JPS63110042U - - Google Patents
Info
- Publication number
- JPS63110042U JPS63110042U JP154587U JP154587U JPS63110042U JP S63110042 U JPS63110042 U JP S63110042U JP 154587 U JP154587 U JP 154587U JP 154587 U JP154587 U JP 154587U JP S63110042 U JPS63110042 U JP S63110042U
- Authority
- JP
- Japan
- Prior art keywords
- angled surface
- carrier
- holding
- semiconductor
- suction hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000012050 conventional carrier Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Warehouses Or Storage Devices (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP154587U JPS63110042U (cs) | 1987-01-08 | 1987-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP154587U JPS63110042U (cs) | 1987-01-08 | 1987-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63110042U true JPS63110042U (cs) | 1988-07-15 |
Family
ID=30779552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP154587U Pending JPS63110042U (cs) | 1987-01-08 | 1987-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63110042U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003077988A (ja) * | 2001-09-06 | 2003-03-14 | Nitto Denko Corp | 半導体ウエハのマウント方法およびこれに用いるカセット |
-
1987
- 1987-01-08 JP JP154587U patent/JPS63110042U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003077988A (ja) * | 2001-09-06 | 2003-03-14 | Nitto Denko Corp | 半導体ウエハのマウント方法およびこれに用いるカセット |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6088535U (ja) | 半導体ウエハ | |
| JPS63110042U (cs) | ||
| JPS62128633U (cs) | ||
| JPH01139436U (cs) | ||
| JPH031537U (cs) | ||
| JPH0338U (cs) | ||
| JPS6289141U (cs) | ||
| JPS624132U (cs) | ||
| JPS6338330U (cs) | ||
| JPS6310060U (cs) | ||
| JPS5863755U (ja) | 半導体製造治具 | |
| JPS6196535U (cs) | ||
| JPH0224532U (cs) | ||
| JPS58153447U (ja) | ワ−ク整列治具 | |
| JPS6068648U (ja) | 半導体ウエ−ハ用キヤリヤ | |
| JPS63118291U (cs) | ||
| JPS6052626U (ja) | 半導体製造治具 | |
| JPS6331539U (cs) | ||
| JPS62109487U (cs) | ||
| JPS6380848U (cs) | ||
| JPS61123542U (cs) | ||
| JPS60147820U (ja) | 分割型リテ−ナ | |
| JPH01162207U (cs) | ||
| JPS6127579U (ja) | ワ−ク受けポスト | |
| JPS61162054U (cs) |