JPH0455326B2 - - Google Patents

Info

Publication number
JPH0455326B2
JPH0455326B2 JP60016143A JP1614385A JPH0455326B2 JP H0455326 B2 JPH0455326 B2 JP H0455326B2 JP 60016143 A JP60016143 A JP 60016143A JP 1614385 A JP1614385 A JP 1614385A JP H0455326 B2 JPH0455326 B2 JP H0455326B2
Authority
JP
Japan
Prior art keywords
etched
electrode
etching
parallel plate
dry etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60016143A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61174721A (ja
Inventor
Yasuo Naruge
Tooru Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP60016143A priority Critical patent/JPS61174721A/ja
Publication of JPS61174721A publication Critical patent/JPS61174721A/ja
Publication of JPH0455326B2 publication Critical patent/JPH0455326B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Drying Of Semiconductors (AREA)
JP60016143A 1985-01-30 1985-01-30 平行平板形ドライエツチング装置 Granted JPS61174721A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60016143A JPS61174721A (ja) 1985-01-30 1985-01-30 平行平板形ドライエツチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60016143A JPS61174721A (ja) 1985-01-30 1985-01-30 平行平板形ドライエツチング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7710295A Division JPH0822982A (ja) 1995-03-09 1995-03-09 ドライエッチング装置のエッチング条件設定方法

Publications (2)

Publication Number Publication Date
JPS61174721A JPS61174721A (ja) 1986-08-06
JPH0455326B2 true JPH0455326B2 (enExample) 1992-09-03

Family

ID=11908273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60016143A Granted JPS61174721A (ja) 1985-01-30 1985-01-30 平行平板形ドライエツチング装置

Country Status (1)

Country Link
JP (1) JPS61174721A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3242166B2 (ja) * 1992-11-19 2001-12-25 株式会社日立製作所 エッチング装置
KR100561642B1 (ko) 2003-06-27 2006-03-20 엘지.필립스 엘시디 주식회사 표시소자 제조 장치 및 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202733A (en) * 1981-06-09 1982-12-11 Matsushita Electric Ind Co Ltd Dry etching device
JPS58157975A (ja) * 1982-03-10 1983-09-20 Tokyo Ohka Kogyo Co Ltd プラズマエツチング方法
JPS594028A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体製造装置
JPS5943880A (ja) * 1982-09-03 1984-03-12 Matsushita Electric Ind Co Ltd ドライエツチング装置

Also Published As

Publication number Publication date
JPS61174721A (ja) 1986-08-06

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