JPH0454528B2 - - Google Patents

Info

Publication number
JPH0454528B2
JPH0454528B2 JP61080776A JP8077686A JPH0454528B2 JP H0454528 B2 JPH0454528 B2 JP H0454528B2 JP 61080776 A JP61080776 A JP 61080776A JP 8077686 A JP8077686 A JP 8077686A JP H0454528 B2 JPH0454528 B2 JP H0454528B2
Authority
JP
Japan
Prior art keywords
heat sink
copper plate
press
manufacturing
press mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61080776A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62238026A (ja
Inventor
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP8077686A priority Critical patent/JPS62238026A/ja
Publication of JPS62238026A publication Critical patent/JPS62238026A/ja
Publication of JPH0454528B2 publication Critical patent/JPH0454528B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Punching Or Piercing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP8077686A 1986-04-08 1986-04-08 ヒ−トシンクの製造方法 Granted JPS62238026A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8077686A JPS62238026A (ja) 1986-04-08 1986-04-08 ヒ−トシンクの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8077686A JPS62238026A (ja) 1986-04-08 1986-04-08 ヒ−トシンクの製造方法

Publications (2)

Publication Number Publication Date
JPS62238026A JPS62238026A (ja) 1987-10-19
JPH0454528B2 true JPH0454528B2 (cg-RX-API-DMAC7.html) 1992-08-31

Family

ID=13727836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8077686A Granted JPS62238026A (ja) 1986-04-08 1986-04-08 ヒ−トシンクの製造方法

Country Status (1)

Country Link
JP (1) JPS62238026A (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1034881C2 (nl) * 2008-01-02 2009-07-06 Bosch Gmbh Robert Stanssamenstel dat bestemd is om te worden toegepast ten behoeve van het stansen van dwarselementen voor gebruik in een duwband voor een continu variabele transmissie.
CN103506498B (zh) * 2013-10-25 2016-06-01 昆山精创模具有限公司 冲压空调散热片透气孔用凸模及其加工方法
US11224909B2 (en) * 2015-07-07 2022-01-18 Nippon Steel Corporation Protrusion molding device, protrusion molding method, and molded article

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014681U (cg-RX-API-DMAC7.html) * 1973-05-31 1975-02-15
JPS51109589A (ja) * 1975-03-20 1976-09-28 Sanyo Electric Co Hikaatsushomomenojusuru bantainochinukikakohoho
JPS5932418Y2 (ja) * 1982-06-30 1984-09-11 ナショナル住宅産業株式会社 打抜きプレス型
JPS60216572A (ja) * 1984-04-11 1985-10-30 Sanyo Electric Co Ltd ヒ−トシンクの製造方法

Also Published As

Publication number Publication date
JPS62238026A (ja) 1987-10-19

Similar Documents

Publication Publication Date Title
US3860949A (en) Semiconductor mounting devices made by soldering flat surfaces to each other
US8524531B2 (en) System and method for improving solder joint reliability in an integrated circuit package
KR101032961B1 (ko) Led 방열기판의 제조방법 및 그의 구조
JP2000030834A (ja) 基板用端子及びその製造方法
JPH0454528B2 (cg-RX-API-DMAC7.html)
US7534661B2 (en) Method of forming molded resin semiconductor device
US6495860B1 (en) Light emitting diode and manufacturing process thereof with blank
JPH02177342A (ja) 集積回路実装用テープ
US5518684A (en) Method of making a molded lead frame
JP3807639B2 (ja) 放熱板及びそれを用いた複合半導体装置
CN210073831U (zh) 半导体器件封装组件
JP2002223002A (ja) パッケージ成形体と発光装置
US6312976B1 (en) Method for manufacturing leadless semiconductor chip package
JPH0637200A (ja) 電子装置
JPH01128456A (ja) 面実装型半導体デバイスおよびリードフレーム
JP2684247B2 (ja) リードフレームの製造方法
US20050189625A1 (en) Lead-frame for electonic devices with extruded pads
JPH0851267A (ja) 回路基板及びその製造方法
KR0176440B1 (ko) 리드프레임 및 그 제조방법
JP2002223003A (ja) パッケージ成形体とその製造方法及び発光装置
KR20020068208A (ko) 반도체 조립체의 방열판 구조 및 그 제조 방법
KR100950505B1 (ko) 파워 트랜지스터용 반도체 리이드 프레임과, 이의 제조 방법
JP3766206B2 (ja) フィルム基板の固定方法
JPH0828449B2 (ja) リードフレームの製造方法
JPH1027874A (ja) 半導体装置