JPH01142871U - - Google Patents
Info
- Publication number
- JPH01142871U JPH01142871U JP4061088U JP4061088U JPH01142871U JP H01142871 U JPH01142871 U JP H01142871U JP 4061088 U JP4061088 U JP 4061088U JP 4061088 U JP4061088 U JP 4061088U JP H01142871 U JPH01142871 U JP H01142871U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- mounting condition
- chip
- component mounting
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
第１図は本考案に係るチツプ部品の取付状態試
験装置の一実施例を概念的に示した斜視図、第２
図は第１図に示す治具の構造および使用態様を示
した拡大断面図、第３図は従来の試験装置の一例
を概念的に示した斜視図、第４図は従来装置にお
ける治具の使用状態を示した拡大断面図である。
１０……接触子、１１……接触面、２０……ボ
ード、２１……貫通孔、３０……治具、５０……
判定処理部、６０……印刷配線板、６１……部品
取付用ランド、７０……チツプ部品、７１……電
極。
FIG. 1 is a perspective view conceptually showing an embodiment of the chip component installation state testing device according to the present invention;
The figures are an enlarged sectional view showing the structure and usage of the jig shown in Fig. 1, Fig. 3 is a perspective view conceptually showing an example of a conventional test device, and Fig. 4 is a diagram of the jig in the conventional test device. FIG. 3 is an enlarged sectional view showing the state of use. 10...Contact, 11...Contact surface, 20...Board, 21...Through hole, 30...Jig, 50...
Judgment processing unit, 60... printed wiring board, 61... component mounting land, 70... chip component, 71... electrode.
Claims (1)
の接触子を配設してなる治具と、この接触子を介
して上記チツプ部品にチエツク用の信号を与え、
この信号の通過状態に基づいて上記チツプ部品の
取付状態の良否を判定する手段とを備えたチツプ
部品の取付状態試験装置において、 上記接触子の頂部に、上記チツプ部品の電極に
接触する接触面を形成したことを特徴とするチツ
プ部品の取付状態試験装置。[Scope of Claim for Utility Model Registration] A jig comprising a conductive contact placed at a location corresponding to the mounting position of a chip component, and a check signal applied to the chip component via the contact,
In the chip component mounting condition testing device, the chip component mounting condition testing apparatus is provided with a means for determining whether the chip component mounting condition is good or bad based on the passing state of the signal, and a contact surface that contacts the electrode of the chip component is provided on the top of the contactor. A device for testing the mounting state of chip parts, characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4061088U JPH01142871U (en) | 1988-03-28 | 1988-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4061088U JPH01142871U (en) | 1988-03-28 | 1988-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01142871U true JPH01142871U (en) | 1989-09-29 |
Family
ID=31267079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4061088U Pending JPH01142871U (en) | 1988-03-28 | 1988-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01142871U (en) |
-
1988
- 1988-03-28 JP JP4061088U patent/JPH01142871U/ja active Pending
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