JPH0453100B2 - - Google Patents

Info

Publication number
JPH0453100B2
JPH0453100B2 JP60175165A JP17516585A JPH0453100B2 JP H0453100 B2 JPH0453100 B2 JP H0453100B2 JP 60175165 A JP60175165 A JP 60175165A JP 17516585 A JP17516585 A JP 17516585A JP H0453100 B2 JPH0453100 B2 JP H0453100B2
Authority
JP
Japan
Prior art keywords
recess
plated
copper
plating
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60175165A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6235654A (ja
Inventor
Masahiko Hasunuma
Mitsumasa Shinoda
Hideyuki Hatanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASAKA DENSHI KK
Original Assignee
ASAKA DENSHI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASAKA DENSHI KK filed Critical ASAKA DENSHI KK
Priority to JP17516585A priority Critical patent/JPS6235654A/ja
Publication of JPS6235654A publication Critical patent/JPS6235654A/ja
Publication of JPH0453100B2 publication Critical patent/JPH0453100B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP17516585A 1985-08-09 1985-08-09 プリント基板用素子部品およびその製造方法 Granted JPS6235654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17516585A JPS6235654A (ja) 1985-08-09 1985-08-09 プリント基板用素子部品およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17516585A JPS6235654A (ja) 1985-08-09 1985-08-09 プリント基板用素子部品およびその製造方法

Publications (2)

Publication Number Publication Date
JPS6235654A JPS6235654A (ja) 1987-02-16
JPH0453100B2 true JPH0453100B2 (enrdf_load_stackoverflow) 1992-08-25

Family

ID=15991399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17516585A Granted JPS6235654A (ja) 1985-08-09 1985-08-09 プリント基板用素子部品およびその製造方法

Country Status (1)

Country Link
JP (1) JPS6235654A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787221B2 (ja) * 1987-02-27 1995-09-20 イビデン株式会社 半導体搭載用基板
JP4726043B2 (ja) * 2005-03-23 2011-07-20 リコーエレメックス株式会社 液体吐出用ノズル及びそれを用いたフラックス塗布装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法
JPS6134989A (ja) * 1984-07-25 1986-02-19 イビデン株式会社 電子部品搭載用基板

Also Published As

Publication number Publication date
JPS6235654A (ja) 1987-02-16

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