JPH0459078B2 - - Google Patents

Info

Publication number
JPH0459078B2
JPH0459078B2 JP60085266A JP8526685A JPH0459078B2 JP H0459078 B2 JPH0459078 B2 JP H0459078B2 JP 60085266 A JP60085266 A JP 60085266A JP 8526685 A JP8526685 A JP 8526685A JP H0459078 B2 JPH0459078 B2 JP H0459078B2
Authority
JP
Japan
Prior art keywords
flux
soldering
phosphoric acid
dibutyl
activator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60085266A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61242790A (ja
Inventor
Sandai Iwasa
Yoichi Ooba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Laboratory Co Ltd
Original Assignee
Asahi Chemical Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Laboratory Co Ltd filed Critical Asahi Chemical Laboratory Co Ltd
Priority to JP60085266A priority Critical patent/JPS61242790A/ja
Priority to US06/838,825 priority patent/US4684054A/en
Priority to FR8604245A priority patent/FR2579857A1/fr
Priority to GB8607657A priority patent/GB2174326B/en
Priority to DE3645211A priority patent/DE3645211C2/de
Priority to DE19863610747 priority patent/DE3610747A1/de
Priority to NL8600826A priority patent/NL8600826A/nl
Priority to KR1019860002903A priority patent/KR900007263B1/ko
Publication of JPS61242790A publication Critical patent/JPS61242790A/ja
Priority to NL9201027A priority patent/NL9201027A/nl
Publication of JPH0459078B2 publication Critical patent/JPH0459078B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP60085266A 1985-03-30 1985-04-19 半田付け用フラツクス Granted JPS61242790A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP60085266A JPS61242790A (ja) 1985-04-19 1985-04-19 半田付け用フラツクス
US06/838,825 US4684054A (en) 1985-03-30 1986-03-12 Automatic soldering apparatus and method of using the flux to heat the circuit board
FR8604245A FR2579857A1 (fr) 1985-03-30 1986-03-25 Appareil et procede de soudage automatique
GB8607657A GB2174326B (en) 1985-03-30 1986-03-27 Method for automatic soldering.
DE19863610747 DE3610747A1 (de) 1985-03-30 1986-03-29 Verfahren und vorrichtung zum selbsttaetigen loeten
DE3645211A DE3645211C2 (de) 1985-03-30 1986-03-29 Flußmittel für das Löten von Leiterplatten
NL8600826A NL8600826A (nl) 1985-03-30 1986-04-01 Werkwijze en inrichting voor het solderen van een plaat met gedrukte bedrading.
KR1019860002903A KR900007263B1 (ko) 1985-04-19 1986-04-16 납땜용 플럭스
NL9201027A NL9201027A (nl) 1985-03-30 1992-06-10 Werkwijze en inrichting voor het solderen van een plaat met gedrukte bedrading.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60085266A JPS61242790A (ja) 1985-04-19 1985-04-19 半田付け用フラツクス

Publications (2)

Publication Number Publication Date
JPS61242790A JPS61242790A (ja) 1986-10-29
JPH0459078B2 true JPH0459078B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-09-21

Family

ID=13853771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60085266A Granted JPS61242790A (ja) 1985-03-30 1985-04-19 半田付け用フラツクス

Country Status (2)

Country Link
JP (1) JPS61242790A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR900007263B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5009724A (en) * 1990-07-02 1991-04-23 At&T Bell Laboratories Soldering flux and method of its use in fabricating and assembling circuit boards
JPH07121468B2 (ja) * 1990-10-03 1995-12-25 メック株式会社 はんだ付け用フラックス
US5069730A (en) * 1991-01-28 1991-12-03 At&T Bell Laboratories Water-soluble soldering paste
JPH05212584A (ja) * 1992-01-31 1993-08-24 Senju Metal Ind Co Ltd ソルダーペースト
CN101557903B (zh) * 2006-12-12 2013-06-19 千住金属工业株式会社 无铅软钎料用焊剂和软钎焊方法
CN105728982B (zh) * 2015-11-05 2017-11-24 广东轻工职业技术学院 一种高效助焊剂

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110159A (ja) * 1974-07-16 1976-01-27 Matsushita Electric Ind Co Ltd Handazukehoho

Also Published As

Publication number Publication date
JPS61242790A (ja) 1986-10-29
KR900007263B1 (ko) 1990-10-06
KR860008701A (ko) 1986-11-17

Similar Documents

Publication Publication Date Title
JP2690197B2 (ja) 清浄不要のはんだ付用フラックス及びその使用方法
CN103286477B (zh) 一种无铅焊料用助焊剂及其制备方法
CN104607826B (zh) 一种用于铝低温软钎焊的免清洗固态助焊剂及制备方法
CN113441868B (zh) 一种润湿效果好的无铅抗氧化锡膏及其制备方法
US4478650A (en) Water soluble flux
CN101157168A (zh) 无铅焊料丝用松香型无卤素免清洗助焊剂
JP5071952B2 (ja) ハンダ付け用フラックス
JP2516286B2 (ja) 水溶性はんだ付けフラックス、部品の表面にフラックスを付与する方法および二つの部品を接合する方法
EP1995016A1 (en) Water-dispersed flux composition, electronic circuit board with electronic component, and their production methods
JPH08243787A (ja) 回路基板はんだ付け用フラックス及び回路基板
CN104070308A (zh) 无卤素免清洗光亮型焊锡丝用松香基助焊剂及其制备方法
KR960004341B1 (ko) 유기산을 포함하는 저잔류물 납땜 페이스트
JPH0459078B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US5131962A (en) Low-residual type soldering flux
CN105234591A (zh) 一种无卤焊锡丝活性剂及其制备方法
JP3368502B2 (ja) 洗浄不要かつ低残存性の、揮発性有機化合物を含まないハンダ付けフラツクス溶液および使用方法
JP2736304B2 (ja) ハンダ付け方法とハンダフラックス
JPS6390390A (ja) 半田付け用フラツクス
CN115971726A (zh) 一种无铅焊料用助焊剂及无铅焊膏
JPS58179562A (ja) はんだ付方法とはんだ付用フラツクス組成物
US4180419A (en) Solder flux
JPS5877791A (ja) 半田付け用フラツクス組成物
CN116252014B (zh) 一种喷锡助焊剂及其制备方法
KR100328256B1 (ko) 납땜 플럭스 조성물용 용제시스템, 이를 포함한 플럭스조성물 및 그 제조방법
KR20160017809A (ko) 솔더링용 플럭스