JPS6310057U - - Google Patents

Info

Publication number
JPS6310057U
JPS6310057U JP1986103927U JP10392786U JPS6310057U JP S6310057 U JPS6310057 U JP S6310057U JP 1986103927 U JP1986103927 U JP 1986103927U JP 10392786 U JP10392786 U JP 10392786U JP S6310057 U JPS6310057 U JP S6310057U
Authority
JP
Japan
Prior art keywords
polishing jig
semiconductor wafers
template
mat
workpieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986103927U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0453896Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986103927U priority Critical patent/JPH0453896Y2/ja
Publication of JPS6310057U publication Critical patent/JPS6310057U/ja
Application granted granted Critical
Publication of JPH0453896Y2 publication Critical patent/JPH0453896Y2/ja
Expired legal-status Critical Current

Links

JP1986103927U 1986-07-07 1986-07-07 Expired JPH0453896Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986103927U JPH0453896Y2 (cs) 1986-07-07 1986-07-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986103927U JPH0453896Y2 (cs) 1986-07-07 1986-07-07

Publications (2)

Publication Number Publication Date
JPS6310057U true JPS6310057U (cs) 1988-01-22
JPH0453896Y2 JPH0453896Y2 (cs) 1992-12-17

Family

ID=30976940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986103927U Expired JPH0453896Y2 (cs) 1986-07-07 1986-07-07

Country Status (1)

Country Link
JP (1) JPH0453896Y2 (cs)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413568A (ja) * 1990-04-27 1992-01-17 Shin Etsu Handotai Co Ltd バッキングパッド、その精密平面加工方法およびそれを用いた半導体ウェーハの研磨方法
JPH0650751U (ja) * 1992-12-10 1994-07-12 ロデール・ニッタ株式会社 被研磨物保持具
JP2003179015A (ja) * 1998-06-03 2003-06-27 Applied Materials Inc 化学的機械的研磨用の多層の止め輪を有するキャリア・ヘッド
JP2006255827A (ja) * 2005-03-17 2006-09-28 Fujibo Holdings Inc 保持具
JP2007069295A (ja) * 2005-09-06 2007-03-22 Nitta Haas Inc 被研磨物保持具
JP2008030175A (ja) * 2006-07-31 2008-02-14 Setsuko Kondo ロアチャックパッド
WO2019058871A1 (ja) * 2017-09-22 2019-03-28 信越半導体株式会社 研磨ヘッド及び研磨ヘッドの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219153A (ja) * 1983-05-27 1984-12-10 Citizen Watch Co Ltd 磁気ヘツドの精密研磨加工法
JPS60249568A (ja) * 1984-05-21 1985-12-10 Sumitomo Electric Ind Ltd 半導体ウエハの研磨方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219153A (ja) * 1983-05-27 1984-12-10 Citizen Watch Co Ltd 磁気ヘツドの精密研磨加工法
JPS60249568A (ja) * 1984-05-21 1985-12-10 Sumitomo Electric Ind Ltd 半導体ウエハの研磨方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413568A (ja) * 1990-04-27 1992-01-17 Shin Etsu Handotai Co Ltd バッキングパッド、その精密平面加工方法およびそれを用いた半導体ウェーハの研磨方法
JPH0650751U (ja) * 1992-12-10 1994-07-12 ロデール・ニッタ株式会社 被研磨物保持具
JP2003179015A (ja) * 1998-06-03 2003-06-27 Applied Materials Inc 化学的機械的研磨用の多層の止め輪を有するキャリア・ヘッド
JP2006255827A (ja) * 2005-03-17 2006-09-28 Fujibo Holdings Inc 保持具
JP2007069295A (ja) * 2005-09-06 2007-03-22 Nitta Haas Inc 被研磨物保持具
JP2008030175A (ja) * 2006-07-31 2008-02-14 Setsuko Kondo ロアチャックパッド
WO2019058871A1 (ja) * 2017-09-22 2019-03-28 信越半導体株式会社 研磨ヘッド及び研磨ヘッドの製造方法

Also Published As

Publication number Publication date
JPH0453896Y2 (cs) 1992-12-17

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