JPS63118291U - - Google Patents

Info

Publication number
JPS63118291U
JPS63118291U JP1987009038U JP903887U JPS63118291U JP S63118291 U JPS63118291 U JP S63118291U JP 1987009038 U JP1987009038 U JP 1987009038U JP 903887 U JP903887 U JP 903887U JP S63118291 U JPS63118291 U JP S63118291U
Authority
JP
Japan
Prior art keywords
substrate
fixing
cooling plate
cooling structure
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987009038U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987009038U priority Critical patent/JPS63118291U/ja
Publication of JPS63118291U publication Critical patent/JPS63118291U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1987009038U 1987-01-23 1987-01-23 Pending JPS63118291U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987009038U JPS63118291U (cs) 1987-01-23 1987-01-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987009038U JPS63118291U (cs) 1987-01-23 1987-01-23

Publications (1)

Publication Number Publication Date
JPS63118291U true JPS63118291U (cs) 1988-07-30

Family

ID=30793973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987009038U Pending JPS63118291U (cs) 1987-01-23 1987-01-23

Country Status (1)

Country Link
JP (1) JPS63118291U (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007036094A (ja) * 2005-07-29 2007-02-08 Mitsubishi Materials Corp 冷却器及びパワーモジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007036094A (ja) * 2005-07-29 2007-02-08 Mitsubishi Materials Corp 冷却器及びパワーモジュール
JP4600199B2 (ja) * 2005-07-29 2010-12-15 三菱マテリアル株式会社 冷却器及びパワーモジュール

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