JPH0453095B2 - - Google Patents

Info

Publication number
JPH0453095B2
JPH0453095B2 JP60240282A JP24028285A JPH0453095B2 JP H0453095 B2 JPH0453095 B2 JP H0453095B2 JP 60240282 A JP60240282 A JP 60240282A JP 24028285 A JP24028285 A JP 24028285A JP H0453095 B2 JPH0453095 B2 JP H0453095B2
Authority
JP
Japan
Prior art keywords
wire
electrode
semiconductor chip
metal
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60240282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62101041A (ja
Inventor
Takeshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60240282A priority Critical patent/JPS62101041A/ja
Publication of JPS62101041A publication Critical patent/JPS62101041A/ja
Publication of JPH0453095B2 publication Critical patent/JPH0453095B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP60240282A 1985-10-25 1985-10-25 半導体装置 Granted JPS62101041A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60240282A JPS62101041A (ja) 1985-10-25 1985-10-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60240282A JPS62101041A (ja) 1985-10-25 1985-10-25 半導体装置

Publications (2)

Publication Number Publication Date
JPS62101041A JPS62101041A (ja) 1987-05-11
JPH0453095B2 true JPH0453095B2 (2) 1992-08-25

Family

ID=17057167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60240282A Granted JPS62101041A (ja) 1985-10-25 1985-10-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS62101041A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5460838B2 (ja) * 2012-12-10 2014-04-02 三菱電機株式会社 電力変換装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56145841U (2) * 1980-03-31 1981-11-04

Also Published As

Publication number Publication date
JPS62101041A (ja) 1987-05-11

Similar Documents

Publication Publication Date Title
KR101505551B1 (ko) 온도 감지소자가 장착된 반도체 파워 모듈 패키지 및 그제조방법
US4849803A (en) Molded resin semiconductor device
JPS61241959A (ja) 半導体モジユ−ル
WO2018194090A1 (ja) 半導体装置
CN1155088C (zh) 直接接触式管芯安装
EP4285408A1 (en) Packaged electronic devices having substrates with thermally conductive adhesive layers
EP0609528A1 (en) Low inductance semiconductor package
JPH03142847A (ja) 半導体集積回路装置
US5200640A (en) Hermetic package having covers and a base providing for direct electrical connection
US3463970A (en) Integrated semiconductor rectifier assembly
JP3216305B2 (ja) 半導体装置
JP4409064B2 (ja) パワー素子を含む半導体装置
CN115023791A (zh) 半导体芯片封装件和组装方法
JPH0453095B2 (2)
JPH0645504A (ja) 半導体装置
JPS62104058A (ja) 半導体装置
JPH0878619A (ja) 電力用半導体装置
US5313091A (en) Package for a high power electrical component
JPH02150051A (ja) 半導体モジュール
JPH09331150A (ja) 半導体装置
JP2004111560A (ja) 半導体装置および半導体装置の製造方法
JP2000243883A (ja) 半導体ダイを実装するためのＡＬＮ絶縁層を有するアルミニウム外装ＡＬＳｉＣ基板
KR100314709B1 (ko) 전력용 반도체 모듈
JP3011502B2 (ja) 混成集積回路
JPH01281759A (ja) 半導体装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term