JPH046098B2 - - Google Patents

Info

Publication number
JPH046098B2
JPH046098B2 JP59078685A JP7868584A JPH046098B2 JP H046098 B2 JPH046098 B2 JP H046098B2 JP 59078685 A JP59078685 A JP 59078685A JP 7868584 A JP7868584 A JP 7868584A JP H046098 B2 JPH046098 B2 JP H046098B2
Authority
JP
Japan
Prior art keywords
group
light
epoxy resin
light emitting
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59078685A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60224250A (ja
Inventor
Tokuo Kurokawa
Teru Okunoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP59078685A priority Critical patent/JPS60224250A/ja
Publication of JPS60224250A publication Critical patent/JPS60224250A/ja
Publication of JPH046098B2 publication Critical patent/JPH046098B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP59078685A 1984-04-20 1984-04-20 樹脂封止形発光装置 Granted JPS60224250A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59078685A JPS60224250A (ja) 1984-04-20 1984-04-20 樹脂封止形発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59078685A JPS60224250A (ja) 1984-04-20 1984-04-20 樹脂封止形発光装置

Publications (2)

Publication Number Publication Date
JPS60224250A JPS60224250A (ja) 1985-11-08
JPH046098B2 true JPH046098B2 (enExample) 1992-02-04

Family

ID=13668725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59078685A Granted JPS60224250A (ja) 1984-04-20 1984-04-20 樹脂封止形発光装置

Country Status (1)

Country Link
JP (1) JPS60224250A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3936151B2 (ja) * 2000-05-08 2007-06-27 双葉電子工業株式会社 有機ｅｌ素子
JP4023655B2 (ja) 2001-11-07 2007-12-19 双葉電子工業株式会社 透明膜状乾燥剤及び透明液状乾燥剤

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6117136A (ja) * 1984-07-04 1986-01-25 Agency Of Ind Science & Technol プラスチツクフイルム塗布用感光性エマルジヨン

Also Published As

Publication number Publication date
JPS60224250A (ja) 1985-11-08

Similar Documents

Publication Publication Date Title
US5198479A (en) Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith
JP4336767B2 (ja) エラストマー変性エポキシシロキサン組成物
US5102960A (en) Silicon-epoxy resin composition
JPS632968B2 (enExample)
AU627187B2 (en) Composition comprising a dual curable silicone polymer, an onium salt photo catalyst and a condensation cure catalyst
JPWO2009008283A1 (ja) 光半導体封止用組成物
JPS61261365A (ja) 光硬化性被覆組成物
JPWO2009008283A6 (ja) 光半導体封止用組成物
JP2715792B2 (ja) 光透過性エポキシ樹脂組成物及び光半導体装置
JPH0563488B2 (enExample)
JPH0549695B2 (enExample)
JPH046098B2 (enExample)
JP5523816B2 (ja) 変性樹脂組成物、その製造方法、及びそれを含む硬化性樹脂組成物
JP4392096B2 (ja) カチオン重合性樹脂組成物
JPH0625248B2 (ja) エポキシ樹脂組成物
JP2012092172A (ja) 光半導体封止用組成物および発光素子
JPH0791447B2 (ja) 光透過性エポキシ樹脂組成物及び光半導体装置
JP5134962B2 (ja) 照射もしくは熱硬化性組成物、及びコーティング方法
JP3012358B2 (ja) 加熱硬化性エポキシ樹脂組成物
TW201113330A (en) Photo-semiconductor package composition
JP2007016073A (ja) エポキシ樹脂組成物及び光半導体装置
JP3363484B2 (ja) 硬化性樹脂組成物
JPS5999782A (ja) 樹脂封止型発光装置及びその製造法
JPH03275712A (ja) 熱硬化性樹脂組成物
JPH06206982A (ja) 流動性封止用樹脂組成物