JPH0453896Y2 - - Google Patents

Info

Publication number
JPH0453896Y2
JPH0453896Y2 JP1986103927U JP10392786U JPH0453896Y2 JP H0453896 Y2 JPH0453896 Y2 JP H0453896Y2 JP 1986103927 U JP1986103927 U JP 1986103927U JP 10392786 U JP10392786 U JP 10392786U JP H0453896 Y2 JPH0453896 Y2 JP H0453896Y2
Authority
JP
Japan
Prior art keywords
workpiece
polishing
wafer
mat
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986103927U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6310057U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986103927U priority Critical patent/JPH0453896Y2/ja
Publication of JPS6310057U publication Critical patent/JPS6310057U/ja
Application granted granted Critical
Publication of JPH0453896Y2 publication Critical patent/JPH0453896Y2/ja
Expired legal-status Critical Current

Links

JP1986103927U 1986-07-07 1986-07-07 Expired JPH0453896Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986103927U JPH0453896Y2 (cs) 1986-07-07 1986-07-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986103927U JPH0453896Y2 (cs) 1986-07-07 1986-07-07

Publications (2)

Publication Number Publication Date
JPS6310057U JPS6310057U (cs) 1988-01-22
JPH0453896Y2 true JPH0453896Y2 (cs) 1992-12-17

Family

ID=30976940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986103927U Expired JPH0453896Y2 (cs) 1986-07-07 1986-07-07

Country Status (1)

Country Link
JP (1) JPH0453896Y2 (cs)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2632738B2 (ja) * 1990-04-27 1997-07-23 信越半導体 株式会社 パッキングパッド、および半導体ウェーハの研磨方法
JP2540674Y2 (ja) * 1992-12-10 1997-07-09 ロデール・ニッタ株式会社 被研磨物保持具
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
JP5004429B2 (ja) * 2005-03-17 2012-08-22 富士紡ホールディングス株式会社 保持具
JP2007069295A (ja) * 2005-09-06 2007-03-22 Nitta Haas Inc 被研磨物保持具
JP5008922B2 (ja) * 2006-07-31 2012-08-22 セツ子 近藤 ロアチャックパッド
JP2019058955A (ja) * 2017-09-22 2019-04-18 信越半導体株式会社 研磨ヘッド及び研磨ヘッドの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219153A (ja) * 1983-05-27 1984-12-10 Citizen Watch Co Ltd 磁気ヘツドの精密研磨加工法
JPS60249568A (ja) * 1984-05-21 1985-12-10 Sumitomo Electric Ind Ltd 半導体ウエハの研磨方法

Also Published As

Publication number Publication date
JPS6310057U (cs) 1988-01-22

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