JPH02106858U - - Google Patents
Info
- Publication number
- JPH02106858U JPH02106858U JP1513189U JP1513189U JPH02106858U JP H02106858 U JPH02106858 U JP H02106858U JP 1513189 U JP1513189 U JP 1513189U JP 1513189 U JP1513189 U JP 1513189U JP H02106858 U JPH02106858 U JP H02106858U
- Authority
- JP
- Japan
- Prior art keywords
- region
- printed wiring
- contact probe
- cutting
- tested
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案実施例の平面構造を示す図、第
２図は本考案実施例のテスト状態を示す斜視図、
第３図は従来例のテスト状態を示す斜視図である
。
１……元基板、２……製品基板、３……捨て基
板、４……コネクター端子、５……テストポイン
ト、６……銅箔回路パターン、７……切断箇所、
８……コンタクトプローブピン。
FIG. 1 is a diagram showing the planar structure of the embodiment of the present invention, and FIG. 2 is a perspective view showing the test state of the embodiment of the present invention.
FIG. 3 is a perspective view showing a test state of a conventional example. 1... Original board, 2... Product board, 3... Discarded board, 4... Connector terminal, 5... Test point, 6... Copper foil circuit pattern, 7... Cutting location,
8...Contact probe pin.
Claims (1)
第１の領域と、テスト用のコンタクトプローブピ
ンを接触させるテストポイントを有する第２の領
域とが共通の基材上に形成され、上記第１の領域
と第２の領域とを切断により分離可能な構造を有
する高密度実装用プリント配線基板。 A first region having a printed wiring circuit to be tested and a second region having test points for contacting contact probe pins for testing are formed on a common base material, and the first region and A printed wiring board for high-density mounting that has a structure that allows separation from a second region by cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1513189U JPH02106858U (en) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1513189U JPH02106858U (en) | 1989-02-10 | 1989-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106858U true JPH02106858U (en) | 1990-08-24 |
Family
ID=31226918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1513189U Pending JPH02106858U (en) | 1989-02-10 | 1989-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106858U (en) |
-
1989
- 1989-02-10 JP JP1513189U patent/JPH02106858U/ja active Pending
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