JPH0453896Y2 - - Google Patents
Info
- Publication number
- JPH0453896Y2 JPH0453896Y2 JP1986103927U JP10392786U JPH0453896Y2 JP H0453896 Y2 JPH0453896 Y2 JP H0453896Y2 JP 1986103927 U JP1986103927 U JP 1986103927U JP 10392786 U JP10392786 U JP 10392786U JP H0453896 Y2 JPH0453896 Y2 JP H0453896Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986103927U JPH0453896Y2 (en) | 1986-07-07 | 1986-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986103927U JPH0453896Y2 (en) | 1986-07-07 | 1986-07-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6310057U JPS6310057U (en) | 1988-01-22 |
| JPH0453896Y2 true JPH0453896Y2 (en) | 1992-12-17 |
Family
ID=30976940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986103927U Granted JPH0453896Y2 (en) | 1986-07-07 | 1986-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453896Y2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2632738B2 (en) * | 1990-04-27 | 1997-07-23 | 信越半導体 株式会社 | Packing pad and method for polishing semiconductor wafer |
| JP2540674Y2 (en) * | 1992-12-10 | 1997-07-09 | ロデール・ニッタ株式会社 | Workpiece holder |
| US6251215B1 (en) * | 1998-06-03 | 2001-06-26 | Applied Materials, Inc. | Carrier head with a multilayer retaining ring for chemical mechanical polishing |
| JP5004429B2 (en) * | 2005-03-17 | 2012-08-22 | 富士紡ホールディングス株式会社 | Retainer |
| JP2007069295A (en) * | 2005-09-06 | 2007-03-22 | Nitta Haas Inc | Holder for polishing object |
| JP5008922B2 (en) * | 2006-07-31 | 2012-08-22 | セツ子 近藤 | Lower chuck pad |
| JP2019058955A (en) * | 2017-09-22 | 2019-04-18 | 信越半導体株式会社 | Polishing head and manufacturing method of the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59219153A (en) * | 1983-05-27 | 1984-12-10 | Citizen Watch Co Ltd | Precision finishing method of magnetic head |
| JPS60249568A (en) * | 1984-05-21 | 1985-12-10 | Sumitomo Electric Ind Ltd | Polishing of semiconductor wafer |
-
1986
- 1986-07-07 JP JP1986103927U patent/JPH0453896Y2/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59219153A (en) * | 1983-05-27 | 1984-12-10 | Citizen Watch Co Ltd | Precision finishing method of magnetic head |
| JPS60249568A (en) * | 1984-05-21 | 1985-12-10 | Sumitomo Electric Ind Ltd | Polishing of semiconductor wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6310057U (en) | 1988-01-22 |