JPH0456390A - 内層用回路板の銅回路の処理方法 - Google Patents

Info

Publication number

JPH0456390A

JPH0456390A JP16785790A JP16785790A JPH0456390A JP H0456390 A JPH0456390 A JP H0456390A JP 16785790 A JP16785790 A JP 16785790A JP 16785790 A JP16785790 A JP 16785790A JP H0456390 A JPH0456390 A JP H0456390A

Authority

JP

Japan

Prior art keywords

copper

oxide

acid

inner layer

metal

Prior art date

1990-06-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

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• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 82
• 229910052802 copper Inorganic materials 0.000 title claims abstract description 70
• 239000010949 copper Substances 0.000 title claims abstract description 70
• 238000003672 processing method Methods 0.000 title 1
• QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 59
• 239000005751 Copper oxide Substances 0.000 claims abstract description 49
• 239000002253 acid Substances 0.000 claims abstract description 49
• 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 49
• 229910052751 metal Inorganic materials 0.000 claims abstract description 29
• 239000002184 metal Substances 0.000 claims abstract description 28
• 230000001603 reducing effect Effects 0.000 claims abstract description 13
• 239000011248 coating agent Substances 0.000 claims abstract description 5
• 238000000576 coating method Methods 0.000 claims abstract description 5
• 230000001590 oxidative effect Effects 0.000 claims abstract description 5
• 238000011282 treatment Methods 0.000 claims description 34
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
• 238000006386 neutralization reaction Methods 0.000 claims description 16
• 238000000034 method Methods 0.000 claims description 15
• 239000003513 alkali Substances 0.000 claims description 7
• 238000005406 washing Methods 0.000 claims description 7
• YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 claims description 5
• 150000003839 salts Chemical class 0.000 claims description 4
• 230000003472 neutralizing effect Effects 0.000 claims description 3
• 229960004643 cupric oxide Drugs 0.000 abstract description 50
• 239000000843 powder Substances 0.000 abstract description 14
• 229910052739 hydrogen Inorganic materials 0.000 abstract description 11
• 239000001257 hydrogen Substances 0.000 abstract description 10
• UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 8
• HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 7
• BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 abstract description 5
• KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 abstract description 4
• 229940112669 cuprous oxide Drugs 0.000 abstract description 4
• 238000004090 dissolution Methods 0.000 abstract description 3
• -1 cationic ions Chemical class 0.000 abstract description 2
• 229910044991 metal oxide Inorganic materials 0.000 abstract 1
• 150000004706 metal oxides Chemical class 0.000 abstract 1
• 239000007864 aqueous solution Substances 0.000 description 14
• 239000011889 copper foil Substances 0.000 description 12
• 230000003647 oxidation Effects 0.000 description 8
• 238000007254 oxidation reaction Methods 0.000 description 8
• 239000000126 substance Substances 0.000 description 7
• HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
• 238000007747 plating Methods 0.000 description 6
• JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 4
• 239000005750 Copper hydroxide Substances 0.000 description 4
• VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
• QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
• 229910001956 copper hydroxide Inorganic materials 0.000 description 4
• 239000007788 liquid Substances 0.000 description 4
• 239000011347 resin Substances 0.000 description 4
• 229920005989 resin Polymers 0.000 description 4
• 150000007513 acids Chemical class 0.000 description 3
• 239000012670 alkaline solution Substances 0.000 description 3
• 230000000052 comparative effect Effects 0.000 description 3
• 239000003822 epoxy resin Substances 0.000 description 3
• 125000001475 halogen functional group Chemical group 0.000 description 3
• 229920000647 polyepoxide Polymers 0.000 description 3
• USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 3
• 239000000243 solution Substances 0.000 description 3
• CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
• 239000002585 base Substances 0.000 description 2
• 239000003638 chemical reducing agent Substances 0.000 description 2
• 238000009713 electroplating Methods 0.000 description 2
• 238000005530 etching Methods 0.000 description 2
• 239000004744 fabric Substances 0.000 description 2
• 239000007789 gas Substances 0.000 description 2
• 150000002431 hydrogen Chemical class 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 2
• 238000000465 moulding Methods 0.000 description 2
• BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
• 238000007788 roughening Methods 0.000 description 2
• UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 2
• 229960002218 sodium chlorite Drugs 0.000 description 2
• 238000005507 spraying Methods 0.000 description 2
• 238000010306 acid treatment Methods 0.000 description 1
• 230000015572 biosynthetic process Effects 0.000 description 1
• 150000001768 cations Chemical class 0.000 description 1
• 238000007598 dipping method Methods 0.000 description 1
• 238000005553 drilling Methods 0.000 description 1
• 238000001035 drying Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 230000003628 erosive effect Effects 0.000 description 1
• 239000011888 foil Substances 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 238000010030 laminating Methods 0.000 description 1
• 238000003475 lamination Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 239000007800 oxidant agent Substances 0.000 description 1
• 239000002245 particle Substances 0.000 description 1
• 229920001721 polyimide Polymers 0.000 description 1
• 239000009719 polyimide resin Substances 0.000 description 1
• 229910000027 potassium carbonate Inorganic materials 0.000 description 1
• 238000011946 reduction process Methods 0.000 description 1
• 239000011734 sodium Substances 0.000 description 1
• 229910000029 sodium carbonate Inorganic materials 0.000 description 1
• 235000014347 soups Nutrition 0.000 description 1
• 239000011701 zinc Substances 0.000 description 1
• 229910052725 zinc Inorganic materials 0.000 description 1

Cited By (1)