JPH0453896Y2 - - Google Patents

Info

Publication number
JPH0453896Y2
JPH0453896Y2 JP1986103927U JP10392786U JPH0453896Y2 JP H0453896 Y2 JPH0453896 Y2 JP H0453896Y2 JP 1986103927 U JP1986103927 U JP 1986103927U JP 10392786 U JP10392786 U JP 10392786U JP H0453896 Y2 JPH0453896 Y2 JP H0453896Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986103927U
Other languages
Japanese (ja)
Other versions
JPS6310057U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986103927U priority Critical patent/JPH0453896Y2/ja
Publication of JPS6310057U publication Critical patent/JPS6310057U/ja
Application granted granted Critical
Publication of JPH0453896Y2 publication Critical patent/JPH0453896Y2/ja
Granted legal-status Critical Current

Links

JP1986103927U 1986-07-07 1986-07-07 Granted JPH0453896Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986103927U JPH0453896Y2 (en) 1986-07-07 1986-07-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986103927U JPH0453896Y2 (en) 1986-07-07 1986-07-07

Publications (2)

Publication Number Publication Date
JPS6310057U JPS6310057U (en) 1988-01-22
JPH0453896Y2 true JPH0453896Y2 (en) 1992-12-17

Family

ID=30976940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986103927U Granted JPH0453896Y2 (en) 1986-07-07 1986-07-07

Country Status (1)

Country Link
JP (1) JPH0453896Y2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2632738B2 (en) * 1990-04-27 1997-07-23 信越半導体 株式会社 Packing pad and method for polishing semiconductor wafer
JP2540674Y2 (en) * 1992-12-10 1997-07-09 ロデール・ニッタ株式会社 Workpiece holder
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
JP5004429B2 (en) * 2005-03-17 2012-08-22 富士紡ホールディングス株式会社 Retainer
JP2007069295A (en) * 2005-09-06 2007-03-22 Nitta Haas Inc Holder for polishing object
JP5008922B2 (en) * 2006-07-31 2012-08-22 セツ子 近藤 Lower chuck pad
JP2019058955A (en) * 2017-09-22 2019-04-18 信越半導体株式会社 Polishing head and manufacturing method of the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219153A (en) * 1983-05-27 1984-12-10 Citizen Watch Co Ltd Precision finishing method of magnetic head
JPS60249568A (en) * 1984-05-21 1985-12-10 Sumitomo Electric Ind Ltd Polishing of semiconductor wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219153A (en) * 1983-05-27 1984-12-10 Citizen Watch Co Ltd Precision finishing method of magnetic head
JPS60249568A (en) * 1984-05-21 1985-12-10 Sumitomo Electric Ind Ltd Polishing of semiconductor wafer

Also Published As

Publication number Publication date
JPS6310057U (en) 1988-01-22

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