、４１……ベルト
コンベア、４２……配線基板、５１，７１……検
出部、５４……リレーユニツト、５５……比較処
理回路、６２……フラツクス塗布部、６３……予
熱部、６４……半田付部、６５……冷却部、Ｔ１
〜Ｔ１１……電極。
Fig. 1 is a block diagram showing the configuration of a soldering device 32 equipped with a measuring device 31 according to an embodiment of the present invention, Fig. 2 is a plan view of the soldering device 32, and Fig. 3 shows a method for measuring the jet height. FIG. 4 is a sectional view showing the overall configuration of the soldering device 32, FIG. 5 is a perspective view of a detection unit 71 according to another embodiment of the present invention, and FIG.
FIG. 7 is a perspective view showing a simplified soldering device 1 according to the prior art, FIG. FIG. 9 is a plan view for explaining the measurement state using the tool 11; FIG. 9 is a plan view for explaining another conventional measurement method using the measuring device 15;
FIG. 10 is a side view for explaining still another conventional measurement method using the magnetic sensor 21. 31... Measuring device, 32... Soldering device, 33
... Solder, 35 ... Nozzle, 36 ... Tube, 37
... Jet solder, 40 ... Pump, 41 ... Belt conveyor, 42 ... Wiring board, 51, 71 ... Detection section, 54 ... Relay unit, 55 ... Comparison processing circuit, 62 ... Flux application section 63... Preheating section, 64... Soldering section, 65... Cooling section, T1
~T11...electrode.
Claims (1)
であつて、 前記液体の噴流面に向けて延びる複数の一方電
極と、 前記一方電極を支持し、電気絶縁性の材料から
成る支持部材と、 噴流している液体内に浸漬される他方電極と、 前記一方電極と他方電極との間の導通状態を検
査し、その検査結果に基づいて噴流高さを判定す
る判定手段とを含むことを特徴とする液体の噴流
高さ測定装置。[Claims for Utility Model Registration] An apparatus for measuring the height of a jet of conductive liquid, comprising: a plurality of one electrodes extending toward the jet surface of the liquid; and an electrically insulating electrode supporting the one electrode. A support member made of a material, the other electrode immersed in the jetting liquid, and the conductivity between the one electrode and the other electrode are inspected, and the jet height is determined based on the inspection results. What is claimed is: 1. A liquid jet height measuring device, comprising: determining means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990104370U JP2538007Y2 (en) | 1990-10-02 | 1990-10-02 | Measuring device for jet height of molten solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990104370U JP2538007Y2 (en) | 1990-10-02 | 1990-10-02 | Measuring device for jet height of molten solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0461006U true JPH0461006U (en) | 1992-05-26 |
| JP2538007Y2 JP2538007Y2 (en) | 1997-06-04 |
Family
ID=31849616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990104370U Expired - Lifetime JP2538007Y2 (en) | 1990-10-02 | 1990-10-02 | Measuring device for jet height of molten solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2538007Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6197942B1 (en) * | 2016-12-28 | 2017-09-20 | 千住金属工業株式会社 | Jet solder height confirmation jig and its handling method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62159967U (en) * | 1986-03-28 | 1987-10-12 |
-
1990
- 1990-10-02 JP JP1990104370U patent/JP2538007Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62159967U (en) * | 1986-03-28 | 1987-10-12 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6197942B1 (en) * | 2016-12-28 | 2017-09-20 | 千住金属工業株式会社 | Jet solder height confirmation jig and its handling method |
| WO2018123261A1 (en) * | 2016-12-28 | 2018-07-05 | 千住金属工業株式会社 | Jet solder height confirmation jig and method for handling same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2538007Y2 (en) | 1997-06-04 |
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